WO2003025244A3 - Refurbishing spent sputtering targets - Google Patents
Refurbishing spent sputtering targets Download PDFInfo
- Publication number
- WO2003025244A3 WO2003025244A3 PCT/US2002/029246 US0229246W WO03025244A3 WO 2003025244 A3 WO2003025244 A3 WO 2003025244A3 US 0229246 W US0229246 W US 0229246W WO 03025244 A3 WO03025244 A3 WO 03025244A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sputtering targets
- refurbishing
- spent sputtering
- spent
- refurbished
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F2007/068—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts repairing articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002333640A AU2002333640A1 (en) | 2001-09-17 | 2002-09-16 | Refurbishing spent sputtering targets |
JP2003530013A JP2005508444A (en) | 2001-09-17 | 2002-09-16 | Recycling of used sputter targets |
KR1020047003873A KR100617402B1 (en) | 2001-09-17 | 2002-09-16 | Refurbishing spent sputtering targets |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US32242901P | 2001-09-17 | 2001-09-17 | |
US60/322,429 | 2001-09-17 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2003025244A2 WO2003025244A2 (en) | 2003-03-27 |
WO2003025244A3 true WO2003025244A3 (en) | 2004-10-14 |
WO2003025244B1 WO2003025244B1 (en) | 2004-12-29 |
Family
ID=23254840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/029246 WO2003025244A2 (en) | 2001-09-17 | 2002-09-16 | Refurbishing spent sputtering targets |
Country Status (6)
Country | Link |
---|---|
US (1) | US7175802B2 (en) |
JP (1) | JP2005508444A (en) |
KR (1) | KR100617402B1 (en) |
CN (1) | CN1608141A (en) |
AU (1) | AU2002333640A1 (en) |
WO (1) | WO2003025244A2 (en) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030002043A1 (en) * | 2001-04-10 | 2003-01-02 | Kla-Tencor Corporation | Periodic patterns and technique to control misalignment |
US7964247B2 (en) * | 2003-02-24 | 2011-06-21 | Tekna Plasma Systems, Inc. | Process and apparatus for the manufacture of a sputtering target |
US7504008B2 (en) * | 2004-03-12 | 2009-03-17 | Applied Materials, Inc. | Refurbishment of sputtering targets |
US20060021870A1 (en) * | 2004-07-27 | 2006-02-02 | Applied Materials, Inc. | Profile detection and refurbishment of deposition targets |
US20060081459A1 (en) * | 2004-10-18 | 2006-04-20 | Applied Materials, Inc. | In-situ monitoring of target erosion |
KR100978160B1 (en) * | 2005-01-28 | 2010-08-27 | 파나소닉 주식회사 | Deposition method by physical vapor deposition method and target for deposition processing by physical vapor deposition method |
RU2418886C2 (en) * | 2005-05-05 | 2011-05-20 | Х.К. Штарк Гмбх | Procedure for application of coating for fabrication or restoration of sputtering targets and anodes of x-ray tubes |
JP5065248B2 (en) * | 2005-05-05 | 2012-10-31 | ハー.ツェー.スタルク ゲゼルシャフト ミット ベシュレンクテル ハフツング | Coating method and coated product on substrate surface |
US8617672B2 (en) | 2005-07-13 | 2013-12-31 | Applied Materials, Inc. | Localized surface annealing of components for substrate processing chambers |
US9127362B2 (en) | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
WO2007062089A1 (en) * | 2005-11-22 | 2007-05-31 | Bodycote Imt, Inc. | Fabrication of ruthenium and ruthenium alloy sputtering targets with low oxygen content |
US20070125646A1 (en) * | 2005-11-25 | 2007-06-07 | Applied Materials, Inc. | Sputtering target for titanium sputtering chamber |
US8080930B2 (en) * | 2006-09-07 | 2011-12-20 | Michigan Technological University | Self-regenerating nanotips for low-power electric propulsion (EP) cathodes |
US20080078268A1 (en) | 2006-10-03 | 2008-04-03 | H.C. Starck Inc. | Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof |
US20100015467A1 (en) * | 2006-11-07 | 2010-01-21 | H.C. Starck Gmbh & Co., Kg | Method for coating a substrate and coated product |
KR100856758B1 (en) * | 2006-11-30 | 2008-09-05 | 희성금속 주식회사 | Manufacturing method of the iridium and ruthenium sputtering target having a fine grain size |
US20080145688A1 (en) * | 2006-12-13 | 2008-06-19 | H.C. Starck Inc. | Method of joining tantalum clade steel structures |
US8197894B2 (en) | 2007-05-04 | 2012-06-12 | H.C. Starck Gmbh | Methods of forming sputtering targets |
US7942969B2 (en) | 2007-05-30 | 2011-05-17 | Applied Materials, Inc. | Substrate cleaning chamber and components |
US8968536B2 (en) * | 2007-06-18 | 2015-03-03 | Applied Materials, Inc. | Sputtering target having increased life and sputtering uniformity |
US7871563B2 (en) * | 2007-07-17 | 2011-01-18 | Williams Advanced Materials, Inc. | Process for the refurbishing of a sputtering target |
US7901552B2 (en) | 2007-10-05 | 2011-03-08 | Applied Materials, Inc. | Sputtering target with grooves and intersecting channels |
US20100178525A1 (en) * | 2009-01-12 | 2010-07-15 | Scott Campbell | Method for making composite sputtering targets and the tartets made in accordance with the method |
WO2009117043A1 (en) * | 2008-03-20 | 2009-09-24 | Sci Engineered Materials, Inc. | A method for making composite sputtering targets and the targets made in accordance with the method |
US8246903B2 (en) | 2008-09-09 | 2012-08-21 | H.C. Starck Inc. | Dynamic dehydriding of refractory metal powders |
US8043655B2 (en) * | 2008-10-06 | 2011-10-25 | H.C. Starck, Inc. | Low-energy method of manufacturing bulk metallic structures with submicron grain sizes |
JP4348396B1 (en) | 2008-12-26 | 2009-10-21 | 田中貴金属工業株式会社 | Reproduction target manufacturing method |
TWI397600B (en) * | 2009-01-07 | 2013-06-01 | Solar Applied Mat Tech Corp | Recycled sputtering target and its making method |
GB0905731D0 (en) * | 2009-04-03 | 2009-05-20 | Eads Uk Ltd | Hybrid component |
CN101665916B (en) * | 2009-09-29 | 2011-04-20 | 中国科学院上海微系统与信息技术研究所 | Method for preparing sputtering target of phase-change material |
KR20130027025A (en) * | 2010-06-16 | 2013-03-14 | 가부시키가이샤 아루박 | Sputtering target and process for production thereof |
JP5883022B2 (en) | 2010-11-30 | 2016-03-09 | ダウ グローバル テクノロジーズ エルエルシー | Repair of alloy sputter targets containing copper and indium. |
JP2013001971A (en) * | 2011-06-17 | 2013-01-07 | Solar Applied Materials Technology Corp | Reproduced sputtering target and manufacturing method therefor |
US8734896B2 (en) | 2011-09-29 | 2014-05-27 | H.C. Starck Inc. | Methods of manufacturing high-strength large-area sputtering targets |
CN103484851A (en) * | 2012-06-13 | 2014-01-01 | 通用电气公司 | Method for repairing metal components and gas turbine components |
KR20150048538A (en) * | 2013-10-28 | 2015-05-07 | 희성금속 주식회사 | Preparation method of reuse gold targets for semiconductors |
KR102332893B1 (en) * | 2015-03-19 | 2021-12-01 | 엘티메탈 주식회사 | Method for a variety metal bonding on precious metals sputtering target decrease raw materials and the sputtering target prepared thereby |
KR102263238B1 (en) * | 2015-03-20 | 2021-06-10 | 엘티메탈 주식회사 | Sintered body for sputtering target, sputtering target comprising the same, and the preparation thereof |
US11149343B2 (en) * | 2015-05-28 | 2021-10-19 | Materion Corporation | Processes for refurbishing a spent sputtering target |
CN105671501B (en) * | 2016-04-11 | 2019-06-14 | 广州市尤特新材料有限公司 | A kind of method that waste and old rotary target material is recycled, repairs and reprocessed |
KR200486197Y1 (en) | 2017-07-10 | 2018-04-12 | 이승노 | Ladder for fruit tree cultivation |
KR20210148458A (en) | 2020-05-28 | 2021-12-08 | 삼성디스플레이 주식회사 | Depositing device and depositing method using depositing device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62230967A (en) * | 1986-03-31 | 1987-10-09 | Mitsubishi Metal Corp | Method for generating used target |
JPS6393859A (en) * | 1986-10-09 | 1988-04-25 | Toshiba Corp | Sputtering target and its production |
JPH0565635A (en) * | 1991-03-11 | 1993-03-19 | Mitsubishi Materials Corp | Method for repairing magnetron sputtering noble-metal target |
JPH05148631A (en) * | 1991-10-31 | 1993-06-15 | Mitsubishi Materials Corp | Target for sputtering |
JPH11286776A (en) * | 1998-04-02 | 1999-10-19 | Mitsubishi Materials Corp | Sputtering target for forming magnet-optical recording medium |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2933835A1 (en) * | 1979-08-21 | 1981-03-26 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR FASTENING TARGET MATERIALS PRESENT IN DISK OR PLATE SHAPE ON COOLING PLATE FOR DUST-UP SYSTEMS |
EP0342537B1 (en) * | 1988-05-16 | 1995-09-06 | Tosoh Corporation | Process for the manufacture of a sputtering target for producing electroconductive transparent films |
US5428882A (en) * | 1993-04-05 | 1995-07-04 | The Regents Of The University Of California | Process for the fabrication of aluminum metallized pyrolytic graphite sputtering targets |
US5342496A (en) * | 1993-05-18 | 1994-08-30 | Tosoh Smd, Inc. | Method of welding sputtering target/backing plate assemblies |
JP2000038661A (en) | 1998-07-21 | 2000-02-08 | Hitachi Metals Ltd | Co ALLOY TARGET, ITS PRODUCTION, APPARATUS FOR SPUTTERING, MAGNETIC RECORDING FILM AND DEVICE FOR MAGNETIC RECORDING |
JP4240679B2 (en) * | 1999-09-21 | 2009-03-18 | ソニー株式会社 | Method for producing sputtering target |
PL363521A1 (en) * | 2001-02-14 | 2004-11-29 | H.C.Starck, Inc. | Rejuvenation of refractory metal products |
-
2002
- 2002-09-16 CN CNA028181441A patent/CN1608141A/en active Pending
- 2002-09-16 JP JP2003530013A patent/JP2005508444A/en active Pending
- 2002-09-16 US US10/243,948 patent/US7175802B2/en not_active Expired - Fee Related
- 2002-09-16 AU AU2002333640A patent/AU2002333640A1/en not_active Abandoned
- 2002-09-16 KR KR1020047003873A patent/KR100617402B1/en not_active IP Right Cessation
- 2002-09-16 WO PCT/US2002/029246 patent/WO2003025244A2/en active Search and Examination
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62230967A (en) * | 1986-03-31 | 1987-10-09 | Mitsubishi Metal Corp | Method for generating used target |
JPS6393859A (en) * | 1986-10-09 | 1988-04-25 | Toshiba Corp | Sputtering target and its production |
JPH0565635A (en) * | 1991-03-11 | 1993-03-19 | Mitsubishi Materials Corp | Method for repairing magnetron sputtering noble-metal target |
JPH05148631A (en) * | 1991-10-31 | 1993-06-15 | Mitsubishi Materials Corp | Target for sputtering |
JPH11286776A (en) * | 1998-04-02 | 1999-10-19 | Mitsubishi Materials Corp | Sputtering target for forming magnet-optical recording medium |
Non-Patent Citations (5)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 0121, no. 03 (C - 485) 5 April 1988 (1988-04-05) * |
PATENT ABSTRACTS OF JAPAN vol. 0123, no. 33 (C - 526) 8 September 1988 (1988-09-08) * |
PATENT ABSTRACTS OF JAPAN vol. 0173, no. 82 (C - 1085) 19 July 1993 (1993-07-19) * |
PATENT ABSTRACTS OF JAPAN vol. 0175, no. 40 (C - 1115) 29 September 1993 (1993-09-29) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 01 31 January 2000 (2000-01-31) * |
Also Published As
Publication number | Publication date |
---|---|
KR100617402B1 (en) | 2006-09-01 |
KR20040044935A (en) | 2004-05-31 |
WO2003025244A2 (en) | 2003-03-27 |
US7175802B2 (en) | 2007-02-13 |
WO2003025244B1 (en) | 2004-12-29 |
US20030077199A1 (en) | 2003-04-24 |
CN1608141A (en) | 2005-04-20 |
AU2002333640A1 (en) | 2003-04-01 |
JP2005508444A (en) | 2005-03-31 |
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