WO2003018874A3 - Apparatus and methods for electrochemical processing of microelectronic workpieces - Google Patents
Apparatus and methods for electrochemical processing of microelectronic workpieces Download PDFInfo
- Publication number
- WO2003018874A3 WO2003018874A3 PCT/US2002/028071 US0228071W WO03018874A3 WO 2003018874 A3 WO2003018874 A3 WO 2003018874A3 US 0228071 W US0228071 W US 0228071W WO 03018874 A3 WO03018874 A3 WO 03018874A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- virtual
- methods
- electro
- interface element
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
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- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Weting (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003523715A JP2005501180A (en) | 2001-08-31 | 2002-09-03 | Apparatus and method for electrochemical processing of microelectronic workpieces |
EP02780265A EP1481114A4 (en) | 2001-08-31 | 2002-09-03 | Apparatus and methods for electrochemical processing of microelectronic workpieces |
AU2002343330A AU2002343330A1 (en) | 2001-08-31 | 2002-09-03 | Apparatus and methods for electrochemical processing of microelectronic workpieces |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31659701P | 2001-08-31 | 2001-08-31 | |
US60/316,597 | 2001-08-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003018874A2 WO2003018874A2 (en) | 2003-03-06 |
WO2003018874A3 true WO2003018874A3 (en) | 2003-04-17 |
Family
ID=23229725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/028071 WO2003018874A2 (en) | 2001-08-31 | 2002-09-03 | Apparatus and methods for electrochemical processing of microelectronic workpieces |
Country Status (5)
Country | Link |
---|---|
US (2) | US7090751B2 (en) |
EP (1) | EP1481114A4 (en) |
JP (1) | JP2005501180A (en) |
AU (1) | AU2002343330A1 (en) |
WO (1) | WO2003018874A2 (en) |
Families Citing this family (13)
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---|---|---|---|---|
TWI223678B (en) * | 1998-03-20 | 2004-11-11 | Semitool Inc | Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper |
US6497801B1 (en) * | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
US7189318B2 (en) * | 1999-04-13 | 2007-03-13 | Semitool, Inc. | Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece |
US20060043750A1 (en) * | 2004-07-09 | 2006-03-02 | Paul Wirth | End-effectors for handling microfeature workpieces |
US7067048B2 (en) * | 2003-08-08 | 2006-06-27 | Lsi Logic Corporation | Method to improve the control of electro-polishing by use of a plating electrode an electrolyte bath |
US20070020080A1 (en) * | 2004-07-09 | 2007-01-25 | Paul Wirth | Transfer devices and methods for handling microfeature workpieces within an environment of a processing machine |
US20060045666A1 (en) * | 2004-07-09 | 2006-03-02 | Harris Randy A | Modular tool unit for processing of microfeature workpieces |
US7531060B2 (en) * | 2004-07-09 | 2009-05-12 | Semitool, Inc. | Integrated tool assemblies with intermediate processing modules for processing of microfeature workpieces |
CN102618541A (en) * | 2004-11-05 | 2012-08-01 | 圣诺制药公司 | Compositions for treating respiratory viral infections and their use |
US20070181441A1 (en) * | 2005-10-14 | 2007-08-09 | Applied Materials, Inc. | Method and apparatus for electropolishing |
US8524065B2 (en) * | 2008-09-19 | 2013-09-03 | Metokote Corporation | Systems and methods for electrocoating a part |
US8496790B2 (en) * | 2011-05-18 | 2013-07-30 | Applied Materials, Inc. | Electrochemical processor |
US8496789B2 (en) * | 2011-05-18 | 2013-07-30 | Applied Materials, Inc. | Electrochemical processor |
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2002
- 2002-09-03 WO PCT/US2002/028071 patent/WO2003018874A2/en active Application Filing
- 2002-09-03 JP JP2003523715A patent/JP2005501180A/en active Pending
- 2002-09-03 AU AU2002343330A patent/AU2002343330A1/en not_active Abandoned
- 2002-09-03 EP EP02780265A patent/EP1481114A4/en not_active Withdrawn
- 2002-09-03 US US10/234,442 patent/US7090751B2/en not_active Expired - Fee Related
-
2006
- 2006-08-15 US US11/505,252 patent/US20070131542A1/en not_active Abandoned
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Title |
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See also references of EP1481114A4 * |
Also Published As
Publication number | Publication date |
---|---|
WO2003018874A2 (en) | 2003-03-06 |
US7090751B2 (en) | 2006-08-15 |
EP1481114A2 (en) | 2004-12-01 |
EP1481114A4 (en) | 2005-06-22 |
US20070131542A1 (en) | 2007-06-14 |
US20030070918A1 (en) | 2003-04-17 |
JP2005501180A (en) | 2005-01-13 |
AU2002343330A1 (en) | 2003-03-10 |
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