WO2003065776A3 - Methods and apparatus for dishing and erosion characterization - Google Patents

Methods and apparatus for dishing and erosion characterization Download PDF

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Publication number
WO2003065776A3
WO2003065776A3 PCT/US2003/002359 US0302359W WO03065776A3 WO 2003065776 A3 WO2003065776 A3 WO 2003065776A3 US 0302359 W US0302359 W US 0302359W WO 03065776 A3 WO03065776 A3 WO 03065776A3
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WO
WIPO (PCT)
Prior art keywords
dishing
erosion
characterization
methods
target
Prior art date
Application number
PCT/US2003/002359
Other languages
French (fr)
Other versions
WO2003065776A2 (en
Inventor
Mehran Nasser-Ghodsi
Phil Wood
Original Assignee
Kla Tencor Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Tech Corp filed Critical Kla Tencor Tech Corp
Publication of WO2003065776A2 publication Critical patent/WO2003065776A2/en
Publication of WO2003065776A3 publication Critical patent/WO2003065776A3/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G01N23/2252—Measuring emitted X-rays, e.g. electron probe microanalysis [EPMA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/2445—Photon detectors for X-rays, light, e.g. photomultipliers

Abstract

The present invention includes a system for efficient and effective detection and characterization of dishing and/or erosion. An X-ray emission inducer (120) is used to scan a target on a sample (157). The target can be scanned at an acute incident angle to allow characterization of the dishing and/or erosion and analysis of the metallization or thin film layer topology.
PCT/US2003/002359 2002-01-25 2003-01-23 Methods and apparatus for dishing and erosion characterization WO2003065776A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US35196002P 2002-01-25 2002-01-25
US60/351,960 2002-01-25
US10/242,496 US6810105B2 (en) 2002-01-25 2002-09-12 Methods and apparatus for dishing and erosion characterization
US10/242,496 2002-09-12

Publications (2)

Publication Number Publication Date
WO2003065776A2 WO2003065776A2 (en) 2003-08-07
WO2003065776A3 true WO2003065776A3 (en) 2003-10-16

Family

ID=27616399

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/002359 WO2003065776A2 (en) 2002-01-25 2003-01-23 Methods and apparatus for dishing and erosion characterization

Country Status (2)

Country Link
US (1) US6810105B2 (en)
WO (1) WO2003065776A2 (en)

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US20070274447A1 (en) * 2006-05-15 2007-11-29 Isaac Mazor Automated selection of X-ray reflectometry measurement locations
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US7720169B2 (en) * 2007-05-10 2010-05-18 Ilan Reuven Multiple-input multiple-output (MIMO) detector incorporating efficient signal point search and soft information refinement
US7680243B2 (en) * 2007-09-06 2010-03-16 Jordan Valley Semiconductors Ltd. X-ray measurement of properties of nano-particles
KR100937590B1 (en) * 2007-10-23 2010-01-20 한국전자통신연구원 Multiple quality image contents service system and upgrade method thereof
US8243878B2 (en) * 2010-01-07 2012-08-14 Jordan Valley Semiconductors Ltd. High-resolution X-ray diffraction measurement with enhanced sensitivity
US8687766B2 (en) 2010-07-13 2014-04-01 Jordan Valley Semiconductors Ltd. Enhancing accuracy of fast high-resolution X-ray diffractometry
US8437450B2 (en) 2010-12-02 2013-05-07 Jordan Valley Semiconductors Ltd. Fast measurement of X-ray diffraction from tilted layers
US8781070B2 (en) 2011-08-11 2014-07-15 Jordan Valley Semiconductors Ltd. Detection of wafer-edge defects
US9390984B2 (en) 2011-10-11 2016-07-12 Bruker Jv Israel Ltd. X-ray inspection of bumps on a semiconductor substrate
US9389192B2 (en) 2013-03-24 2016-07-12 Bruker Jv Israel Ltd. Estimation of XRF intensity from an array of micro-bumps
US9632043B2 (en) 2014-05-13 2017-04-25 Bruker Jv Israel Ltd. Method for accurately determining the thickness and/or elemental composition of small features on thin-substrates using micro-XRF
US9726624B2 (en) 2014-06-18 2017-08-08 Bruker Jv Israel Ltd. Using multiple sources/detectors for high-throughput X-ray topography measurement
US9606073B2 (en) 2014-06-22 2017-03-28 Bruker Jv Israel Ltd. X-ray scatterometry apparatus
US9829448B2 (en) 2014-10-30 2017-11-28 Bruker Jv Israel Ltd. Measurement of small features using XRF
JP6999268B2 (en) 2016-01-11 2022-01-18 ブルカー テクノロジーズ リミテッド Methods and equipment for X-ray scatterometry
US10816487B2 (en) 2018-04-12 2020-10-27 Bruker Technologies Ltd. Image contrast in X-ray topography imaging for defect inspection
JP2019191167A (en) 2018-04-23 2019-10-31 ブルカー ジェイヴィ イスラエル リミテッドＢｒｕｋｅｒ Ｊｖ Ｉｓｒａｅｌ Ｌｔｄ． X ray source optical system for small-angle x-ray scatterometry
WO2020008420A2 (en) 2018-07-05 2020-01-09 Bruker Jv Israel Ltd. Small-angle x-ray scatterometry
US11781999B2 (en) 2021-09-05 2023-10-10 Bruker Technologies Ltd. Spot-size control in reflection-based and scatterometry-based X-ray metrology systems

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Also Published As

Publication number Publication date
US20030142782A1 (en) 2003-07-31
US6810105B2 (en) 2004-10-26
WO2003065776A2 (en) 2003-08-07

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