WO2003083952A3 - Device and sensor for receiving light signals and method for the production thereof - Google Patents

Device and sensor for receiving light signals and method for the production thereof Download PDF

Info

Publication number
WO2003083952A3
WO2003083952A3 PCT/DE2002/004655 DE0204655W WO03083952A3 WO 2003083952 A3 WO2003083952 A3 WO 2003083952A3 DE 0204655 W DE0204655 W DE 0204655W WO 03083952 A3 WO03083952 A3 WO 03083952A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
production
light signals
receiving light
wafer
Prior art date
Application number
PCT/DE2002/004655
Other languages
German (de)
French (fr)
Other versions
WO2003083952A2 (en
Inventor
Christian Krummel
Original Assignee
Bosch Gmbh Robert
Christian Krummel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Christian Krummel filed Critical Bosch Gmbh Robert
Publication of WO2003083952A2 publication Critical patent/WO2003083952A2/en
Publication of WO2003083952A3 publication Critical patent/WO2003083952A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

The invention relates to a device (10) for receiving light signals, a sensor (15) and a method for the production of said device (10) and a sensor (15). A detector (45) is provided on the first wafer (40) and a filter (85) is provided on the second wafer (80). The first wafer (40) and the second wafer (80) are hermetically sealed together.
PCT/DE2002/004655 2002-04-03 2002-12-19 Device and sensor for receiving light signals and method for the production thereof WO2003083952A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10214769A DE10214769A1 (en) 2002-04-03 2002-04-03 Device and sensor for recording light signals and manufacturing process
DE10214769.8 2002-04-03

Publications (2)

Publication Number Publication Date
WO2003083952A2 WO2003083952A2 (en) 2003-10-09
WO2003083952A3 true WO2003083952A3 (en) 2004-07-22

Family

ID=28051079

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/004655 WO2003083952A2 (en) 2002-04-03 2002-12-19 Device and sensor for receiving light signals and method for the production thereof

Country Status (2)

Country Link
DE (1) DE10214769A1 (en)
WO (1) WO2003083952A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004002163B4 (en) 2004-01-15 2019-12-24 Robert Bosch Gmbh Gas sensor module and a method for its production
DE102004032176A1 (en) * 2004-07-02 2006-01-26 Robert Bosch Gmbh Coated micromechanical radiator

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668374A (en) * 1986-07-07 1987-05-26 General Motors Corporation Gas sensor and method of fabricating same
EP0632508A2 (en) * 1993-07-01 1995-01-04 Sharp Kabushiki Kaisha Photodetector with a multilayer filter and method of producing the same
JPH0989773A (en) * 1995-09-20 1997-04-04 Horiba Ltd Infrared gas analyzer
US5861545A (en) * 1997-04-30 1999-01-19 Honeywell Inc. Micromachined inferential opto-thermal gas sensor
US6124145A (en) * 1998-01-23 2000-09-26 Instrumentarium Corporation Micromachined gas-filled chambers and method of microfabrication
WO2001056921A2 (en) * 2000-02-02 2001-08-09 Raytheon Company Vacuum package fabrication of microelectromechanical system devices with integrated circuit components

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668374A (en) * 1986-07-07 1987-05-26 General Motors Corporation Gas sensor and method of fabricating same
EP0632508A2 (en) * 1993-07-01 1995-01-04 Sharp Kabushiki Kaisha Photodetector with a multilayer filter and method of producing the same
JPH0989773A (en) * 1995-09-20 1997-04-04 Horiba Ltd Infrared gas analyzer
US5861545A (en) * 1997-04-30 1999-01-19 Honeywell Inc. Micromachined inferential opto-thermal gas sensor
US6124145A (en) * 1998-01-23 2000-09-26 Instrumentarium Corporation Micromachined gas-filled chambers and method of microfabrication
WO2001056921A2 (en) * 2000-02-02 2001-08-09 Raytheon Company Vacuum package fabrication of microelectromechanical system devices with integrated circuit components

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 08 29 August 1997 (1997-08-29) *

Also Published As

Publication number Publication date
WO2003083952A2 (en) 2003-10-09
DE10214769A1 (en) 2003-10-16

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