WO2003022523A1 - Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method - Google Patents

Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method Download PDF

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Publication number
WO2003022523A1
WO2003022523A1 PCT/JP2002/009022 JP0209022W WO03022523A1 WO 2003022523 A1 WO2003022523 A1 WO 2003022523A1 JP 0209022 W JP0209022 W JP 0209022W WO 03022523 A1 WO03022523 A1 WO 03022523A1
Authority
WO
WIPO (PCT)
Prior art keywords
dressing
pad
tool
holding mechanism
dressing tool
Prior art date
Application number
PCT/JP2002/009022
Other languages
French (fr)
Japanese (ja)
Inventor
Susumu Hoshino
Eiichi Yamamoto
Takahiko Mitsui
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001272945A external-priority patent/JP2003080456A/en
Priority claimed from JP2002058096A external-priority patent/JP2003257911A/en
Priority claimed from JP2002175035A external-priority patent/JP4348900B2/en
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to KR1020047003519A priority Critical patent/KR100565913B1/en
Priority to EP02765417.7A priority patent/EP1426140B1/en
Publication of WO2003022523A1 publication Critical patent/WO2003022523A1/en
Priority to US10/791,670 priority patent/US20050032467A1/en
Priority to US11/511,279 priority patent/US20060292969A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor

Abstract

A dressing device (DA) is comprised of a pad holding mechanism (10) for holding and rotating a grinding pad (15) having a doughnut disk-shaped pad surface (15a), a dressing tool (2) having a substantially rectangular dressing surface (3), and a dressing tool holding mechanism (1) for holding the dressing tool (2) with the dressing surface (3) opposed to the pad surface (15a) of the grinding pad (15) held and rotated by the pad holding mechanism (10). The dressing tool holding mechanism (1) abuts dressing tool (2) held therein against the pad surface (15a) to effect dressing with the widthwise centerline (L1) of the dressing surface (3) directed to extend radially of the pad surface (15a). This makes it possible to improve the flatness of the processed surface after dressing.
PCT/JP2002/009022 2001-09-10 2002-09-05 Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method WO2003022523A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020047003519A KR100565913B1 (en) 2001-09-10 2002-09-05 Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method
EP02765417.7A EP1426140B1 (en) 2001-09-10 2002-09-05 Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method
US10/791,670 US20050032467A1 (en) 2001-09-10 2004-03-03 Dressing tool, dressing device, dressing method, processing device and semiconductor device producing method
US11/511,279 US20060292969A1 (en) 2001-09-10 2006-08-29 Dressing tool, dressing device, dressing method, processing device and semiconductor device producing method

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2001-272945 2001-09-10
JP2001272945A JP2003080456A (en) 2001-09-10 2001-09-10 Dressing tool, dressing device using the tool and manufacturing device using working tool dressed by the dressing device
JP2002058096A JP2003257911A (en) 2002-03-04 2002-03-04 Dressing method and dressing device, polishing device, and semiconductor device and manufacturing method thereof
JP2002-058096 2002-03-04
JP2002175035A JP4348900B2 (en) 2002-06-14 2002-06-14 Dressing method
JP2002-175035 2002-06-14

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10/791,670 Continuation US20050032467A1 (en) 2001-09-10 2004-03-03 Dressing tool, dressing device, dressing method, processing device and semiconductor device producing method
US11/511,279 Continuation US20060292969A1 (en) 2001-09-10 2006-08-29 Dressing tool, dressing device, dressing method, processing device and semiconductor device producing method

Publications (1)

Publication Number Publication Date
WO2003022523A1 true WO2003022523A1 (en) 2003-03-20

Family

ID=27347468

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/009022 WO2003022523A1 (en) 2001-09-10 2002-09-05 Dressing tool, dressing device, dressing method, processing device, and semiconductor device producing method

Country Status (6)

Country Link
US (2) US20050032467A1 (en)
EP (1) EP1426140B1 (en)
KR (1) KR100565913B1 (en)
CN (1) CN1553842A (en)
TW (1) TW546182B (en)
WO (1) WO2003022523A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106965307A (en) * 2017-05-02 2017-07-21 廊坊合力天机械设备有限公司 A kind of abatvoix top-surface camber cloth trimming device and dressing method

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006106790A1 (en) * 2005-04-01 2006-10-12 Nikon Corporation Polishing apparatus, semiconductor device manufacturing method using such polishing apparatus and semiconductor device manufactured by such semiconductor device manufacturing method
CN100546770C (en) * 2007-11-20 2009-10-07 浙江工业大学 Trimming device for polishing cushion
JP5510779B2 (en) * 2009-06-15 2014-06-04 Ｎｔｎ株式会社 Grinding equipment
JP5764031B2 (en) * 2011-10-06 2015-08-12 株式会社ディスコ Cutting equipment
TWI663025B (en) * 2012-09-24 2019-06-21 日商荏原製作所股份有限公司 Grinding method and grinding device
JP6121795B2 (en) * 2013-05-15 2017-04-26 株式会社荏原製作所 Dressing apparatus, polishing apparatus equipped with the dressing apparatus, and polishing method
JP6093741B2 (en) * 2014-10-21 2017-03-08 信越半導体株式会社 Polishing apparatus and wafer polishing method
CN106563980B (en) * 2015-10-12 2020-04-10 株式会社迪思科 Grinding method
US9802293B1 (en) * 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
JP6803187B2 (en) * 2016-10-05 2020-12-23 株式会社ディスコ Grinding wheel dressing method
CN106938437A (en) * 2017-05-12 2017-07-11 深圳市海德精密机械有限公司 A kind of super mirror finish equipment of submicron order
US10857651B2 (en) * 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
US10814457B2 (en) * 2018-03-19 2020-10-27 Globalfoundries Inc. Gimbal for CMP tool conditioning disk having flexible metal diaphragm
JP7308074B2 (en) * 2019-05-14 2023-07-13 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
CN112975750A (en) * 2021-02-08 2021-06-18 华中科技大学 Online grinding device for grinding wheel for translational wafer grinding
CN114952452B (en) * 2022-04-19 2023-09-26 赛莱克斯微系统科技（北京）有限公司 Polishing pad conditioner, chemical mechanical polishing device and method

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6471557A (en) 1987-09-10 1989-03-16 Aeg Elotherm Gmbh Method and device for electromagnetically agitating molten metal in continuous casting cooling mold
JPH07237113A (en) * 1994-02-28 1995-09-12 Hitachi Zosen Corp Both surface polishing machine with surface finishing device
JPH0911117A (en) * 1995-06-20 1997-01-14 Sony Corp Flattening method and apparatus
US5782682A (en) * 1995-06-09 1998-07-21 Ehwa Diamond Ind. Co. Ltd. Grinding wheel having abrasive tips
JP2000237947A (en) * 1999-02-19 2000-09-05 Speedfam-Ipec Co Ltd Dresser
US6116997A (en) * 1998-04-23 2000-09-12 Hakomori; Shunji Single side work polishing apparatus
JP2001162513A (en) * 1999-12-09 2001-06-19 Daido Steel Co Ltd Lapping surface truing device for single-side lapping machine
US20010009844A1 (en) 1998-04-25 2001-07-26 Sung-Bum Cho Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk
US6273797B1 (en) * 1999-11-19 2001-08-14 International Business Machines Corporation In-situ automated CMP wedge conditioner

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785585A (en) * 1995-09-18 1998-07-28 International Business Machines Corporation Polish pad conditioner with radial compensation
US6884155B2 (en) * 1999-11-22 2005-04-26 Kinik Diamond grid CMP pad dresser
US6237797B1 (en) * 1999-10-29 2001-05-29 John J. Hurford Fuel cap extension
US6547651B1 (en) * 1999-11-10 2003-04-15 Strasbaugh Subaperture chemical mechanical planarization with polishing pad conditioning

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6471557A (en) 1987-09-10 1989-03-16 Aeg Elotherm Gmbh Method and device for electromagnetically agitating molten metal in continuous casting cooling mold
JPH07237113A (en) * 1994-02-28 1995-09-12 Hitachi Zosen Corp Both surface polishing machine with surface finishing device
US5782682A (en) * 1995-06-09 1998-07-21 Ehwa Diamond Ind. Co. Ltd. Grinding wheel having abrasive tips
JPH0911117A (en) * 1995-06-20 1997-01-14 Sony Corp Flattening method and apparatus
US6116997A (en) * 1998-04-23 2000-09-12 Hakomori; Shunji Single side work polishing apparatus
US20010009844A1 (en) 1998-04-25 2001-07-26 Sung-Bum Cho Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk
JP2000237947A (en) * 1999-02-19 2000-09-05 Speedfam-Ipec Co Ltd Dresser
US6273797B1 (en) * 1999-11-19 2001-08-14 International Business Machines Corporation In-situ automated CMP wedge conditioner
JP2001162513A (en) * 1999-12-09 2001-06-19 Daido Steel Co Ltd Lapping surface truing device for single-side lapping machine

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1426140A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106965307A (en) * 2017-05-02 2017-07-21 廊坊合力天机械设备有限公司 A kind of abatvoix top-surface camber cloth trimming device and dressing method

Also Published As

Publication number Publication date
EP1426140A1 (en) 2004-06-09
US20050032467A1 (en) 2005-02-10
EP1426140A4 (en) 2007-08-08
TW546182B (en) 2003-08-11
CN1553842A (en) 2004-12-08
EP1426140B1 (en) 2013-07-10
KR100565913B1 (en) 2006-03-31
US20060292969A1 (en) 2006-12-28
KR20040031070A (en) 2004-04-09

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