WO2003012883A3 - Method for contacting thin-film electrodes - Google Patents
Method for contacting thin-film electrodes Download PDFInfo
- Publication number
- WO2003012883A3 WO2003012883A3 PCT/EP2002/008638 EP0208638W WO03012883A3 WO 2003012883 A3 WO2003012883 A3 WO 2003012883A3 EP 0208638 W EP0208638 W EP 0208638W WO 03012883 A3 WO03012883 A3 WO 03012883A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal strip
- thin
- film electrodes
- sonotrode
- contacting thin
- Prior art date
Links
- 239000010409 thin film Substances 0.000 title abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 238000003466 welding Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10137778A DE10137778A1 (en) | 2001-08-02 | 2001-08-02 | Method for contacting thin-film electrodes |
DE10137778.9 | 2001-08-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003012883A2 WO2003012883A2 (en) | 2003-02-13 |
WO2003012883A3 true WO2003012883A3 (en) | 2004-02-12 |
Family
ID=7694052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2002/008638 WO2003012883A2 (en) | 2001-08-02 | 2002-08-02 | Method for contacting thin-film electrodes |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10137778A1 (en) |
WO (1) | WO2003012883A2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10355043A1 (en) * | 2003-11-25 | 2005-06-23 | Watlow Electric Manufacturing Co., St. Louis | Method for fastening an electrical conductor to a surface element, and hot runner element, in particular for a plastic injection device |
AT502004B1 (en) * | 2005-06-01 | 2007-07-15 | Outokumpu Copper Neumayer Gmbh | ELECTRICAL CONNECTING ELEMENT, METHOD FOR THE PRODUCTION THEREOF AND SOLAR CELL AND MODULE WITH CONNECTING ELEMENT |
US8651354B2 (en) | 2010-07-19 | 2014-02-18 | Orthodyne Electronics Corporation | Ultrasonic bonding systems including workholder and ribbon feeding system |
US8231044B2 (en) | 2010-10-01 | 2012-07-31 | Orthodyne Electronics Corporation | Solar substrate ribbon bonding system |
US8196798B2 (en) | 2010-10-08 | 2012-06-12 | Kulicke And Soffa Industries, Inc. | Solar substrate ribbon bonding system |
RU2623820C1 (en) * | 2016-08-16 | 2017-06-29 | Общество с ограниченной ответственностью "НТЦ тонкопленочных технологий в энергетике", ООО "НТЦ ТПТ" | Method of commutation of heterostructural photoelectric converters |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3620847A (en) * | 1969-05-05 | 1971-11-16 | Us Air Force | Silicon solar cell array hardened to space nuclear blast radiation |
US4336648A (en) * | 1979-11-02 | 1982-06-29 | Licentia Patent-Verwaltungs-G.M.B.H. | Method of contacting a solar cell |
US4473432A (en) * | 1983-02-04 | 1984-09-25 | Harold Leader | Dot heat stapling |
US4975133A (en) * | 1981-11-28 | 1990-12-04 | Licentia Patent-Verwaltungs-Gmbh | Apparatus for welding components together with the use of ultrasound |
US5525172A (en) * | 1987-07-24 | 1996-06-11 | Cadiou; James | Compound ultrasonic sonotrode especially adapted to welding between semi-rigid polystyrene and molded cellulose |
US5580509A (en) * | 1993-11-26 | 1996-12-03 | Siemens Solar Gmbh | Method for electrically contacting thin-film solar modules |
US5626276A (en) * | 1996-03-14 | 1997-05-06 | International Business Machines Corporation | Linkage drive mechanism for ultrasonic wirebonding |
JP2000004034A (en) * | 1998-06-16 | 2000-01-07 | Yazaki Corp | Connecting method for bus bar in solar battery module |
-
2001
- 2001-08-02 DE DE10137778A patent/DE10137778A1/en not_active Withdrawn
-
2002
- 2002-08-02 WO PCT/EP2002/008638 patent/WO2003012883A2/en not_active Application Discontinuation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3620847A (en) * | 1969-05-05 | 1971-11-16 | Us Air Force | Silicon solar cell array hardened to space nuclear blast radiation |
US4336648A (en) * | 1979-11-02 | 1982-06-29 | Licentia Patent-Verwaltungs-G.M.B.H. | Method of contacting a solar cell |
US4975133A (en) * | 1981-11-28 | 1990-12-04 | Licentia Patent-Verwaltungs-Gmbh | Apparatus for welding components together with the use of ultrasound |
US4473432A (en) * | 1983-02-04 | 1984-09-25 | Harold Leader | Dot heat stapling |
US5525172A (en) * | 1987-07-24 | 1996-06-11 | Cadiou; James | Compound ultrasonic sonotrode especially adapted to welding between semi-rigid polystyrene and molded cellulose |
US5580509A (en) * | 1993-11-26 | 1996-12-03 | Siemens Solar Gmbh | Method for electrically contacting thin-film solar modules |
US5626276A (en) * | 1996-03-14 | 1997-05-06 | International Business Machines Corporation | Linkage drive mechanism for ultrasonic wirebonding |
JP2000004034A (en) * | 1998-06-16 | 2000-01-07 | Yazaki Corp | Connecting method for bus bar in solar battery module |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 04 31 August 2000 (2000-08-31) * |
Also Published As
Publication number | Publication date |
---|---|
WO2003012883A2 (en) | 2003-02-13 |
DE10137778A1 (en) | 2003-03-06 |
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