WO2003025244A3 - Refurbishing spent sputtering targets - Google Patents

Refurbishing spent sputtering targets Download PDF

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Publication number
WO2003025244A3
WO2003025244A3 PCT/US2002/029246 US0229246W WO03025244A3 WO 2003025244 A3 WO2003025244 A3 WO 2003025244A3 US 0229246 W US0229246 W US 0229246W WO 03025244 A3 WO03025244 A3 WO 03025244A3
Authority
WO
WIPO (PCT)
Prior art keywords
sputtering targets
refurbishing
spent sputtering
spent
refurbished
Prior art date
Application number
PCT/US2002/029246
Other languages
French (fr)
Other versions
WO2003025244B1 (en
WO2003025244A2 (en
Inventor
Michael Sandlin
Original Assignee
Heraeus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Inc filed Critical Heraeus Inc
Priority to JP2003530013A priority Critical patent/JP2005508444A/en
Priority to KR1020047003873A priority patent/KR100617402B1/en
Priority to AU2002333640A priority patent/AU2002333640A1/en
Publication of WO2003025244A2 publication Critical patent/WO2003025244A2/en
Publication of WO2003025244A3 publication Critical patent/WO2003025244A3/en
Publication of WO2003025244B1 publication Critical patent/WO2003025244B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F2007/068—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts repairing articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps

Abstract

Spent sputtering targets are refurbished by filling the depleted (2) region of the target (1) with new sputter material using a hot isostatic pressing or HIP'ing technique.
PCT/US2002/029246 2001-09-17 2002-09-16 Refurbishing spent sputtering targets WO2003025244A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003530013A JP2005508444A (en) 2001-09-17 2002-09-16 Recycling of used sputter targets
KR1020047003873A KR100617402B1 (en) 2001-09-17 2002-09-16 Refurbishing spent sputtering targets
AU2002333640A AU2002333640A1 (en) 2001-09-17 2002-09-16 Refurbishing spent sputtering targets

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32242901P 2001-09-17 2001-09-17
US60/322,429 2001-09-17

Publications (3)

Publication Number Publication Date
WO2003025244A2 WO2003025244A2 (en) 2003-03-27
WO2003025244A3 true WO2003025244A3 (en) 2004-10-14
WO2003025244B1 WO2003025244B1 (en) 2004-12-29

Family

ID=23254840

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/029246 WO2003025244A2 (en) 2001-09-17 2002-09-16 Refurbishing spent sputtering targets

Country Status (6)

Country Link
US (1) US7175802B2 (en)
JP (1) JP2005508444A (en)
KR (1) KR100617402B1 (en)
CN (1) CN1608141A (en)
AU (1) AU2002333640A1 (en)
WO (1) WO2003025244A2 (en)

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US7504008B2 (en) * 2004-03-12 2009-03-17 Applied Materials, Inc. Refurbishment of sputtering targets
US20060021870A1 (en) * 2004-07-27 2006-02-02 Applied Materials, Inc. Profile detection and refurbishment of deposition targets
US20060081459A1 (en) * 2004-10-18 2006-04-20 Applied Materials, Inc. In-situ monitoring of target erosion
US8419911B2 (en) * 2005-01-28 2013-04-16 Panasonic Corporation Deposition method by physical vapor deposition and target for deposition processing by physical vapor deposition
BRPI0611451A2 (en) * 2005-05-05 2010-09-08 Starck H C Gmbh coating process for fabrication or reprocessing of metallization targets and x-ray anodes
BRPI0611539B1 (en) * 2005-05-05 2017-04-04 Starck H C Gmbh method of applying a coating to a surface, cold spray coat and coated object
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US20070116592A1 (en) * 2005-11-22 2007-05-24 Paul Tylus Fabrication of Ruthenium and Ruthenium Alloy Sputtering Targets with Low Oxygen Content
US20070125646A1 (en) * 2005-11-25 2007-06-07 Applied Materials, Inc. Sputtering target for titanium sputtering chamber
US8080930B2 (en) * 2006-09-07 2011-12-20 Michigan Technological University Self-regenerating nanotips for low-power electric propulsion (EP) cathodes
US20080078268A1 (en) 2006-10-03 2008-04-03 H.C. Starck Inc. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof
DK2104753T3 (en) * 2006-11-07 2014-09-29 Starck H C Gmbh PROCEDURE FOR COATING A SUBSTRATE AND A COATED PRODUCT
KR100856758B1 (en) * 2006-11-30 2008-09-05 희성금속 주식회사 Manufacturing method of the iridium and ruthenium sputtering target having a fine grain size
US20080145688A1 (en) 2006-12-13 2008-06-19 H.C. Starck Inc. Method of joining tantalum clade steel structures
US8197894B2 (en) 2007-05-04 2012-06-12 H.C. Starck Gmbh Methods of forming sputtering targets
US7942969B2 (en) 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US8968536B2 (en) * 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
US7871563B2 (en) * 2007-07-17 2011-01-18 Williams Advanced Materials, Inc. Process for the refurbishing of a sputtering target
US7901552B2 (en) 2007-10-05 2011-03-08 Applied Materials, Inc. Sputtering target with grooves and intersecting channels
WO2009117043A1 (en) * 2008-03-20 2009-09-24 Sci Engineered Materials, Inc. A method for making composite sputtering targets and the targets made in accordance with the method
US20100178525A1 (en) * 2009-01-12 2010-07-15 Scott Campbell Method for making composite sputtering targets and the tartets made in accordance with the method
US8246903B2 (en) 2008-09-09 2012-08-21 H.C. Starck Inc. Dynamic dehydriding of refractory metal powders
US8043655B2 (en) * 2008-10-06 2011-10-25 H.C. Starck, Inc. Low-energy method of manufacturing bulk metallic structures with submicron grain sizes
JP4348396B1 (en) 2008-12-26 2009-10-21 田中貴金属工業株式会社 Reproduction target manufacturing method
TWI397600B (en) * 2009-01-07 2013-06-01 Solar Applied Mat Tech Corp Recycled sputtering target and its making method
GB0905731D0 (en) * 2009-04-03 2009-05-20 Eads Uk Ltd Hybrid component
CN101665916B (en) * 2009-09-29 2011-04-20 中国科学院上海微系统与信息技术研究所 Method for preparing sputtering target of phase-change material
WO2011158455A1 (en) * 2010-06-16 2011-12-22 株式会社アルバック Sputtering target and process for production thereof
CN103228815B (en) * 2010-11-30 2016-08-17 陶氏环球技术有限责任公司 Renovation is containing copper and the alloy sputtering targets of indium
JP2013001971A (en) * 2011-06-17 2013-01-07 Solar Applied Materials Technology Corp Reproduced sputtering target and manufacturing method therefor
US9120183B2 (en) 2011-09-29 2015-09-01 H.C. Starck Inc. Methods of manufacturing large-area sputtering targets
CN103484851A (en) * 2012-06-13 2014-01-01 通用电气公司 Method for repairing metal components and gas turbine components
KR20150048538A (en) * 2013-10-28 2015-05-07 희성금속 주식회사 Preparation method of reuse gold targets for semiconductors
KR102332893B1 (en) * 2015-03-19 2021-12-01 엘티메탈 주식회사 Method for a variety metal bonding on precious metals sputtering target decrease raw materials and the sputtering target prepared thereby
KR102263238B1 (en) * 2015-03-20 2021-06-10 엘티메탈 주식회사 Sintered body for sputtering target, sputtering target comprising the same, and the preparation thereof
US11149343B2 (en) * 2015-05-28 2021-10-19 Materion Corporation Processes for refurbishing a spent sputtering target
CN105671501B (en) * 2016-04-11 2019-06-14 广州市尤特新材料有限公司 A kind of method that waste and old rotary target material is recycled, repairs and reprocessed
KR200486197Y1 (en) 2017-07-10 2018-04-12 이승노 Ladder for fruit tree cultivation
KR20210148458A (en) 2020-05-28 2021-12-08 삼성디스플레이 주식회사 Depositing device and depositing method using depositing device

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Also Published As

Publication number Publication date
CN1608141A (en) 2005-04-20
KR100617402B1 (en) 2006-09-01
KR20040044935A (en) 2004-05-31
AU2002333640A1 (en) 2003-04-01
US20030077199A1 (en) 2003-04-24
WO2003025244B1 (en) 2004-12-29
WO2003025244A2 (en) 2003-03-27
JP2005508444A (en) 2005-03-31
US7175802B2 (en) 2007-02-13

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