WO2003055287A3 - Plasma reactor with overhead rf electrode tuned to the plasma with arcing suppression - Google Patents

Plasma reactor with overhead rf electrode tuned to the plasma with arcing suppression Download PDF

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Publication number
WO2003055287A3
WO2003055287A3 PCT/US2002/030407 US0230407W WO03055287A3 WO 2003055287 A3 WO2003055287 A3 WO 2003055287A3 US 0230407 W US0230407 W US 0230407W WO 03055287 A3 WO03055287 A3 WO 03055287A3
Authority
WO
WIPO (PCT)
Prior art keywords
plasma
electrode
overhead
overhead electrode
reactor
Prior art date
Application number
PCT/US2002/030407
Other languages
French (fr)
Other versions
WO2003055287A2 (en
Inventor
Daniel J Hoffman
Gerald Zheyao Yin
Yan Ye
Dan Katz
Douglas A Buchberger Jr
Xiaoye Zhao
Kang-Lie Chiang
Robert B Hagen
Matthew L Miller
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to JP2003555872A priority Critical patent/JP4902941B2/en
Priority to EP02773574A priority patent/EP1459351A2/en
Priority to KR1020047009697A priority patent/KR100903535B1/en
Publication of WO2003055287A2 publication Critical patent/WO2003055287A2/en
Publication of WO2003055287A3 publication Critical patent/WO2003055287A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H01J37/32183—Matching circuits

Abstract

A plasma reactor for processing a semiconductor workpiece, includes a reactor chamber having a chamber wall and containing a workpiece support for holding the semiconductor workpiece, an overhead electrode overlying said workpiece support, the electrode comprising a portion of said chamber wall, an RF power generator for supplying power at a frequency of said generator to said overhead electrode and capable of maintaining a plasma within said chamber at a desired plasma ion density level. The overhead electrode has a capacitance such that said overhead electrode and the plasma formed in said chamber at said desired plasma ion density resonate together at an electrode-plasma resonant frequency, said frequency of said generator being at least near said electrode-plasma resonant frequency. The reactor further includes an insulating layer formed on a surface of said overhead electrode facing said workpiece support, a capacitive insulating layer between said RF power generator and said overhead electrode, and a metal foam layer overlying and contacting a surface of said overhead electrode that faces away from said workpiece support.
PCT/US2002/030407 2001-12-19 2002-09-25 Plasma reactor with overhead rf electrode tuned to the plasma with arcing suppression WO2003055287A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003555872A JP4902941B2 (en) 2001-12-19 2002-09-25 Plasma reactor for processing semiconductor workpieces
EP02773574A EP1459351A2 (en) 2001-12-19 2002-09-25 Plasma reactor with overhead rf electrode tuned to the plasma with arcing suppression
KR1020047009697A KR100903535B1 (en) 2001-12-19 2002-09-25 Plasma reactor with overhead rf electrode tuned to the plasma with arcing suppression

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/028,922 2001-12-19
US10/028,922 US7030335B2 (en) 2000-03-17 2001-12-19 Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression

Publications (2)

Publication Number Publication Date
WO2003055287A2 WO2003055287A2 (en) 2003-07-03
WO2003055287A3 true WO2003055287A3 (en) 2004-02-19

Family

ID=21846242

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/030407 WO2003055287A2 (en) 2001-12-19 2002-09-25 Plasma reactor with overhead rf electrode tuned to the plasma with arcing suppression

Country Status (7)

Country Link
US (1) US7030335B2 (en)
EP (1) EP1459351A2 (en)
JP (1) JP4902941B2 (en)
KR (1) KR100903535B1 (en)
CN (1) CN100341107C (en)
TW (1) TW589659B (en)
WO (1) WO2003055287A2 (en)

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