WO2003071601A3 - Circuit module and method for the production thereof - Google Patents

Circuit module and method for the production thereof Download PDF

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Publication number
WO2003071601A3
WO2003071601A3 PCT/DE2003/000430 DE0300430W WO03071601A3 WO 2003071601 A3 WO2003071601 A3 WO 2003071601A3 DE 0300430 W DE0300430 W DE 0300430W WO 03071601 A3 WO03071601 A3 WO 03071601A3
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WO
WIPO (PCT)
Prior art keywords
circuit module
production
circuit carrier
electronic components
circuit
Prior art date
Application number
PCT/DE2003/000430
Other languages
German (de)
French (fr)
Other versions
WO2003071601A2 (en
Inventor
Robert Bergmann
Wolfram Hable
Original Assignee
Infineon Technologies Ag
Robert Bergmann
Wolfram Hable
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Robert Bergmann, Wolfram Hable filed Critical Infineon Technologies Ag
Publication of WO2003071601A2 publication Critical patent/WO2003071601A2/en
Publication of WO2003071601A3 publication Critical patent/WO2003071601A3/en

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    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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Abstract

The invention relates to a circuit module (1) comprising a plurality of electronic components (2) and a method for the production thereof. Said circuit module (1) comprises a circuit carrier (3) which is ceramic and a housing made of synthetic material (4). The differences in thermal expansion coefficients are minimised in such a way that the circuit carrier (3) is separated with electronic components (2) into a plurality of circuit carrier sections (5) The partitioning lines are electrically bridged by corresponding bond connections (6) in the synthetic material housing (4).
PCT/DE2003/000430 2002-02-18 2003-02-13 Circuit module and method for the production thereof WO2003071601A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10206817.8 2002-02-18
DE10206817 2002-02-18

Publications (2)

Publication Number Publication Date
WO2003071601A2 WO2003071601A2 (en) 2003-08-28
WO2003071601A3 true WO2003071601A3 (en) 2003-11-27

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DE10316136A1 (en) * 2003-04-09 2004-11-18 Ixys Semiconductor Gmbh Encapsulated power semiconductor arrangement
DE102009044933B4 (en) * 2009-09-24 2023-03-30 Infineon Technologies Ag Power semiconductor module with at least two connected circuit carriers and method for producing a power semiconductor module with at least two connected circuit carriers
DE202011100820U1 (en) 2011-05-17 2011-12-01 Ixys Semiconductor Gmbh Power semiconductor
DE102011080153A1 (en) * 2011-07-29 2013-01-31 Infineon Technologies Ag Power semiconductor module for use at outer wall of motor, has component or contact surface exhibiting direct connection with one substrate and arranged between respective substrates and metallization layer that is attached on substrates

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US5075759A (en) * 1989-07-21 1991-12-24 Motorola, Inc. Surface mounting semiconductor device and method
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DE19522173C1 (en) * 1995-06-19 1996-10-17 Eupec Gmbh & Co Kg Power semiconductor module
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US6060772A (en) * 1997-06-30 2000-05-09 Kabushiki Kaisha Toshiba Power semiconductor module with a plurality of semiconductor chips
US6272015B1 (en) * 1997-11-24 2001-08-07 International Rectifier Corp. Power semiconductor module with insulation shell support for plural separate substrates
DE10125697A1 (en) * 2001-05-25 2002-12-05 Eupec Gmbh & Co Kg Power semiconductor module and method for producing a power semiconductor module
WO2003021680A2 (en) * 2001-09-01 2003-03-13 Eupec Gmbh Power semiconductor module

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US4554613A (en) * 1983-10-31 1985-11-19 Kaufman Lance R Multiple substrate circuit package
US5075759A (en) * 1989-07-21 1991-12-24 Motorola, Inc. Surface mounting semiconductor device and method
US5332921A (en) * 1992-04-27 1994-07-26 Kabushiki Kaisha Toshiba Resin-seal type semiconductor device
DE19522173C1 (en) * 1995-06-19 1996-10-17 Eupec Gmbh & Co Kg Power semiconductor module
DE19707514A1 (en) * 1997-02-25 1998-08-27 Eupec Gmbh & Co Kg Semiconductor module
US6060772A (en) * 1997-06-30 2000-05-09 Kabushiki Kaisha Toshiba Power semiconductor module with a plurality of semiconductor chips
US6272015B1 (en) * 1997-11-24 2001-08-07 International Rectifier Corp. Power semiconductor module with insulation shell support for plural separate substrates
DE10125697A1 (en) * 2001-05-25 2002-12-05 Eupec Gmbh & Co Kg Power semiconductor module and method for producing a power semiconductor module
WO2003021680A2 (en) * 2001-09-01 2003-03-13 Eupec Gmbh Power semiconductor module

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