WO2003041126A3 - Electrochemical mechanical processing with advancible sweeper - Google Patents

Electrochemical mechanical processing with advancible sweeper Download PDF

Info

Publication number
WO2003041126A3
WO2003041126A3 PCT/US2002/035398 US0235398W WO03041126A3 WO 2003041126 A3 WO2003041126 A3 WO 2003041126A3 US 0235398 W US0235398 W US 0235398W WO 03041126 A3 WO03041126 A3 WO 03041126A3
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
mechanical processing
advancible
sweeper
electrochemical mechanical
Prior art date
Application number
PCT/US2002/035398
Other languages
French (fr)
Other versions
WO2003041126A2 (en
Inventor
Bulent M Basol
Halit N Yakupoglu
Cyprian E Uzoh
Homayoun Talieh
Original Assignee
Nutool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nutool Inc filed Critical Nutool Inc
Priority to KR10-2004-7006513A priority Critical patent/KR20040064699A/en
Priority to JP2003543071A priority patent/JP2005509092A/en
Priority to AU2002363479A priority patent/AU2002363479A1/en
Priority to EP02802846A priority patent/EP1439935A2/en
Publication of WO2003041126A2 publication Critical patent/WO2003041126A2/en
Publication of WO2003041126A3 publication Critical patent/WO2003041126A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/22—Electroplating combined with mechanical treatment during the deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material

Abstract

The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution, a belt workpiece surface influencing device extended between a supply spool and a receiving spool. During the process, the surface of the workpiece is placed in proximity of the workpiece surface influencing device and the process solution is flowed through the process section and onto the surface while a potential difference is applied between the electrode and the surface of the workpiece.
PCT/US2002/035398 2001-11-02 2002-11-04 Electrochemical mechanical processing with advancible sweeper WO2003041126A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR10-2004-7006513A KR20040064699A (en) 2001-11-02 2002-11-04 Electrochemical mechanical processing with advancible sweeper
JP2003543071A JP2005509092A (en) 2001-11-02 2002-11-04 Electrochemical mechanical processing using an advanceable sweeper
AU2002363479A AU2002363479A1 (en) 2001-11-02 2002-11-04 Electrochemical mechanical processing with advancible sweeper
EP02802846A EP1439935A2 (en) 2001-11-02 2002-11-04 Electrochemical mechanical processing with advancible sweeper

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35021401P 2001-11-02 2001-11-02
US60/350,214 2001-11-02

Publications (2)

Publication Number Publication Date
WO2003041126A2 WO2003041126A2 (en) 2003-05-15
WO2003041126A3 true WO2003041126A3 (en) 2003-11-06

Family

ID=23375713

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/035398 WO2003041126A2 (en) 2001-11-02 2002-11-04 Electrochemical mechanical processing with advancible sweeper

Country Status (7)

Country Link
EP (1) EP1439935A2 (en)
JP (1) JP2005509092A (en)
KR (1) KR20040064699A (en)
CN (1) CN1646263A (en)
AU (1) AU2002363479A1 (en)
TW (1) TW593787B (en)
WO (1) WO2003041126A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6838149B2 (en) * 2001-12-13 2005-01-04 3M Innovative Properties Company Abrasive article for the deposition and polishing of a conductive material
KR100767047B1 (en) * 2006-05-20 2007-10-17 한국기계연구원 A electro-polishing jig and the electro-polishing method of metal mask
CN101987429B (en) * 2009-08-07 2012-09-26 中芯国际集成电路制造(上海)有限公司 Grinding method and device by chemical machinery
CN109277655B (en) * 2018-09-12 2020-02-21 南京航空航天大学 Electrolytic spraying processing device and method for multi-pattern hollowed-out thin sheet metal band

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6176992B1 (en) * 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6241583B1 (en) * 1999-02-04 2001-06-05 Applied Materials, Inc. Chemical mechanical polishing with a plurality of polishing sheets
WO2002029859A2 (en) * 2000-10-04 2002-04-11 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
WO2002057514A2 (en) * 2000-11-03 2002-07-25 Nutool, Inc. Method and apparatus for electrodeposition or etching of uniform film with minimal edge exclusion on substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6176992B1 (en) * 1998-11-03 2001-01-23 Nutool, Inc. Method and apparatus for electro-chemical mechanical deposition
US6241583B1 (en) * 1999-02-04 2001-06-05 Applied Materials, Inc. Chemical mechanical polishing with a plurality of polishing sheets
WO2002029859A2 (en) * 2000-10-04 2002-04-11 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
WO2002057514A2 (en) * 2000-11-03 2002-07-25 Nutool, Inc. Method and apparatus for electrodeposition or etching of uniform film with minimal edge exclusion on substrate

Also Published As

Publication number Publication date
JP2005509092A (en) 2005-04-07
WO2003041126A2 (en) 2003-05-15
KR20040064699A (en) 2004-07-19
AU2002363479A1 (en) 2003-05-19
CN1646263A (en) 2005-07-27
TW200300463A (en) 2003-06-01
TW593787B (en) 2004-06-21
EP1439935A2 (en) 2004-07-28

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