WO2002084736A3 - Microelectronic spring with additional protruding member - Google Patents

Microelectronic spring with additional protruding member Download PDF

Info

Publication number
WO2002084736A3
WO2002084736A3 PCT/US2002/012762 US0212762W WO02084736A3 WO 2002084736 A3 WO2002084736 A3 WO 2002084736A3 US 0212762 W US0212762 W US 0212762W WO 02084736 A3 WO02084736 A3 WO 02084736A3
Authority
WO
WIPO (PCT)
Prior art keywords
protruding member
microelectronic spring
substrate
clearance under
cantilevered
Prior art date
Application number
PCT/US2002/012762
Other languages
French (fr)
Other versions
WO2002084736A8 (en
WO2002084736A2 (en
WO2002084736A1 (en
Inventor
Gary W Grube
Original Assignee
Formfactor Inc
Gary W Grube
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc, Gary W Grube filed Critical Formfactor Inc
Priority to AU2002256325A priority Critical patent/AU2002256325A1/en
Publication of WO2002084736A2 publication Critical patent/WO2002084736A2/en
Publication of WO2002084736A1 publication Critical patent/WO2002084736A1/en
Publication of WO2002084736A8 publication Critical patent/WO2002084736A8/en
Publication of WO2002084736A3 publication Critical patent/WO2002084736A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Various structural features for modifying the performance characteristics of cantilevered microelectronic spring structures (102) are disclosed. Generally, the features comprise a protruding member (120) mounted between a supporting substrate (116) and the transverse cantilever beam (106) of a microelectronic spring structure (102), at a distance spaced apart from the supporting structure from which the beam is cantilevered. The protruding member (120) may be equal to the clearance under the beam, less than the clearance under the beam, or adjustable in height; and may be attached or mounted to either the beam or the substrate. The protruding member may be substantially rigid and incompressible, and shorter than the clearance under the beam or 'soft' and compressible. The protruding member may comprise an electronic device attached to both the substrate and the beam. Additionally the protruding member may be comprised of an adjustable pressure device.
PCT/US2002/012762 2001-04-12 2002-04-10 Microelectronic spring with additional protruding member WO2002084736A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002256325A AU2002256325A1 (en) 2001-04-12 2002-04-10 Microelectronic spring with additional protruding member

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/834,074 US6811406B2 (en) 2001-04-12 2001-04-12 Microelectronic spring with additional protruding member
US09/834,074 2001-04-12

Publications (4)

Publication Number Publication Date
WO2002084736A2 WO2002084736A2 (en) 2002-10-24
WO2002084736A1 WO2002084736A1 (en) 2002-10-24
WO2002084736A8 WO2002084736A8 (en) 2002-11-21
WO2002084736A3 true WO2002084736A3 (en) 2003-04-24

Family

ID=25266036

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/012762 WO2002084736A1 (en) 2001-04-12 2002-04-10 Microelectronic spring with additional protruding member

Country Status (4)

Country Link
US (1) US6811406B2 (en)
AU (1) AU2002256325A1 (en)
TW (1) TW593123B (en)
WO (1) WO2002084736A1 (en)

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Also Published As

Publication number Publication date
TW593123B (en) 2004-06-21
WO2002084736A8 (en) 2002-11-21
US6811406B2 (en) 2004-11-02
WO2002084736A1 (en) 2002-10-24
AU2002256325A1 (en) 2002-10-28
US20020151194A1 (en) 2002-10-17

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