WO2003090245A8 - Thermionic vacuum diode device with adjustable electrodes - Google Patents

Thermionic vacuum diode device with adjustable electrodes

Info

Publication number
WO2003090245A8
WO2003090245A8 PCT/US2003/007015 US0307015W WO03090245A8 WO 2003090245 A8 WO2003090245 A8 WO 2003090245A8 US 0307015 W US0307015 W US 0307015W WO 03090245 A8 WO03090245 A8 WO 03090245A8
Authority
WO
WIPO (PCT)
Prior art keywords
electrodes
diode device
gap
vacuum diode
separation
Prior art date
Application number
PCT/US2003/007015
Other languages
French (fr)
Other versions
WO2003090245A1 (en
Inventor
Avto Tavkhelidze
Zaza Taliashvili
Original Assignee
Borealis Tech Ltd
Avto Tavkhelidze
Zaza Taliashvili
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/234,498 external-priority patent/US7140102B2/en
Application filed by Borealis Tech Ltd, Avto Tavkhelidze, Zaza Taliashvili filed Critical Borealis Tech Ltd
Priority to AU2003220082A priority Critical patent/AU2003220082A1/en
Priority to US10/507,273 priority patent/US7169006B2/en
Priority to EP03716372A priority patent/EP1509940A4/en
Publication of WO2003090245A1 publication Critical patent/WO2003090245A1/en
Priority to US11/123,700 priority patent/US20050189871A1/en
Publication of WO2003090245A8 publication Critical patent/WO2003090245A8/en
Priority to US11/254,495 priority patent/US7658772B2/en
Priority to US11/598,919 priority patent/US7253549B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J45/00—Discharge tubes functioning as thermionic generators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

In accordance with one embodiment of the present invention, a Gap Diode is disclosed in which a tubular actuating element serves as both a housing for a pair of electrodes (92) and as a means for controlling the separation between the electrode pair. In a preferred embodiment, the tubular actuating element (90) is a quartz piezo-electric tube. In accordance with another embodiment of the present invention, a Gap Diode is disclosed which is fabricated by micromachining techniques in which the separation of the electrodes (202, 206) is controlled by piezo-electric, electrostrictive or magnetostrictive actuators. Preferred embodiments of Gap Diodes include Cool Chips, Power Chips, and photoelectric converters.
PCT/US2003/007015 1997-09-08 2003-03-06 Thermionic vacuum diode device with adjustable electrodes WO2003090245A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AU2003220082A AU2003220082A1 (en) 2002-03-06 2003-03-06 Thermionic vacuum diode device with adjustable electrodes
US10/507,273 US7169006B2 (en) 2001-09-02 2003-03-06 Thermionic vacuum diode device with adjustable electrodes
EP03716372A EP1509940A4 (en) 2002-03-06 2003-03-06 Thermionic vacuum diode device with adjustable electrodes
US11/123,700 US20050189871A1 (en) 2002-03-06 2005-05-05 Thermionic vacuum diode device with adjustable electrodes
US11/254,495 US7658772B2 (en) 1997-09-08 2005-10-20 Process for making electrode pairs
US11/598,919 US7253549B2 (en) 2002-03-06 2006-11-13 Thermionic vacuum diode device with adjustable electrodes

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US36249402P 2002-03-06 2002-03-06
US60/362,494 2002-03-06
US37350802P 2002-04-17 2002-04-17
US60/373,508 2002-04-17
US10/234,498 US7140102B2 (en) 2001-09-02 2002-09-03 Electrode sandwich separation
US10/234,498 2002-09-03

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US10/823,483 Continuation-In-Part US20040189141A1 (en) 1997-09-08 2004-04-12 Thermionic vacuum diode device with adjustable electrodes

Related Child Applications (4)

Application Number Title Priority Date Filing Date
US10507273 A-371-Of-International 2003-03-06
US11/123,700 Continuation-In-Part US20050189871A1 (en) 2002-03-06 2005-05-05 Thermionic vacuum diode device with adjustable electrodes
US11/254,495 Continuation-In-Part US7658772B2 (en) 1997-09-08 2005-10-20 Process for making electrode pairs
US11/598,919 Continuation-In-Part US7253549B2 (en) 2002-03-06 2006-11-13 Thermionic vacuum diode device with adjustable electrodes

Publications (2)

Publication Number Publication Date
WO2003090245A1 WO2003090245A1 (en) 2003-10-30
WO2003090245A8 true WO2003090245A8 (en) 2005-05-06

Family

ID=34527760

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/007015 WO2003090245A1 (en) 1997-09-08 2003-03-06 Thermionic vacuum diode device with adjustable electrodes

Country Status (4)

Country Link
US (2) US7169006B2 (en)
EP (1) EP1509940A4 (en)
AU (1) AU2003220082A1 (en)
WO (1) WO2003090245A1 (en)

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US7169006B2 (en) * 2001-09-02 2007-01-30 Borealis Technical Limited Thermionic vacuum diode device with adjustable electrodes
US20080061114A1 (en) * 2001-09-02 2008-03-13 Zara Taliashvili Method for the fabrication of low temperature vacuum sealed bonds using diffusion welding
US7305839B2 (en) 2004-06-30 2007-12-11 General Electric Company Thermal transfer device and system and method incorporating same
US7260939B2 (en) 2004-12-17 2007-08-28 General Electric Company Thermal transfer device and system and method incorporating same
US7589348B2 (en) * 2005-03-14 2009-09-15 Borealis Technical Limited Thermal tunneling gap diode with integrated spacers and vacuum seal
US7498507B2 (en) 2005-03-16 2009-03-03 General Electric Company Device for solid state thermal transfer and power generation
JP4956929B2 (en) * 2005-07-25 2012-06-20 富士ゼロックス株式会社 Actuator, droplet discharge head, droplet discharge device, and actuator manufacturing method
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US8018117B2 (en) * 2006-01-31 2011-09-13 Tempronics, Inc. Closely spaced electrodes with a uniform gap
US8713195B2 (en) 2006-02-10 2014-04-29 Cisco Technology, Inc. Method and system for streaming digital video content to a client in a digital video network
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NL1032911C2 (en) * 2006-11-21 2008-05-22 Innovy Switched energy conversion device, generator provided therewith and method for manufacturing thereof.
US8816192B1 (en) 2007-02-09 2014-08-26 Borealis Technical Limited Thin film solar cell
US7928630B2 (en) 2007-09-24 2011-04-19 Borealis Technical Limited Monolithic thermionic converter
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US20090205695A1 (en) * 2008-02-15 2009-08-20 Tempronics, Inc. Energy Conversion Device
WO2009129190A1 (en) * 2008-04-14 2009-10-22 University Of Central Florida Research Foundation, Inc. Method for generating, transmitting, and receiving power
JP2009302661A (en) * 2008-06-10 2009-12-24 Toshiba Corp Piezoelectric device
US20110226299A1 (en) * 2009-01-02 2011-09-22 Tarek Makansi Device for energy conversion, electrical switching, and thermal switching
US20100211911A1 (en) * 2009-02-13 2010-08-19 Adrian Logan Method of altering a user interface
US20110277808A1 (en) * 2010-03-22 2011-11-17 Scannanotek Oy Mems solar cell device and array
US8969703B2 (en) 2010-09-13 2015-03-03 Tempronics, Inc. Distributed thermoelectric string and insulating panel
KR20140045408A (en) 2011-07-06 2014-04-16 템프로닉스, 인크. Integration of distributed thermoelectric heating and cooling
US9638442B2 (en) 2012-08-07 2017-05-02 Tempronics, Inc. Medical, topper, pet wireless, and automated manufacturing of distributed thermoelectric heating and cooling
US9590535B2 (en) * 2012-08-17 2017-03-07 The Board Of Trustees Of The Leland Stanford Junior University MEMS-based integrated inverter for wafer-scale thermionic energy converter
KR20150060798A (en) 2012-09-25 2015-06-03 포레시아 오토모티브 시팅, 엘엘씨 Vehicle seat with thermal device
US10228165B2 (en) 2013-11-04 2019-03-12 Tempronics, Inc. Thermoelectric string, panel, and covers for function and durability
JP6265075B2 (en) * 2014-07-18 2018-01-24 株式会社デンソー Heat transfer device, temperature control device, internal combustion engine, internal combustion engine exhaust system, and melting furnace
US10845375B2 (en) * 2016-02-19 2020-11-24 Agjunction Llc Thermal stabilization of inertial measurement units
CN111181444A (en) * 2020-01-11 2020-05-19 东南大学 Hot electron power generation device and working method thereof

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Also Published As

Publication number Publication date
US20070056623A1 (en) 2007-03-15
US7169006B2 (en) 2007-01-30
US20050104512A1 (en) 2005-05-19
EP1509940A1 (en) 2005-03-02
EP1509940A4 (en) 2005-12-07
WO2003090245A1 (en) 2003-10-30
US7253549B2 (en) 2007-08-07
AU2003220082A1 (en) 2003-11-03
AU2003220082A8 (en) 2003-11-03

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