WO2003001223A3 - High density planar electrical interface - Google Patents

High density planar electrical interface Download PDF

Info

Publication number
WO2003001223A3
WO2003001223A3 PCT/US2002/019347 US0219347W WO03001223A3 WO 2003001223 A3 WO2003001223 A3 WO 2003001223A3 US 0219347 W US0219347 W US 0219347W WO 03001223 A3 WO03001223 A3 WO 03001223A3
Authority
WO
WIPO (PCT)
Prior art keywords
cables
respective ones
conductors
holes
substrate
Prior art date
Application number
PCT/US2002/019347
Other languages
French (fr)
Other versions
WO2003001223A2 (en
Inventor
Benjamin N Eldridge
Charles A Miller
Original Assignee
Formfactor Inc
Benjamin N Eldridge
Charles A Miller
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc, Benjamin N Eldridge, Charles A Miller filed Critical Formfactor Inc
Priority to AU2002350894A priority Critical patent/AU2002350894A1/en
Publication of WO2003001223A2 publication Critical patent/WO2003001223A2/en
Publication of WO2003001223A3 publication Critical patent/WO2003001223A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/025—Contact members formed by the conductors of a cable end
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Abstract

An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.
PCT/US2002/019347 2001-06-20 2002-06-18 High density planar electrical interface WO2003001223A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002350894A AU2002350894A1 (en) 2001-06-20 2002-06-18 High density planar electrical interface

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/886,521 2001-06-20
US09/886,521 US7108546B2 (en) 2001-06-20 2001-06-20 High density planar electrical interface

Publications (2)

Publication Number Publication Date
WO2003001223A2 WO2003001223A2 (en) 2003-01-03
WO2003001223A3 true WO2003001223A3 (en) 2003-05-30

Family

ID=25389185

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/019347 WO2003001223A2 (en) 2001-06-20 2002-06-18 High density planar electrical interface

Country Status (4)

Country Link
US (3) US7108546B2 (en)
AU (1) AU2002350894A1 (en)
TW (1) TWI221197B (en)
WO (1) WO2003001223A2 (en)

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US7108546B2 (en) * 2001-06-20 2006-09-19 Formfactor, Inc. High density planar electrical interface
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US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US7759949B2 (en) 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US7271602B2 (en) * 2005-02-16 2007-09-18 Sv Probe Pte. Ltd. Probe card assembly and method of attaching probes to the probe card assembly
US7371676B2 (en) 2005-04-08 2008-05-13 Micron Technology, Inc. Method for fabricating semiconductor components with through wire interconnects
US7502606B2 (en) * 2005-04-11 2009-03-10 Microsoft Corporation Computer-readable medium, method, and device for associating information with a contact
US7393770B2 (en) 2005-05-19 2008-07-01 Micron Technology, Inc. Backside method for fabricating semiconductor components with conductive interconnects
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7307348B2 (en) 2005-12-07 2007-12-11 Micron Technology, Inc. Semiconductor components having through wire interconnects (TWI)
US7312617B2 (en) * 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US7659612B2 (en) * 2006-04-24 2010-02-09 Micron Technology, Inc. Semiconductor components having encapsulated through wire interconnects (TWI)
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7994808B2 (en) * 2007-02-02 2011-08-09 Johnstech International Corporation Contact insert for a microcircuit test socket
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
KR100882512B1 (en) * 2007-04-25 2009-02-10 윌테크놀러지(주) Probe card
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US7733104B2 (en) * 2008-04-21 2010-06-08 Sv Probe Pte. Ltd. Low force interconnects for probe cards
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
US8884639B2 (en) * 2008-08-27 2014-11-11 Advantest (Singapore) Pte Ltd Methods, apparatus and articles of manufacture for testing a plurality of singulated die
KR100907864B1 (en) * 2008-09-30 2009-07-14 주식회사 아이엠텍 Space transformer having isolation resistor for probe card and method of manufacturing space transforber
JP2012098219A (en) * 2010-11-04 2012-05-24 Yamaichi Electronics Co Ltd Socket for semiconductor device
US8878560B2 (en) 2010-12-30 2014-11-04 Taiwan Semiconductor Manufacturing Company, Ltd. High frequency probing structure
KR101149759B1 (en) * 2011-03-14 2012-06-01 리노공업주식회사 A testing apparatus of the semiconductor device
US8622752B2 (en) * 2011-04-13 2014-01-07 Teradyne, Inc. Probe-card interposer constructed using hexagonal modules
US8988895B2 (en) * 2011-08-23 2015-03-24 Tessera, Inc. Interconnection elements with encased interconnects
US20130048344A1 (en) * 2011-08-30 2013-02-28 Star Technologies Inc. High frequency circuit board
US9594114B2 (en) * 2014-06-26 2017-03-14 Teradyne, Inc. Structure for transmitting signals in an application space between a device under test and test electronics
US10120020B2 (en) 2016-06-16 2018-11-06 Formfactor Beaverton, Inc. Probe head assemblies and probe systems for testing integrated circuit devices
US9977052B2 (en) * 2016-10-04 2018-05-22 Teradyne, Inc. Test fixture
US20180188288A1 (en) * 2016-12-29 2018-07-05 Intel Corporation Stacked instrument architecture for testing and validation of electronic circuits
US10914757B2 (en) * 2019-02-07 2021-02-09 Teradyne, Inc. Connection module
JP7151567B2 (en) * 2019-03-14 2022-10-12 株式会社オートネットワーク技術研究所 Connection structure between circuit device and electronic control unit and circuit device

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US5068602A (en) * 1990-09-07 1991-11-26 Tektronix, Inc. DUT board for a semiconductor device tester having a reconfigurable coaxial interconnect grid and method of using same
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JP2000088920A (en) * 1998-09-08 2000-03-31 Hitachi Electronics Eng Co Ltd Interface unit for inspection apparatus

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JPH03177038A (en) * 1989-12-06 1991-08-01 Hitachi Ltd Semiconductor lsi inspecting device
US5068602A (en) * 1990-09-07 1991-11-26 Tektronix, Inc. DUT board for a semiconductor device tester having a reconfigurable coaxial interconnect grid and method of using same
JPH08110366A (en) * 1994-10-11 1996-04-30 Murata Mfg Co Ltd Measuring tool for surface-mount type electronic parts
US5945838A (en) * 1997-06-26 1999-08-31 Star Technology Group, Inc. Apparatus for testing circuit boards
JPH11108955A (en) * 1997-09-30 1999-04-23 Mitsubishi Electric Corp Wafer prober
JP2000088920A (en) * 1998-09-08 2000-03-31 Hitachi Electronics Eng Co Ltd Interface unit for inspection apparatus

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Title
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PATENT ABSTRACTS OF JAPAN vol. 1996, no. 08 30 August 1996 (1996-08-30) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 09 30 July 1999 (1999-07-30) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 06 22 September 2000 (2000-09-22) *

Also Published As

Publication number Publication date
US20020195265A1 (en) 2002-12-26
US20080150571A1 (en) 2008-06-26
US20070007980A1 (en) 2007-01-11
US7335057B2 (en) 2008-02-26
US7699616B2 (en) 2010-04-20
TWI221197B (en) 2004-09-21
US7108546B2 (en) 2006-09-19
AU2002350894A1 (en) 2003-01-08
WO2003001223A2 (en) 2003-01-03

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