WO2003063245A3 - Process condition sensing wafer and data analysis system - Google Patents

Process condition sensing wafer and data analysis system Download PDF

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Publication number
WO2003063245A3
WO2003063245A3 PCT/US2003/000751 US0300751W WO03063245A3 WO 2003063245 A3 WO2003063245 A3 WO 2003063245A3 US 0300751 W US0300751 W US 0300751W WO 03063245 A3 WO03063245 A3 WO 03063245A3
Authority
WO
WIPO (PCT)
Prior art keywords
conditions
data analysis
analysis system
process condition
sensing wafer
Prior art date
Application number
PCT/US2003/000751
Other languages
French (fr)
Other versions
WO2003063245A2 (en
Inventor
Wayne G Renken
Original Assignee
Sensarray Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensarray Corp filed Critical Sensarray Corp
Priority to JP2003563004A priority Critical patent/JP4719933B2/en
Priority to KR1020047011508A priority patent/KR101019076B1/en
Publication of WO2003063245A2 publication Critical patent/WO2003063245A2/en
Publication of WO2003063245A3 publication Critical patent/WO2003063245A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.
PCT/US2003/000751 2002-01-24 2003-01-08 Process condition sensing wafer and data analysis system WO2003063245A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003563004A JP4719933B2 (en) 2002-01-24 2003-01-08 Processing status detection wafer and data analysis system
KR1020047011508A KR101019076B1 (en) 2002-01-24 2003-01-08 Process condition sensing wafer and data analysis system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/056,906 2002-01-24
US10/056,906 US6889568B2 (en) 2002-01-24 2002-01-24 Process condition sensing wafer and data analysis system

Publications (2)

Publication Number Publication Date
WO2003063245A2 WO2003063245A2 (en) 2003-07-31
WO2003063245A3 true WO2003063245A3 (en) 2003-11-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/000751 WO2003063245A2 (en) 2002-01-24 2003-01-08 Process condition sensing wafer and data analysis system

Country Status (5)

Country Link
US (4) US6889568B2 (en)
JP (1) JP4719933B2 (en)
KR (1) KR101019076B1 (en)
TW (1) TWI259547B (en)
WO (1) WO2003063245A2 (en)

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Also Published As

Publication number Publication date
US9165846B2 (en) 2015-10-20
US20080228419A1 (en) 2008-09-18
TW200302543A (en) 2003-08-01
US20040074323A1 (en) 2004-04-22
JP2005516400A (en) 2005-06-02
WO2003063245A2 (en) 2003-07-31
US20040031340A1 (en) 2004-02-19
US6889568B2 (en) 2005-05-10
KR20040086295A (en) 2004-10-08
JP4719933B2 (en) 2011-07-06
US7360463B2 (en) 2008-04-22
US7819033B2 (en) 2010-10-26
KR101019076B1 (en) 2011-03-07
US20150006108A9 (en) 2015-01-01
TWI259547B (en) 2006-08-01
US20110040527A1 (en) 2011-02-17

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