WO2003012883A3 - Method for contacting thin-film electrodes - Google Patents

Method for contacting thin-film electrodes Download PDF

Info

Publication number
WO2003012883A3
WO2003012883A3 PCT/EP2002/008638 EP0208638W WO03012883A3 WO 2003012883 A3 WO2003012883 A3 WO 2003012883A3 EP 0208638 W EP0208638 W EP 0208638W WO 03012883 A3 WO03012883 A3 WO 03012883A3
Authority
WO
WIPO (PCT)
Prior art keywords
metal strip
thin
film electrodes
sonotrode
contacting thin
Prior art date
Application number
PCT/EP2002/008638
Other languages
French (fr)
Other versions
WO2003012883A2 (en
Inventor
Franz Karg
Heinz-Ingo Schneider
Helmut Vogt
Original Assignee
Shell Solar Gmbh
Franz Karg
Heinz-Ingo Schneider
Helmut Vogt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shell Solar Gmbh, Franz Karg, Heinz-Ingo Schneider, Helmut Vogt filed Critical Shell Solar Gmbh
Publication of WO2003012883A2 publication Critical patent/WO2003012883A2/en
Publication of WO2003012883A3 publication Critical patent/WO2003012883A3/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/05Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207Ultrasonic-, H.F.-, cold- or impact welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/34Coated articles, e.g. plated or painted; Surface treated articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/38Conductors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/10Aluminium or alloys thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/18Dissimilar materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52Ceramics
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Abstract

With thin-film components, in particular thin-film solar modules, conductive layers (4) are contacted with a metal strip (5) by ultrasonic welding according to the invention. For that purpose, a sonotrode (6) is set onto the metal strip (5) laid upon the conductive layer (4) with a contact force. Subsequently, the sonotrode (6) is oscillated and the conductive layer (4) is bonded with the metal strip (5).
PCT/EP2002/008638 2001-08-02 2002-08-02 Method for contacting thin-film electrodes WO2003012883A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10137778A DE10137778A1 (en) 2001-08-02 2001-08-02 Method for contacting thin-film electrodes
DE10137778.9 2001-08-02

Publications (2)

Publication Number Publication Date
WO2003012883A2 WO2003012883A2 (en) 2003-02-13
WO2003012883A3 true WO2003012883A3 (en) 2004-02-12

Family

ID=7694052

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/008638 WO2003012883A2 (en) 2001-08-02 2002-08-02 Method for contacting thin-film electrodes

Country Status (2)

Country Link
DE (1) DE10137778A1 (en)
WO (1) WO2003012883A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10355043A1 (en) * 2003-11-25 2005-06-23 Watlow Electric Manufacturing Co., St. Louis Method for fastening an electrical conductor to a surface element, and hot runner element, in particular for a plastic injection device
AT502004B1 (en) * 2005-06-01 2007-07-15 Outokumpu Copper Neumayer Gmbh ELECTRICAL CONNECTING ELEMENT, METHOD FOR THE PRODUCTION THEREOF AND SOLAR CELL AND MODULE WITH CONNECTING ELEMENT
US8651354B2 (en) 2010-07-19 2014-02-18 Orthodyne Electronics Corporation Ultrasonic bonding systems including workholder and ribbon feeding system
US8231044B2 (en) 2010-10-01 2012-07-31 Orthodyne Electronics Corporation Solar substrate ribbon bonding system
US8196798B2 (en) 2010-10-08 2012-06-12 Kulicke And Soffa Industries, Inc. Solar substrate ribbon bonding system
RU2623820C1 (en) * 2016-08-16 2017-06-29 Общество с ограниченной ответственностью "НТЦ тонкопленочных технологий в энергетике", ООО "НТЦ ТПТ" Method of commutation of heterostructural photoelectric converters

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3620847A (en) * 1969-05-05 1971-11-16 Us Air Force Silicon solar cell array hardened to space nuclear blast radiation
US4336648A (en) * 1979-11-02 1982-06-29 Licentia Patent-Verwaltungs-G.M.B.H. Method of contacting a solar cell
US4473432A (en) * 1983-02-04 1984-09-25 Harold Leader Dot heat stapling
US4975133A (en) * 1981-11-28 1990-12-04 Licentia Patent-Verwaltungs-Gmbh Apparatus for welding components together with the use of ultrasound
US5525172A (en) * 1987-07-24 1996-06-11 Cadiou; James Compound ultrasonic sonotrode especially adapted to welding between semi-rigid polystyrene and molded cellulose
US5580509A (en) * 1993-11-26 1996-12-03 Siemens Solar Gmbh Method for electrically contacting thin-film solar modules
US5626276A (en) * 1996-03-14 1997-05-06 International Business Machines Corporation Linkage drive mechanism for ultrasonic wirebonding
JP2000004034A (en) * 1998-06-16 2000-01-07 Yazaki Corp Connecting method for bus bar in solar battery module

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3620847A (en) * 1969-05-05 1971-11-16 Us Air Force Silicon solar cell array hardened to space nuclear blast radiation
US4336648A (en) * 1979-11-02 1982-06-29 Licentia Patent-Verwaltungs-G.M.B.H. Method of contacting a solar cell
US4975133A (en) * 1981-11-28 1990-12-04 Licentia Patent-Verwaltungs-Gmbh Apparatus for welding components together with the use of ultrasound
US4473432A (en) * 1983-02-04 1984-09-25 Harold Leader Dot heat stapling
US5525172A (en) * 1987-07-24 1996-06-11 Cadiou; James Compound ultrasonic sonotrode especially adapted to welding between semi-rigid polystyrene and molded cellulose
US5580509A (en) * 1993-11-26 1996-12-03 Siemens Solar Gmbh Method for electrically contacting thin-film solar modules
US5626276A (en) * 1996-03-14 1997-05-06 International Business Machines Corporation Linkage drive mechanism for ultrasonic wirebonding
JP2000004034A (en) * 1998-06-16 2000-01-07 Yazaki Corp Connecting method for bus bar in solar battery module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 04 31 August 2000 (2000-08-31) *

Also Published As

Publication number Publication date
WO2003012883A2 (en) 2003-02-13
DE10137778A1 (en) 2003-03-06

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