WO2003023358A3 - Methods and apparatus for testing electronic circuits - Google Patents

Methods and apparatus for testing electronic circuits Download PDF

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Publication number
WO2003023358A3
WO2003023358A3 PCT/US2002/028564 US0228564W WO03023358A3 WO 2003023358 A3 WO2003023358 A3 WO 2003023358A3 US 0228564 W US0228564 W US 0228564W WO 03023358 A3 WO03023358 A3 WO 03023358A3
Authority
WO
WIPO (PCT)
Prior art keywords
methods
circuits
transient
supply currents
currents
Prior art date
Application number
PCT/US2002/028564
Other languages
French (fr)
Other versions
WO2003023358A2 (en
Inventor
David M Binkley
Rafic Zein Makki
Thomas Paul Weldon
Ali M Chehab
Original Assignee
Univ North Carolina
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ North Carolina filed Critical Univ North Carolina
Priority to AU2002330002A priority Critical patent/AU2002330002A1/en
Publication of WO2003023358A2 publication Critical patent/WO2003023358A2/en
Publication of WO2003023358A3 publication Critical patent/WO2003023358A3/en

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/50Marginal testing, e.g. race, voltage or current testing
    • G11C29/50012Marginal testing, e.g. race, voltage or current testing of timing
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/30Marginal testing, e.g. by varying supply voltage
    • G01R31/3004Current or voltage test
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/30Marginal testing, e.g. by varying supply voltage
    • G01R31/3004Current or voltage test
    • G01R31/3008Quiescent current [IDDQ] test or leakage current test
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/31721Power aspects, e.g. power supplies for test circuits, power saving during test
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/02Detection or location of defective auxiliary circuits, e.g. defective refresh counters
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/50Marginal testing, e.g. race, voltage or current testing
    • G11C2029/5006Current

Abstract

Methods and apparatus are provided for testing to determine the existence of defects and faults in circuits (737), devices (500), and systems such as digital integrated circuits (600), SRAM memory (606), mixed signal circuits (602), and the like. In particular, methods and apparatus are provided for detecting faults in circuits (737), devices (500), and systems using input control signals to generate controlled-duration, controlled pulse-width, transient power supply currents in a device under test (712), where said transient power supply currents are of controllable bandwidth (702, 706) and can be used as observables to determine faulty or defective operation. Additionally, methods and apparatus are provided to permit high bandwidth sensing of transient supply currents as need to preserve the narrow widths of these current pulses (700-703). These methods may include autozero techniques to remove supply current leakage current and DC offsets associated with practical current sensing currents. The sensed transient supply currents can be compared to single or multiple thresholds to assess normal or faulty or defective operation of the device under test (712).
PCT/US2002/028564 2001-09-10 2002-09-10 Methods and apparatus for testing electronic circuits WO2003023358A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002330002A AU2002330002A1 (en) 2001-09-10 2002-09-10 Methods and apparatus for testing electronic circuits

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31859901P 2001-09-10 2001-09-10
US60/318,599 2001-09-10

Publications (2)

Publication Number Publication Date
WO2003023358A2 WO2003023358A2 (en) 2003-03-20
WO2003023358A3 true WO2003023358A3 (en) 2003-04-24

Family

ID=23238838

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/028564 WO2003023358A2 (en) 2001-09-10 2002-09-10 Methods and apparatus for testing electronic circuits

Country Status (3)

Country Link
US (4) US6833724B2 (en)
AU (1) AU2002330002A1 (en)
WO (1) WO2003023358A2 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7539589B2 (en) * 2003-06-24 2009-05-26 Nxp B.V. Testing radio frequency and analogue circuits
US7043389B2 (en) * 2004-02-18 2006-05-09 James Francis Plusquellic Method and system for identifying and locating defects in an integrated circuit
JP4824319B2 (en) * 2005-01-21 2011-11-30 ルネサスエレクトロニクス株式会社 Failure detection apparatus and method, and signal extraction circuit
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) * 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US20080042681A1 (en) * 2006-08-11 2008-02-21 Infineon Technologies Ag Integrated circuit device with current measurement
US7969124B2 (en) * 2007-06-01 2011-06-28 Advantest Corporation Power supply apparatus, test apparatus, and electronic device
US7800389B2 (en) * 2007-07-13 2010-09-21 Allegro Microsystems, Inc. Integrated circuit having built-in self-test features
US7904286B2 (en) * 2007-09-14 2011-03-08 International Business Machines Corporation Method and apparatus for scheduling test vectors in a multiple core integrated circuit
TW200935534A (en) * 2008-02-15 2009-08-16 Promos Technologies Inc Methods of analyzing IC devices and wafers
US8476917B2 (en) * 2010-01-29 2013-07-02 Freescale Semiconductor, Inc. Quiescent current (IDDQ) indication and testing apparatus and methods
US8560987B2 (en) * 2011-09-21 2013-10-15 Qualcomm Incorporated Test functionality integrity verification for integrated circuit design
DE102012220493A1 (en) * 2012-11-09 2014-05-15 Robert Bosch Gmbh Subscriber station for connection to a bus line and method for compensation of a fault due to a CAN bus system in a received signal
US9651596B2 (en) * 2013-08-30 2017-05-16 Keysight Technologies, Inc. System and apparatus for measuring capacitance
US9651576B2 (en) * 2013-10-17 2017-05-16 Thermo Keytek LLC Low-side coaxial current probe
JP2017038200A (en) * 2015-08-10 2017-02-16 ルネサスエレクトロニクス株式会社 Semiconductor device and failure detection method
WO2018113873A1 (en) 2016-12-22 2018-06-28 Vestas Wind Systems A/S Detecting electrical failures in a wind turbine generator control system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5332973A (en) * 1992-05-01 1994-07-26 The University Of Manitoba Built-in fault testing of integrated circuits
US5731700A (en) * 1994-03-14 1998-03-24 Lsi Logic Corporation Quiescent power supply current test method and apparatus for integrated circuits
US5808476A (en) * 1996-07-29 1998-09-15 National Science Council Built-in current sensor for IDDQ monitoring
US6195772B1 (en) * 1996-06-21 2001-02-27 Altera Corporaiton Electronic circuit testing methods and apparatus

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU7736396A (en) * 1995-11-15 1997-06-05 University Of South Florida Method and apparatus for use in iddq integrated circuit testing
US6169408B1 (en) * 1996-09-30 2001-01-02 Motorola, Inc. Method and apparatus for testing an integrated circuit with a pulsed radiation beam
TW419592B (en) * 1998-03-31 2001-01-21 Hitachi Maxell Current accumulating value detecting apparatus, current detecting apparatus and the battery set used
JP2002539420A (en) * 1999-02-10 2002-11-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Apparatus for transient current test of digital electronic CMOS circuit
US6496028B1 (en) * 1999-05-11 2002-12-17 Interuniversitair Micro-Elektronica Centrum Method and apparatus for testing electronic devices
US6324790B1 (en) * 1999-09-01 2001-12-04 Interkal, Inc. Deployable seating arrangement
US6342790B1 (en) * 2000-04-13 2002-01-29 Pmc-Sierra, Inc. High-speed, adaptive IDDQ measurement
US6301168B1 (en) * 2000-08-23 2001-10-09 Motorola, Inc. CMOS cell and circuit design for improved IDDQ testing
US6518782B1 (en) * 2000-08-29 2003-02-11 Delta Design, Inc. Active power monitoring using externally located current sensors
US6580281B2 (en) * 2001-02-22 2003-06-17 Robert A. Falk Externally induced voltage alterations for integrated circuit analysis

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5332973A (en) * 1992-05-01 1994-07-26 The University Of Manitoba Built-in fault testing of integrated circuits
US5731700A (en) * 1994-03-14 1998-03-24 Lsi Logic Corporation Quiescent power supply current test method and apparatus for integrated circuits
US6195772B1 (en) * 1996-06-21 2001-02-27 Altera Corporaiton Electronic circuit testing methods and apparatus
US5808476A (en) * 1996-07-29 1998-09-15 National Science Council Built-in current sensor for IDDQ monitoring

Also Published As

Publication number Publication date
WO2003023358A2 (en) 2003-03-20
US6833724B2 (en) 2004-12-21
US7148717B2 (en) 2006-12-12
US20040263198A1 (en) 2004-12-30
US20030085729A1 (en) 2003-05-08
AU2002330002A1 (en) 2003-03-24
US7710140B2 (en) 2010-05-04
US20100097073A1 (en) 2010-04-22
US20070052438A1 (en) 2007-03-08

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