WO2003077620A1 - Method of manufacturing thin functional copper foils from a continuous copper foil and the manufactured product - Google Patents

Method of manufacturing thin functional copper foils from a continuous copper foil and the manufactured product Download PDF

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Publication number
WO2003077620A1
WO2003077620A1 PCT/FI2003/000169 FI0300169W WO03077620A1 WO 2003077620 A1 WO2003077620 A1 WO 2003077620A1 FI 0300169 W FI0300169 W FI 0300169W WO 03077620 A1 WO03077620 A1 WO 03077620A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper
functional
strip
foils
foil
Prior art date
Application number
PCT/FI2003/000169
Other languages
French (fr)
Inventor
Pekka Taskinen
Olli Hyvärinen
Original Assignee
Outokumpu Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Oyj filed Critical Outokumpu Oyj
Priority to AU2003208379A priority Critical patent/AU2003208379A1/en
Publication of WO2003077620A1 publication Critical patent/WO2003077620A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a method of manufacturing thin functional copper products from finished copper or copper alloy strip.
  • Functional copper products such as smart label antennas are produced by separating foils from a continuous thin strip before they are fixed on to a carrier substrate, and the remaining part of the strip is recycled to metal melting.
  • the invention also relates to the product manufactured by this method.
  • Thin foils with good electrical conductivity properties are needed in several technical applications. These include for example inductive sensors and antennas for various kinds of electronic applications.
  • these include for example inductive sensors and antennas for various kinds of electronic applications.
  • the majority of earlier manufactured metallic foil is etched or cut away in order to obtain the functional form of the foil.
  • Smart labels are the active (functional) elements of microcircuits, their various memories (ROM, RAM, EPROM etc.) (microchip) and antenna, which are laminated inside plastic or some other suitable surface material. They are activated by the effect of an external RF or UF field and therefore do not need a power source, although they may indeed have one in some cases. Smart labels may be used to identify items (products, people, animals etc.) by utilizing the data stored in the memory of the microcircuits. Identification occurs at a distance, which may vary from a few millimeters to several metres. During identification, the antenna produces an electric current to the microchip in the field of the reader.
  • the labels may be single- use, such as labels on food supply and other consumer goods packaging, and be destroyed after use, or they may be designed for permanent use, such as bank, personal and other ID applications.
  • the typical smart label antenna is 20 - 50 ⁇ m thick and has a surface area of 10 - 50 mm x 10 - 100 mm.
  • a printed antenna is generally manufactured using the serigraphy technique. Electroconductivity is created with conductive powder, which can be for instance silver, copper or graphite. In addition to printed antennas, antennas are manufactured at present by winding thin copper wire, by vapourizing, electrolytically or chemically. When making the shape of the antenna coil the unnecessary part of the surface metal manufactured in different ways from continuous copper foil is etched away chemically.
  • the part to be etched away can well be over 50%. Since removing the superfluous metal requires a separate work stage, the aim in the industry has always been to achieve a functional antenna, which even in the preliminary stages of production is as NNS (near net shape) as possible.
  • Electrolytic foil manufacture has focused on producing a continuous foil, of which the superfluous metal is etched away for instance in the manufacture of antennas and microcircuits. Etching occurs after the foil has been laminated to for example a PVC substrate. A resist is applied on top of the copper foil, and it is exposed into the desired form through a mask. The exposed resist is developed and the section of copper foil left outside the resist is etched away. After this, the resist is removed from the surface of the remaining copper foil product.
  • the foil product is for example a microcircuit current conductor or a smart label antenna. Now a method has been developed whereby a thin functional copper foil of the desired form is manufactured directly from a strip-like thin copper foil.
  • the necessary steps such as surface treatment, for example inhibiting, are carried out on the strip-like copper foil after which functional copper foils are formed from the strip for instance mechanically, such as by die-cutting, or etching.
  • the copper foil products thus formed are freed from the strip and the residue from die-cutting is taken back to metal melting and reforming of the strip.
  • Copper foil products such as antennas are mounted on a suitable substrate on the production line of the final product.
  • the invention also relates to the products manufactured by this method.
  • antenna Functional copper foils shall hereinafter be referred to only by the term antenna, although the desired product can be something other than a smart label antenna (for example, the conducting part of a microcircuit).
  • the antenna When the antenna is manufactured directly from a thin metal strip before the strip is fixed to a carrier such as a PVC substrate, it is easy to recycle the remaining piece of strip back to copper melting and so to a new manufacturing cycle.
  • the antennas peeled off from the continuous copper strip are mounted on to a plastic/laminate strip for example with a robot on the smart card production line.
  • Thin functional copper or copper alloy foil is produced mechanically such as by die-cutting from copper or copper alloy strip, or by etching, before being fixed to the carrier substrate.
  • Functional copper or copper alloy foil is advantageously a smart label antenna.

Abstract

The invention relates to a method of manufacturing thin functional copper products from finished copper or copper alloy strip and to the product manufactured by this method. Functional copper products such as smart label antennas are produced by separating foils from a continuous thin strip before they are fixed on to a carrier substrate, and the remaining part of the strip is recycled to metal melting. The invention also relates to the product manufactured by this method.

Description

METHOD OF MANUFACTURING THIN FUNCTIONAL COPPER FOILS FROM A CONTINUOUS COPPER FOIL AND THE MANUFACTURED PRODUCT
The present invention relates to a method of manufacturing thin functional copper products from finished copper or copper alloy strip. Functional copper products such as smart label antennas are produced by separating foils from a continuous thin strip before they are fixed on to a carrier substrate, and the remaining part of the strip is recycled to metal melting. The invention also relates to the product manufactured by this method.
Thin foils with good electrical conductivity properties are needed in several technical applications. These include for example inductive sensors and antennas for various kinds of electronic applications. In the present methods, the majority of earlier manufactured metallic foil is etched or cut away in order to obtain the functional form of the foil.
Smart labels (ID tags) are the active (functional) elements of microcircuits, their various memories (ROM, RAM, EPROM etc.) (microchip) and antenna, which are laminated inside plastic or some other suitable surface material. They are activated by the effect of an external RF or UF field and therefore do not need a power source, although they may indeed have one in some cases. Smart labels may be used to identify items (products, people, animals etc.) by utilizing the data stored in the memory of the microcircuits. Identification occurs at a distance, which may vary from a few millimeters to several metres. During identification, the antenna produces an electric current to the microchip in the field of the reader. The labels may be single- use, such as labels on food supply and other consumer goods packaging, and be destroyed after use, or they may be designed for permanent use, such as bank, personal and other ID applications. The typical smart label antenna is 20 - 50 μm thick and has a surface area of 10 - 50 mm x 10 - 100 mm. A printed antenna is generally manufactured using the serigraphy technique. Electroconductivity is created with conductive powder, which can be for instance silver, copper or graphite. In addition to printed antennas, antennas are manufactured at present by winding thin copper wire, by vapourizing, electrolytically or chemically. When making the shape of the antenna coil the unnecessary part of the surface metal manufactured in different ways from continuous copper foil is etched away chemically. The part to be etched away can well be over 50%. Since removing the superfluous metal requires a separate work stage, the aim in the industry has always been to achieve a functional antenna, which even in the preliminary stages of production is as NNS (near net shape) as possible.
In the prior art a method is known for producing a thin foil by electrolytic deposition. In the method there is a rotating cathode drum in an electrolysis tank and a curved anode made of one or more parts on the bottom of the tank. The electrolyte is fed between the anode and the cathode and as a result a copper foil is deposited on the surface of the cathode drum. When the electrodeposited foil rises above the electrolyte, it is removed from the cathode and taken for further processing. The method has been developed since the 1930s and is described for instance in US patent 2,044,415 and US patent application 2002/5363.
Electrolytic foil manufacture has focused on producing a continuous foil, of which the superfluous metal is etched away for instance in the manufacture of antennas and microcircuits. Etching occurs after the foil has been laminated to for example a PVC substrate. A resist is applied on top of the copper foil, and it is exposed into the desired form through a mask. The exposed resist is developed and the section of copper foil left outside the resist is etched away. After this, the resist is removed from the surface of the remaining copper foil product. The foil product is for example a microcircuit current conductor or a smart label antenna. Now a method has been developed whereby a thin functional copper foil of the desired form is manufactured directly from a strip-like thin copper foil. The necessary steps such as surface treatment, for example inhibiting, are carried out on the strip-like copper foil after which functional copper foils are formed from the strip for instance mechanically, such as by die-cutting, or etching. The copper foil products thus formed are freed from the strip and the residue from die-cutting is taken back to metal melting and reforming of the strip. Copper foil products such as antennas are mounted on a suitable substrate on the production line of the final product. The invention also relates to the products manufactured by this method.
The essential features of the invention will be made apparent in the attached claims.
Functional copper foils shall hereinafter be referred to only by the term antenna, although the desired product can be something other than a smart label antenna (for example, the conducting part of a microcircuit).
When the antenna is manufactured directly from a thin metal strip before the strip is fixed to a carrier such as a PVC substrate, it is easy to recycle the remaining piece of strip back to copper melting and so to a new manufacturing cycle. The antennas peeled off from the continuous copper strip are mounted on to a plastic/laminate strip for example with a robot on the smart card production line.
Thin functional copper or copper alloy foil is produced mechanically such as by die-cutting from copper or copper alloy strip, or by etching, before being fixed to the carrier substrate. Functional copper or copper alloy foil is advantageously a smart label antenna.

Claims

1. A method for manufacturing thin functional copper or copper alloy foils from copper or copper alloy foil strip, characterized in that the functional foils are taken off the strip before they are fixed on to a carrier substrate, and the remaining part of the strip is recycled to metal melting.
2. A method according to claim 1 , characterized in that surface treatment such as inhibiting is carried out on the copper or copper alloy strip before the functional foils are formed.
3. A method according to claims 1 or 2, characterized in that the functional foils are taken off the strip by mechanical means such as die-cutting.
4. A method according to any of the previous claims, characterized in that the functional copper foils are mounted on the carrier substrate using a robot on the production line of the end product.
5. A method according to claim 4, characterized in that the product under manufacture is a smart label antenna.
6. A method according to any of the previous claims, characterized in that the carrier substrate is plastic/laminate strip.
7. A thin functional copper or copper alloy foil, characterized in that the functional foil is produced from finished copper or copper alloy foil strip by mechanical means such as die-cutting before being fixed to the carrier substrate. A thin functional copper or copper alloy foil, characterized in that the functional foil is produced from finished copper or copper alloy foil strip by etching before being fixed to the carrier substrate.
A method according to claims 7 or 8, characterized in that the functional copper or copper alloy foil is a smart label antenna.
PCT/FI2003/000169 2002-03-08 2003-03-06 Method of manufacturing thin functional copper foils from a continuous copper foil and the manufactured product WO2003077620A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003208379A AU2003208379A1 (en) 2002-03-08 2003-03-06 Method of manufacturing thin functional copper foils from a continuous copper foil and the manufactured product

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20020445 2002-03-08
FI20020445A FI20020445A (en) 2002-03-08 2002-03-08 Process for making thin functional copper films of a uniform copper film and with the process produced product

Publications (1)

Publication Number Publication Date
WO2003077620A1 true WO2003077620A1 (en) 2003-09-18

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ID=8563469

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI2003/000169 WO2003077620A1 (en) 2002-03-08 2003-03-06 Method of manufacturing thin functional copper foils from a continuous copper foil and the manufactured product

Country Status (4)

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AU (1) AU2003208379A1 (en)
FI (1) FI20020445A (en)
TW (1) TW200304403A (en)
WO (1) WO2003077620A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007027838A1 (en) * 2007-06-13 2008-12-18 Leonhard Kurz Gmbh & Co. Kg Multilayer film element
US9006082B2 (en) 2013-03-15 2015-04-14 Illinois Tool Works Inc. Film transferable logic circuit, and methods for providing film transferable logic circuit
US10178778B2 (en) 2013-03-15 2019-01-08 Illinois Tool Works Inc. Transferable film including readable conductive image, and methods for providing transferable film

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3978375A (en) * 1973-04-20 1976-08-31 Matsushita Electric Industrial Co., Ltd. Wiring unit
US4846922A (en) * 1986-09-29 1989-07-11 Monarch Marking Systems, Inc. Method of making deactivatable tags
EP0992940A2 (en) * 1998-10-02 2000-04-12 Shinko Electric Industries Co. Ltd. Process for manufacturing IC card

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3978375A (en) * 1973-04-20 1976-08-31 Matsushita Electric Industrial Co., Ltd. Wiring unit
US4846922A (en) * 1986-09-29 1989-07-11 Monarch Marking Systems, Inc. Method of making deactivatable tags
EP0992940A2 (en) * 1998-10-02 2000-04-12 Shinko Electric Industries Co. Ltd. Process for manufacturing IC card

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007027838A1 (en) * 2007-06-13 2008-12-18 Leonhard Kurz Gmbh & Co. Kg Multilayer film element
US8350768B2 (en) 2007-06-13 2013-01-08 Leonhard Kurz Stiftung & Co. Kg Multi-layer film element
DE102007027838B4 (en) * 2007-06-13 2021-01-14 Leonhard Kurz Gmbh & Co. Kg Multi-layer film element
US9006082B2 (en) 2013-03-15 2015-04-14 Illinois Tool Works Inc. Film transferable logic circuit, and methods for providing film transferable logic circuit
US10178778B2 (en) 2013-03-15 2019-01-08 Illinois Tool Works Inc. Transferable film including readable conductive image, and methods for providing transferable film

Also Published As

Publication number Publication date
TW200304403A (en) 2003-10-01
FI20020445A (en) 2003-09-09
AU2003208379A1 (en) 2003-09-22
FI20020445A0 (en) 2002-03-08

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