WO2002090245A3 - Methods of forming microstructure devices - Google Patents

Methods of forming microstructure devices Download PDF

Info

Publication number
WO2002090245A3
WO2002090245A3 PCT/US2002/014142 US0214142W WO02090245A3 WO 2002090245 A3 WO2002090245 A3 WO 2002090245A3 US 0214142 W US0214142 W US 0214142W WO 02090245 A3 WO02090245 A3 WO 02090245A3
Authority
WO
WIPO (PCT)
Prior art keywords
methods
microstructure devices
forming microstructure
materials
forming
Prior art date
Application number
PCT/US2002/014142
Other languages
French (fr)
Other versions
WO2002090245A2 (en
Inventor
Toi Yue Becky Leung
Jeffrey D Chinn
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO2002090245A2 publication Critical patent/WO2002090245A2/en
Publication of WO2002090245A3 publication Critical patent/WO2002090245A3/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0096For avoiding stiction when the device is in use, i.e. after manufacture has been completed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/0005Anti-stiction coatings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/01Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0176Chemical vapour Deposition
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/11Treatments for avoiding stiction of elastic or moving parts of MEMS
    • B81C2201/112Depositing an anti-stiction or passivation coating, e.g. on the elastic or moving parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites

Abstract

The invention includes methods of forming microstructure devices. In an exemplary method, a substrate is provided which includes a first material and a second material. At least one of the first and second materials is exposed to vapor-phase alkylsilane-containing molecules to form a coating over the at least one of the first and second materials.
PCT/US2002/014142 2001-05-07 2002-05-01 Methods of forming microstructure devices WO2002090245A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/850,923 2001-05-07
US09/850,923 US6576489B2 (en) 2001-05-07 2001-05-07 Methods of forming microstructure devices

Publications (2)

Publication Number Publication Date
WO2002090245A2 WO2002090245A2 (en) 2002-11-14
WO2002090245A3 true WO2002090245A3 (en) 2003-09-25

Family

ID=25309455

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/014142 WO2002090245A2 (en) 2001-05-07 2002-05-01 Methods of forming microstructure devices

Country Status (3)

Country Link
US (2) US6576489B2 (en)
TW (1) TW546833B (en)
WO (1) WO2002090245A2 (en)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6849471B2 (en) 2003-03-28 2005-02-01 Reflectivity, Inc. Barrier layers for microelectromechanical systems
US6942811B2 (en) * 1999-10-26 2005-09-13 Reflectivity, Inc Method for achieving improved selectivity in an etching process
US6960305B2 (en) * 1999-10-26 2005-11-01 Reflectivity, Inc Methods for forming and releasing microelectromechanical structures
US7019376B2 (en) * 2000-08-11 2006-03-28 Reflectivity, Inc Micromirror array device with a small pitch size
AU2002303842A1 (en) * 2001-05-22 2002-12-03 Reflectivity, Inc. A method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
US6794119B2 (en) * 2002-02-12 2004-09-21 Iridigm Display Corporation Method for fabricating a structure for a microelectromechanical systems (MEMS) device
US20030161949A1 (en) * 2002-02-28 2003-08-28 The Regents Of The University Of California Vapor deposition of dihalodialklysilanes
US7027200B2 (en) * 2002-03-22 2006-04-11 Reflectivity, Inc Etching method used in fabrications of microstructures
US6965468B2 (en) 2003-07-03 2005-11-15 Reflectivity, Inc Micromirror array having reduced gap between adjacent micromirrors of the micromirror array
US7045170B1 (en) * 2002-04-03 2006-05-16 Sandia Corporation Anti-stiction coating for microelectromechanical devices
US6841079B2 (en) * 2002-05-31 2005-01-11 3M Innovative Properties Company Fluorochemical treatment for silicon articles
US6808745B2 (en) * 2002-08-22 2004-10-26 Eastman Kodak Company Method of coating micro-electromechanical devices
US7781850B2 (en) 2002-09-20 2010-08-24 Qualcomm Mems Technologies, Inc. Controlling electromechanical behavior of structures within a microelectromechanical systems device
JP4694201B2 (en) 2002-09-20 2011-06-08 インテグレイテッド ディーエヌエイ テクノロジーズ インコーポレイテッド Anthraquinone quenching dyes, their production and use
US7553686B2 (en) * 2002-12-17 2009-06-30 The Regents Of The University Of Colorado, A Body Corporate Al2O3 atomic layer deposition to enhance the deposition of hydrophobic or hydrophilic coatings on micro-electromechanical devices
US6913942B2 (en) 2003-03-28 2005-07-05 Reflectvity, Inc Sacrificial layers for use in fabrications of microelectromechanical devices
US7279431B2 (en) * 2003-06-18 2007-10-09 Semitool, Inc. Vapor phase etching MEMS devices
US7638167B2 (en) * 2004-06-04 2009-12-29 Applied Microstructures, Inc. Controlled deposition of silicon-containing coatings adhered by an oxide layer
US20040261703A1 (en) * 2003-06-27 2004-12-30 Jeffrey D. Chinn Apparatus and method for controlled application of reactive vapors to produce thin films and coatings
US20050271893A1 (en) * 2004-06-04 2005-12-08 Applied Microstructures, Inc. Controlled vapor deposition of multilayered coatings adhered by an oxide layer
US9725805B2 (en) * 2003-06-27 2017-08-08 Spts Technologies Limited Apparatus and method for controlled application of reactive vapors to produce thin films and coatings
US6980347B2 (en) * 2003-07-03 2005-12-27 Reflectivity, Inc Micromirror having reduced space between hinge and mirror plate of the micromirror
US7201937B2 (en) * 2003-08-15 2007-04-10 Microsurfaces, Inc. Methods for forming composite coatings on MEMS devices
US7645704B2 (en) * 2003-09-17 2010-01-12 Texas Instruments Incorporated Methods and apparatus of etch process control in fabrications of microstructures
US7835062B2 (en) * 2006-08-30 2010-11-16 Silicon Quest Kabushiki-Kaisha Mircromirror device having a vertical hinge
US20050106774A1 (en) * 2003-11-13 2005-05-19 Dmitri Simonian Surface processes in fabrications of microstructures
US20050118742A1 (en) * 2003-11-17 2005-06-02 Frank Henning Method for reducing the adhesive properties of MEMS and anti-adhesion-coated device
JP4464125B2 (en) * 2003-12-22 2010-05-19 ソニー株式会社 Structure manufacturing method and silicon oxide film etching agent
DE102004002908B4 (en) * 2004-01-20 2008-01-24 Infineon Technologies Ag Method for producing a semiconductor component or a micromechanical structure
US7514012B2 (en) * 2004-01-27 2009-04-07 Texas Instruments Incorporated Pre-oxidization of deformable elements of microstructures
US20050211668A1 (en) * 2004-03-26 2005-09-29 Lam Research Corporation Methods of processing a substrate with minimal scalloping
US7217428B2 (en) * 2004-05-28 2007-05-15 Technology Innovations Llc Drug delivery apparatus utilizing cantilever
US7695775B2 (en) * 2004-06-04 2010-04-13 Applied Microstructures, Inc. Controlled vapor deposition of biocompatible coatings over surface-treated substrates
US20060251795A1 (en) * 2005-05-05 2006-11-09 Boris Kobrin Controlled vapor deposition of biocompatible coatings for medical devices
WO2005121397A2 (en) * 2004-06-04 2005-12-22 Applied Microstructures, Inc. Controlled vapor deposition of multilayered coatings adhered by an oxide layer
US7879396B2 (en) * 2004-06-04 2011-02-01 Applied Microstructures, Inc. High aspect ratio performance coatings for biological microfluidics
KR101354520B1 (en) 2004-07-29 2014-01-21 퀄컴 엠이엠에스 테크놀로지스, 인크. System and method for micro-electromechanical operating of an interferometric modulator
US7288464B2 (en) * 2005-04-11 2007-10-30 Hewlett-Packard Development Company, L.P. MEMS packaging structure and methods
US7354862B2 (en) * 2005-04-18 2008-04-08 Intel Corporation Thin passivation layer on 3D devices
US20060234412A1 (en) * 2005-04-19 2006-10-19 Hewlett-Packard Development Company, L.P. Intellectual Property Administration MEMS release methods
CN101228091A (en) 2005-07-22 2008-07-23 高通股份有限公司 Support structure for MEMS device and methods thereof
EP2495212A3 (en) 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
US7417307B2 (en) * 2005-07-29 2008-08-26 Hewlett-Packard Development Company, L.P. System and method for direct-bonding of substrates
US7795061B2 (en) 2005-12-29 2010-09-14 Qualcomm Mems Technologies, Inc. Method of creating MEMS device cavities by a non-etching process
US7382515B2 (en) 2006-01-18 2008-06-03 Qualcomm Mems Technologies, Inc. Silicon-rich silicon nitrides as etch stops in MEMS manufacture
US7615385B2 (en) 2006-09-20 2009-11-10 Hypres, Inc Double-masking technique for increasing fabrication yield in superconducting electronics
US7618682B2 (en) * 2006-09-25 2009-11-17 Hewlett-Packard Development Company, L.P. Method for providing an anti-stiction coating on a metal surface
US7443001B2 (en) * 2006-10-02 2008-10-28 Helwett-Packard Development Company, L.P. Preparation of microelectromechanical system device using an anti-stiction material and selective plasma sputtering
DE102006049432A1 (en) * 2006-10-16 2008-04-17 Philipps-Universität Marburg Process for the preparation of self-aggregating monolayers on solid surfaces
KR100865911B1 (en) * 2007-02-05 2008-10-29 성균관대학교산학협력단 Fabricating method of Microstructures
US8134772B2 (en) 2007-05-03 2012-03-13 Silicon Quest Kabushiki-Kaisha Mirror device with an anti-stiction layer
US7719752B2 (en) 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US7851239B2 (en) 2008-06-05 2010-12-14 Qualcomm Mems Technologies, Inc. Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices
US8952463B2 (en) * 2008-07-08 2015-02-10 Pixart Imaging Incorporation MEMS structure preventing stiction
US7749917B1 (en) * 2008-12-31 2010-07-06 Applied Materials, Inc. Dry cleaning of silicon surface for solar cell applications
DE102009050426B3 (en) * 2009-10-22 2011-03-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for aligned application of silicon chips with switching structures on e.g. wafer substrate, involves fixing aligned components on substrate by electrostatic force by applying electrical holding voltage above metallization surfaces
WO2011103187A2 (en) * 2010-02-16 2011-08-25 The Regents Of The University Of Michigan Semiconductor that has a functionalized surface
US8415220B2 (en) * 2010-02-22 2013-04-09 International Business Machines Corporation Constrained oxidation of suspended micro- and nano-structures
GB2494168B (en) * 2011-09-01 2014-04-09 Memsstar Ltd Improved deposition technique for micro electro-mechanical structures (MEMS)
US9096428B2 (en) * 2013-03-08 2015-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for MEMS structure release
US9828234B2 (en) 2016-04-29 2017-11-28 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor MEMS structure and manufacturing method thereof
CN111197176B (en) * 2019-12-30 2022-03-08 中国科学院青海盐湖研究所 Electrochemical treatment method of copper foil and composite copper foil material
US20210403321A1 (en) * 2020-06-30 2021-12-30 Butterfly Network, Inc. Formation of self-assembled monolayer for ultrasonic transducers

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5694740A (en) * 1996-03-15 1997-12-09 Analog Devices, Inc. Micromachined device packaged to reduce stiction
US6096149A (en) * 1997-04-21 2000-08-01 Ford Global Technologies, Inc. Method for fabricating adhesion-resistant micromachined devices

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3647533A (en) * 1969-08-08 1972-03-07 Us Navy Substrate bonding bumps for large scale arrays
FR2210881B1 (en) * 1972-12-14 1976-04-23 Honeywell Bull
US4655965A (en) * 1985-02-25 1987-04-07 Cts Corporation Base metal resistive paints
US5079600A (en) 1987-03-06 1992-01-07 Schnur Joel M High resolution patterning on solid substrates
US5243320A (en) * 1988-02-26 1993-09-07 Gould Inc. Resistive metal layers and method for making same
US5220489A (en) * 1991-10-11 1993-06-15 Motorola, Inc. Multicomponent integrated circuit package
WO1994014240A1 (en) 1992-12-11 1994-06-23 The Regents Of The University Of California Microelectromechanical signal processors
US5367284A (en) * 1993-05-10 1994-11-22 Texas Instruments Incorporated Thin film resistor and method for manufacturing the same
JP3110922B2 (en) * 1993-08-12 2000-11-20 富士通株式会社 Multi-chip module
US5429708A (en) 1993-12-22 1995-07-04 The Board Of Trustees Of The Leland Stanford Junior University Molecular layers covalently bonded to silicon surfaces
US6072236A (en) * 1996-03-07 2000-06-06 Micron Technology, Inc. Micromachined chip scale package
US6100596A (en) * 1996-03-19 2000-08-08 Methode Electronics, Inc. Connectorized substrate and method of connectorizing a substrate
US5729438A (en) * 1996-06-07 1998-03-17 Motorola, Inc. Discrete component pad array carrier
US6020247A (en) 1996-08-05 2000-02-01 Texas Instruments Incorporated Method for thin film deposition on single-crystal semiconductor substrates
JP3188843B2 (en) 1996-08-28 2001-07-16 ステラケミファ株式会社 Fine processing surface treatment agent and fine processing surface treatment method
US6002549A (en) 1996-11-01 1999-12-14 Seagate Technology, Inc. Dither microactors for stiction release in magnetic disc drives
US6114099A (en) 1996-11-21 2000-09-05 Virginia Tech Intellectual Properties, Inc. Patterned molecular self-assembly
US6114044A (en) * 1997-05-30 2000-09-05 Regents Of The University Of California Method of drying passivated micromachines by dewetting from a liquid-based process
US5869135A (en) 1997-10-03 1999-02-09 Massachusetts Institute Of Technology Selective chemical vapor deposition of polymers
AU2105499A (en) * 1998-01-15 1999-08-02 Cabot Corporation Polyfunctional organosilane treatment of silica
US6265026B1 (en) * 1998-01-16 2001-07-24 The Regents Of The University Of California Vapor phase deposition
US5912507A (en) * 1998-02-04 1999-06-15 Motorola, Inc. Solderable pad with integral series termination resistor
US6235340B1 (en) 1998-04-10 2001-05-22 Massachusetts Institute Of Technology Biopolymer-resistant coatings
US6108212A (en) * 1998-06-05 2000-08-22 Motorola, Inc. Surface-mount device package having an integral passive component
US6046966A (en) 1998-06-10 2000-04-04 Seagate Technology, Inc. Magneto-optical data storage system
US6200882B1 (en) 1998-06-10 2001-03-13 Seagate Technology, Inc. Method for processing a plurality of micro-machined mirror assemblies
US5977863A (en) * 1998-08-10 1999-11-02 Cts Corporation Low cross talk ball grid array resistor network
US6326677B1 (en) * 1998-09-04 2001-12-04 Cts Corporation Ball grid array resistor network
US6291090B1 (en) * 1998-09-17 2001-09-18 Aer Energy Resources, Inc. Method for making metal-air electrode with water soluble catalyst precursors
US6097277A (en) * 1998-11-05 2000-08-01 Cts Resistor network with solder sphere connector
US6005777A (en) * 1998-11-10 1999-12-21 Cts Corporation Ball grid array capacitor
US6325490B1 (en) 1998-12-31 2001-12-04 Eastman Kodak Company Nozzle plate with mixed self-assembled monolayer
DE19908525C2 (en) 1999-02-26 2001-05-31 Inst Chemo Biosensorik Water soluble copolymer and use thereof
US6194979B1 (en) * 1999-03-18 2001-02-27 Cts Corporation Ball grid array R-C network with high density
WO2001001475A1 (en) 1999-06-30 2001-01-04 The Penn State Research Foundation Electrofluidic assembly of devices and components for micro- and nano-scale integration
AUPQ304199A0 (en) 1999-09-23 1999-10-21 Commonwealth Scientific And Industrial Research Organisation Patterned carbon nanotubes
US6317023B1 (en) * 1999-10-15 2001-11-13 E. I. Du Pont De Nemours And Company Method to embed passive components
US6508979B1 (en) 2000-02-08 2003-01-21 University Of Southern California Layered nanofabrication
US20020075131A1 (en) * 2000-05-18 2002-06-20 Coates Karen L. Cermet thin film resistors
US6246312B1 (en) * 2000-07-20 2001-06-12 Cts Corporation Ball grid array resistor terminator network
US6284982B1 (en) * 2000-08-18 2001-09-04 Ga-Tek Inc. Method and component for forming an embedded resistor in a multi-layer printed circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5694740A (en) * 1996-03-15 1997-12-09 Analog Devices, Inc. Micromachined device packaged to reduce stiction
US6096149A (en) * 1997-04-21 2000-08-01 Ford Global Technologies, Inc. Method for fabricating adhesion-resistant micromachined devices

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
KIM B-H ET AL: "A NEW CLASS OF SURFACE MODIFIERS FOR STICTION REDUCTION", TECHNICAL DIGEST OF THE IEEE INTERNATIONAL MEMS '99 CONFERENCE. 12TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS. ORLANDO, FL, JAN. 17 - 21, 1999, IEEE INTERNATIONAL MICRO ELECTRO MECHANICAL SYSTEMS CONFERENCE, NEW YORK, NY: IEE, 1999, pages 189 - 193, XP000830745, ISBN: 0-7803-5195-9 *
SMITH B K ET AL: "Thin Teflon-like films for eliminating adhesion in released polysilicon microstructures", SENSORS AND ACTUATORS A, ELSEVIER SEQUOIA S.A., LAUSANNE, CH, vol. 70, no. 1-2, 1 October 1998 (1998-10-01), pages 159 - 163, XP004140127, ISSN: 0924-4247 *
SRINIVASAN U ET AL: "ALKYLTRICHLOROSILANE-BASED SELF-ASSEMBLED MONOLAYER FILMS FOR STICTION REDUCTION IN SILICON MICROMACHINES", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, IEEE INC. NEW YORK, US, vol. 7, no. 2, June 1998 (1998-06-01), pages 252 - 259, XP000834745, ISSN: 1057-7157 *

Also Published As

Publication number Publication date
US20030166342A1 (en) 2003-09-04
US20020164879A1 (en) 2002-11-07
US6830950B2 (en) 2004-12-14
WO2002090245A2 (en) 2002-11-14
TW546833B (en) 2003-08-11
US6576489B2 (en) 2003-06-10

Similar Documents

Publication Publication Date Title
WO2002090245A3 (en) Methods of forming microstructure devices
AU2002302356A1 (en) Method of lift-off microstructuring deposition material on a substrate, substrates obtainable by the method, and use thereof
AU2001266018A1 (en) Substrate with a reduced light-scattering, ultraphobic surface and a method for the production of the same
AU2002226083A1 (en) Non-skid coating and method of forming the same
AU2002304525A1 (en) Detachable substrate or detachable structure and method for the production thereof
AU2001296674A1 (en) Microfluidic substrate assembly and method for making same
AU2002343619A1 (en) Process, composition and coating of laminate material
WO2002086083A3 (en) Methods of enhancing cell responsiveness
AU2003289311A1 (en) Article having coating film thereon, method for manufacture thereof, and applying material for forming coating film
WO2008017472A3 (en) Method for the production of a porous, ceramic surface layer
AU2001241144A1 (en) Substrate with photocatalytic film and method for producing the same
WO2003037782A3 (en) Micromechanical component and method for producing same
GB0304305D0 (en) Coating for various types of substrate and method for the production thereof
EP1295649A3 (en) Repair coating method
ATE290615T1 (en) COATING PROCESS AND COATING
MY133023A (en) Process for joining two solid bodies and the resulting structural element
AU2002328444A1 (en) Photocatalyst apatite-containing film, method of forming the same, coating fluid, and electronic apparatus having member covered with photocatalyst apatite-containing film
AU2002241810A1 (en) Method of patterning a mask on the surface of a substrate and product manufactured thereby
AU2001282934A1 (en) Composite nonlinear optical film, method of producing the same and applications of the same
AU2003229467A1 (en) Method and device for the production of an antireflective coating, antireflective coating, and antireflective-coated substrate
AU2002354464A1 (en) Method of suckingly holding substrate, and suckingly and holdingly carrying machine using the method
AU2002346275A1 (en) An orientation coating method of the top of micro tip.
EP1375704A4 (en) Diamond substrate having piezoelectric thin film, and method for manufacturing it
WO2004028956A3 (en) Method and micromechanical component
AU2002228069A1 (en) Multi-layered plasma polymer coating, method for the production and use thereof

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): CN JP KR SG

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP