WO2003022020A3 - Sheet material and its use in circuit boards - Google Patents

Sheet material and its use in circuit boards Download PDF

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Publication number
WO2003022020A3
WO2003022020A3 PCT/US2002/027546 US0227546W WO03022020A3 WO 2003022020 A3 WO2003022020 A3 WO 2003022020A3 US 0227546 W US0227546 W US 0227546W WO 03022020 A3 WO03022020 A3 WO 03022020A3
Authority
WO
WIPO (PCT)
Prior art keywords
sheet material
circuit boards
sheet
useful
concentration
Prior art date
Application number
PCT/US2002/027546
Other languages
French (fr)
Other versions
WO2003022020A2 (en
Inventor
Michael R Samuels
Subhotosh Kahn
Levit R Mikhail
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Priority to AU2002327571A priority Critical patent/AU2002327571A1/en
Priority to EP02763569A priority patent/EP1423995B1/en
Priority to MXPA04000914A priority patent/MXPA04000914A/en
Priority to CN02816862.3A priority patent/CN105189115A/en
Priority to JP2003525568A priority patent/JP2005501764A/en
Priority to KR1020047002968A priority patent/KR100875353B1/en
Priority to CA002455053A priority patent/CA2455053C/en
Priority to BR0212702-4A priority patent/BR0212702A/en
Priority to DE60215199T priority patent/DE60215199T2/en
Publication of WO2003022020A2 publication Critical patent/WO2003022020A2/en
Publication of WO2003022020A3 publication Critical patent/WO2003022020A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/14—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by a layer differing constitutionally or physically in different parts, e.g. denser near its faces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B13/00—Conditioning or physical treatment of the material to be shaped
    • B29B13/10—Conditioning or physical treatment of the material to be shaped by grinding, e.g. by triturating; by sieving; by filtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
    • D04H1/4374—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece using different kinds of webs, e.g. by layering webs
    • D—TEXTILES; PAPER
    • D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
    • D04H—MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARY MATERIAL; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS, NON-WOVEN FABRICS; COTTON-WOOL; WADDING ; NON-WOVEN FABRICS FROM STAPLE FIBRES, FILAMENTS OR YARNS, BONDED WITH AT LEAST ONE WEB-LIKE MATERIAL DURING THEIR CONSOLIDATION
    • D04H1/00—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres
    • D04H1/40—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties
    • D04H1/42—Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties characterised by the use of certain kinds of fibres insofar as this use has no preponderant influence on the consolidation of the fleece
    • D04H1/4382—Stretched reticular film fibres; Composite fibres; Mixed fibres; Ultrafine fibres; Fibres for artificial leather
    • D04H1/43835—Mixed fibres, e.g. at least two chemically different fibres or fibre blends
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/02—Synthetic macromolecular fibres
    • B32B2262/0261—Polyamide fibres
    • B32B2262/0269—Aromatic polyamide fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/249941—Fiber is on the surface of a polymeric matrix having no embedded portion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]

Abstract

A sheet comprising thermoplastic polymer (TP) (4) and short high tensile modulus fibers (3) , in which the concentration of TP (4) in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.
PCT/US2002/027546 2001-08-30 2002-08-29 Sheet material and its use in circuit boards WO2003022020A2 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
AU2002327571A AU2002327571A1 (en) 2001-08-30 2002-08-29 Sheet material and its use in circuit boards
EP02763569A EP1423995B1 (en) 2001-08-30 2002-08-29 Sheet material and its use in circuit boards
MXPA04000914A MXPA04000914A (en) 2001-08-30 2002-08-29 Sheet material especially useful for circuit boards.
CN02816862.3A CN105189115A (en) 2001-08-30 2002-08-29 Sheet material especially useful for circuit boards
JP2003525568A JP2005501764A (en) 2001-08-30 2002-08-29 Sheet material particularly useful for circuit boards
KR1020047002968A KR100875353B1 (en) 2001-08-30 2002-08-29 Sheet material especially useful for circuit boards
CA002455053A CA2455053C (en) 2001-08-30 2002-08-29 Sheet material and its use in circuit boards
BR0212702-4A BR0212702A (en) 2001-08-30 2002-08-29 Sheet, frame, circuit board, chip package, chip carrier and chip package divider and a process for producing a sheet material
DE60215199T DE60215199T2 (en) 2001-08-30 2002-08-29 PANEL MATERIAL AND ITS USE IN PCB

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31588501P 2001-08-30 2001-08-30
US60/315,885 2001-08-30

Publications (2)

Publication Number Publication Date
WO2003022020A2 WO2003022020A2 (en) 2003-03-13
WO2003022020A3 true WO2003022020A3 (en) 2003-10-09

Family

ID=23226483

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/027546 WO2003022020A2 (en) 2001-08-30 2002-08-29 Sheet material and its use in circuit boards

Country Status (12)

Country Link
US (1) US6929848B2 (en)
EP (1) EP1423995B1 (en)
JP (1) JP2005501764A (en)
KR (1) KR100875353B1 (en)
CN (1) CN105189115A (en)
AU (1) AU2002327571A1 (en)
BR (1) BR0212702A (en)
CA (1) CA2455053C (en)
DE (1) DE60215199T2 (en)
MX (1) MXPA04000914A (en)
TW (1) TWI239290B (en)
WO (1) WO2003022020A2 (en)

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JP2002124763A (en) * 2000-10-16 2002-04-26 Matsushita Electric Ind Co Ltd Circuit forming board, production method and materials therefor
JP2004202834A (en) * 2002-12-25 2004-07-22 Sumitomo Chem Co Ltd Aramid laminate and its production method
TW200615142A (en) * 2004-06-30 2006-05-16 Sumitomo Chemical Co Films
CA2499849C (en) 2005-03-09 2010-02-02 Zcl Composites Inc. Composite laminated sheet material for containment sumps
US7524388B2 (en) * 2005-05-10 2009-04-28 World Properties, Inc. Composites, method of manufacture thereof, and articles formed therefrom
US8168292B2 (en) * 2006-06-15 2012-05-01 Innegra Technologies, Llc Composite materials including amorphous thermoplastic fibers
US20080145602A1 (en) 2006-12-15 2008-06-19 Gary Lee Hendren Processes for making shaped honeycomb and honeycombs made thereby
US7771811B2 (en) 2006-12-15 2010-08-10 E.I. Du Pont De Nemours And Company Honeycomb from controlled porosity paper
US20080286522A1 (en) * 2006-12-15 2008-11-20 Subhotosh Khan Honeycomb having a low coefficient of thermal expansion and articles made from same
US8025949B2 (en) 2006-12-15 2011-09-27 E.I. Du Pont De Nemours And Company Honeycomb containing poly(paraphenylene terephthalamide) paper with aliphatic polyamide binder and articles made therefrom
US7771809B2 (en) * 2006-12-15 2010-08-10 E. I. Du Pont De Nemours And Company Shaped honeycomb
US7785520B2 (en) * 2006-12-15 2010-08-31 E.I. Du Pont De Nemours And Company Processes for making shaped honeycomb and honeycombs made thereby
US7771810B2 (en) * 2006-12-15 2010-08-10 E.I. Du Pont De Nemours And Company Honeycomb from paper having a high melt point thermoplastic fiber
US7815993B2 (en) 2006-12-15 2010-10-19 E.I. Du Pont De Nemours And Company Honeycomb from paper having flame retardant thermoplastic binder
JP5014113B2 (en) * 2007-01-26 2012-08-29 イビデン株式会社 Sheet material, method for manufacturing the same, exhaust gas treatment device, and silencer
JP4261590B2 (en) * 2007-01-31 2009-04-30 株式会社日立エンジニアリング・アンド・サービス Adhesive-free aramid-polyester laminate, production method and production apparatus thereof
US7648758B2 (en) 2007-02-06 2010-01-19 Innegrity, Llc Low dielectric loss composite material
US20080188153A1 (en) * 2007-02-06 2008-08-07 Innegrity, Llc Method of Forming a Low Dielectric Loss Composite Material
US8114251B2 (en) * 2007-12-21 2012-02-14 E.I. Du Pont De Nemours And Company Papers containing fibrids derived from diamino diphenyl sulfone
US7803247B2 (en) * 2007-12-21 2010-09-28 E.I. Du Pont De Nemours And Company Papers containing floc derived from diamino diphenyl sulfone
US8118975B2 (en) * 2007-12-21 2012-02-21 E. I. Du Pont De Nemours And Company Papers containing fibrids derived from diamino diphenyl sulfone
JP4402734B1 (en) * 2008-07-30 2010-01-20 株式会社日立エンジニアリング・アンド・サービス Adhesive-free aramid-polyphenylene sulfide laminate manufacturing method, rotating electrical machine insulating member and insulating structure
JP2012116906A (en) * 2010-11-30 2012-06-21 Sumitomo Chemical Co Ltd Resin-impregnated sheet and resin-impregnated sheet with conductive layer
US20150305151A1 (en) * 2011-01-27 2015-10-22 Longpont Co., Ltd. Synthetic paper
WO2014003835A1 (en) 2012-06-28 2014-01-03 3M Innovative Properties Company Thermally conductive substrate article
JP6309451B2 (en) * 2012-09-20 2018-04-11 株式会社クラレ Circuit board and manufacturing method thereof
US11004792B2 (en) 2018-09-28 2021-05-11 Intel Corporation Microelectronic device including fiber-containing build-up layers
CN110154464A (en) * 2019-06-14 2019-08-23 赣州龙邦材料科技有限公司 Aramid fiber paper base flexibility coat copper plate and its manufacturing method
CN114450328A (en) 2019-09-25 2022-05-06 株式会社村田制作所 Liquid crystal polymer powder and method for producing same

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WO1988004165A1 (en) * 1986-12-08 1988-06-16 Nordson Corporation Method and apparatus for depositing moisture-absorbent material in a substrate
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WO1988004165A1 (en) * 1986-12-08 1988-06-16 Nordson Corporation Method and apparatus for depositing moisture-absorbent material in a substrate
JPH07252372A (en) * 1994-03-16 1995-10-03 Toray Ind Inc Prepreg and laminate

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Title
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DATABASE WPI Section Ch Week 199548, Derwent World Patents Index; Class A28, AN 1995-371217, XP002222618 *

Also Published As

Publication number Publication date
DE60215199T2 (en) 2007-08-23
CN105189115A (en) 2015-12-23
BR0212702A (en) 2004-10-19
CA2455053C (en) 2009-12-22
KR100875353B1 (en) 2008-12-22
AU2002327571A1 (en) 2003-03-18
US6929848B2 (en) 2005-08-16
US20030087077A1 (en) 2003-05-08
MXPA04000914A (en) 2004-04-02
CA2455053A1 (en) 2003-03-13
EP1423995B1 (en) 2006-10-04
DE60215199D1 (en) 2006-11-16
WO2003022020A2 (en) 2003-03-13
TWI239290B (en) 2005-09-11
EP1423995A2 (en) 2004-06-02
JP2005501764A (en) 2005-01-20
KR20040029099A (en) 2004-04-03

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