WO2003036306A3 - Testing circuits on substrates - Google Patents

Testing circuits on substrates Download PDF

Info

Publication number
WO2003036306A3
WO2003036306A3 PCT/US2002/032357 US0232357W WO03036306A3 WO 2003036306 A3 WO2003036306 A3 WO 2003036306A3 US 0232357 W US0232357 W US 0232357W WO 03036306 A3 WO03036306 A3 WO 03036306A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
chuck
contacts
terminals
circuit
Prior art date
Application number
PCT/US2002/032357
Other languages
French (fr)
Other versions
WO2003036306A2 (en
Inventor
Timothy J Boyle
Wayne E Richter
Ladd T Johnson
Lawrence A Tom
Original Assignee
Electroglas Inc
Timothy J Boyle
Wayne E Richter
Ladd T Johnson
Lawrence A Tom
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroglas Inc, Timothy J Boyle, Wayne E Richter, Ladd T Johnson, Lawrence A Tom filed Critical Electroglas Inc
Priority to AU2002334941A priority Critical patent/AU2002334941A1/en
Publication of WO2003036306A2 publication Critical patent/WO2003036306A2/en
Publication of WO2003036306A3 publication Critical patent/WO2003036306A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Abstract

The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
PCT/US2002/032357 2001-10-22 2002-10-09 Testing circuits on substrates WO2003036306A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002334941A AU2002334941A1 (en) 2001-10-22 2002-10-09 Testing circuits on substrates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/035,482 US6771060B1 (en) 2001-10-22 2001-10-22 Testing circuits on substrates
US10/035,482 2001-10-22

Publications (2)

Publication Number Publication Date
WO2003036306A2 WO2003036306A2 (en) 2003-05-01
WO2003036306A3 true WO2003036306A3 (en) 2003-07-03

Family

ID=21882962

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/032357 WO2003036306A2 (en) 2001-10-22 2002-10-09 Testing circuits on substrates

Country Status (4)

Country Link
US (3) US6771060B1 (en)
AU (1) AU2002334941A1 (en)
TW (1) TWI274890B (en)
WO (1) WO2003036306A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6861859B1 (en) * 2001-10-22 2005-03-01 Electroglas, Inc. Testing circuits on substrates
US6771060B1 (en) * 2001-10-22 2004-08-03 Electroglas, Inc. Testing circuits on substrates
KR100892254B1 (en) * 2006-07-20 2009-04-17 (주)테크윙 Test handler
US20080020303A1 (en) * 2006-07-24 2008-01-24 Wei Wu Alignment for contact lithography
EP2963430B1 (en) * 2014-07-03 2019-10-02 Rasco GmbH Contactor arrangement, test-in-strip handler and test-in-strip handler arrangement
US10267845B2 (en) * 2017-05-12 2019-04-23 Delta V Instruments, Inc. Wafer level burn-in system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6111421A (en) * 1997-10-20 2000-08-29 Tokyo Electron Limited Probe method and apparatus for inspecting an object

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US3710251A (en) 1971-04-07 1973-01-09 Collins Radio Co Microelectric heat exchanger pedestal
US3949295A (en) 1974-03-20 1976-04-06 Western Electric Company, Inc. Apparatus for retaining articles in an array for testing
US4460868A (en) 1981-11-16 1984-07-17 Rca Corporation Fixture for testing semiconductor devices
US5077523A (en) * 1989-11-03 1991-12-31 John H. Blanz Company, Inc. Cryogenic probe station having movable chuck accomodating variable thickness probe cards
US5012187A (en) 1989-11-03 1991-04-30 Motorola, Inc. Method for parallel testing of semiconductor devices
US5123850A (en) 1990-04-06 1992-06-23 Texas Instruments Incorporated Non-destructive burn-in test socket for integrated circuit die
JP3219844B2 (en) * 1992-06-01 2001-10-15 東京エレクトロン株式会社 Probe device
US5479108A (en) 1992-11-25 1995-12-26 David Cheng Method and apparatus for handling wafers
US5621313A (en) * 1993-09-09 1997-04-15 Tokyo Seimitsu Co., Ltd. Wafer probing system and method that stores reference pattern and movement value data for different kinds of wafers
US5644245A (en) 1993-11-24 1997-07-01 Tokyo Electron Limited Probe apparatus for inspecting electrical characteristics of a microelectronic element
TW287235B (en) 1994-06-30 1996-10-01 Zenshin Test Co
US6577148B1 (en) * 1994-08-31 2003-06-10 Motorola, Inc. Apparatus, method, and wafer used for testing integrated circuits formed on a product wafer
US5742173A (en) 1995-03-18 1998-04-21 Tokyo Electron Limited Method and apparatus for probe testing substrate
DE19581894C2 (en) 1995-11-06 1999-12-23 Advantest Corp Device for changing the orientation of ICs
US5907246A (en) * 1995-11-29 1999-05-25 Lucent Technologies, Inc. Testing of semiconductor chips
US5667077A (en) 1996-04-26 1997-09-16 Micron Electronics, Inc. Module handling apparatus and method with rapid switchover capability
US6021380A (en) 1996-07-09 2000-02-01 Scanis, Inc. Automatic semiconductor wafer sorter/prober with extended optical inspection
EP0837333A3 (en) 1996-10-18 1999-06-09 Tokyo Electron Limited Apparatus for aligning a semiconductor wafer with an inspection contactor
US6164894A (en) 1997-11-04 2000-12-26 Cheng; David Method and apparatus for integrated wafer handling and testing
JPH11163066A (en) 1997-11-29 1999-06-18 Tokyo Electron Ltd Wafer tester
US6049740A (en) * 1998-03-02 2000-04-11 Cyberoptics Corporation Printed circuit board testing system with page scanner
JP3430015B2 (en) 1998-05-20 2003-07-28 東京エレクトロン株式会社 Reliability test system
US6137303A (en) 1998-12-14 2000-10-24 Sony Corporation Integrated testing method and apparatus for semiconductor test operations processing
US6252412B1 (en) 1999-01-08 2001-06-26 Schlumberger Technologies, Inc. Method of detecting defects in patterned substrates
US6861859B1 (en) * 2001-10-22 2005-03-01 Electroglas, Inc. Testing circuits on substrates
US6771060B1 (en) * 2001-10-22 2004-08-03 Electroglas, Inc. Testing circuits on substrates
US6781394B1 (en) * 2001-10-22 2004-08-24 Electroglas, Inc. Testing circuits on substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6111421A (en) * 1997-10-20 2000-08-29 Tokyo Electron Limited Probe method and apparatus for inspecting an object

Also Published As

Publication number Publication date
TWI274890B (en) 2007-03-01
US20060119346A1 (en) 2006-06-08
WO2003036306A2 (en) 2003-05-01
US6771060B1 (en) 2004-08-03
US7180284B2 (en) 2007-02-20
US7002337B2 (en) 2006-02-21
AU2002334941A1 (en) 2003-05-06
US20040263153A1 (en) 2004-12-30

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