WO2003106952A3 - A micro-mechanical capacitive inductive sensor for wireless detection of relative or absolute pressure - Google Patents

A micro-mechanical capacitive inductive sensor for wireless detection of relative or absolute pressure Download PDF

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Publication number
WO2003106952A3
WO2003106952A3 PCT/US2003/019121 US0319121W WO03106952A3 WO 2003106952 A3 WO2003106952 A3 WO 2003106952A3 US 0319121 W US0319121 W US 0319121W WO 03106952 A3 WO03106952 A3 WO 03106952A3
Authority
WO
WIPO (PCT)
Prior art keywords
micro
transducer
relative
resonance frequency
absolute pressure
Prior art date
Application number
PCT/US2003/019121
Other languages
French (fr)
Other versions
WO2003106952A2 (en
Inventor
Michael Pedersen
Mehmet Ozgur
Michael A Huff
Original Assignee
Corp For Nat Res Initiatives
Michael Pedersen
Mehmet Ozgur
Michael A Huff
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corp For Nat Res Initiatives, Michael Pedersen, Mehmet Ozgur, Michael A Huff filed Critical Corp For Nat Res Initiatives
Priority to AU2003253656A priority Critical patent/AU2003253656A1/en
Publication of WO2003106952A2 publication Critical patent/WO2003106952A2/en
Publication of WO2003106952A3 publication Critical patent/WO2003106952A3/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm

Abstract

A micro-mechanical pressure transducer (100) is disclosed in which a capacitive transducer structure is integrated with an inductor coil (105) to form a LC tank circuit, resonance frequency of which may be detected remotely by imposing an electromagnetic field in the transducer (100). The capacitive transducer structure (100) comprises a conductive movable diaphragm (106), a fixed counter electrode (107), and a predetermined air gap (109) between said diaphragm (106) and electrode (107). The diaphragm (106) deflects in response to an applied pressure differential, leading to a change of capacitance in the structure and hence a shift of resonance frequency of the LC tank circuit. The resonance frequency of the LC circuit can be remotely detected by measuring and determining the corresponding peak in electromagnetic impedance of the transducer (100).
PCT/US2003/019121 2002-06-18 2003-06-18 A micro-mechanical capacitive inductive sensor for wireless detection of relative or absolute pressure WO2003106952A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003253656A AU2003253656A1 (en) 2002-06-18 2003-06-18 A micro-mechanical capacitive inductive sensor for wireless detection of relative or absolute pressure

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US38929202P 2002-06-18 2002-06-18
US60/389,292 2002-06-18
US10/462,811 US7024936B2 (en) 2002-06-18 2003-06-17 Micro-mechanical capacitive inductive sensor for wireless detection of relative or absolute pressure
US10/462,811 2003-06-17

Publications (2)

Publication Number Publication Date
WO2003106952A2 WO2003106952A2 (en) 2003-12-24
WO2003106952A3 true WO2003106952A3 (en) 2005-05-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/019121 WO2003106952A2 (en) 2002-06-18 2003-06-18 A micro-mechanical capacitive inductive sensor for wireless detection of relative or absolute pressure

Country Status (3)

Country Link
US (3) US7024936B2 (en)
AU (1) AU2003253656A1 (en)
WO (1) WO2003106952A2 (en)

Families Citing this family (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6665395B1 (en) * 1998-12-11 2003-12-16 Avaya Technology Corp. Automatic call distribution system using computer network-based communication
US7075295B2 (en) 2003-05-01 2006-07-11 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Magnetic field response sensor for conductive media
US8026729B2 (en) 2003-09-16 2011-09-27 Cardiomems, Inc. System and apparatus for in-vivo assessment of relative position of an implant
EP1677852A4 (en) * 2003-09-16 2009-06-24 Cardiomems Inc Implantable wireless sensor
US20060287602A1 (en) * 2005-06-21 2006-12-21 Cardiomems, Inc. Implantable wireless sensor for in vivo pressure measurement
US7112951B2 (en) * 2004-06-07 2006-09-26 General Electric Company MEMS based current sensor using magnetic-to-mechanical conversion and reference components
US7983785B2 (en) * 2004-06-30 2011-07-19 Instrumar Limited Fibre monitoring apparatus and method
US7159467B2 (en) 2004-10-18 2007-01-09 Silverbrook Research Pty Ltd Pressure sensor with conductive ceramic membrane
US7194901B2 (en) * 2004-10-18 2007-03-27 Silverbrook Research Pty Ltd Pressure sensor with apertured membrane guard
US7093494B2 (en) 2004-10-18 2006-08-22 Silverbrook Research Pty Ltd Micro-electromechanical pressure sensor
US7089797B2 (en) 2004-10-18 2006-08-15 Silverbrook Research Pty Ltd Temperature insensitive pressure sensor
US7089790B2 (en) 2004-10-18 2006-08-15 Silverbrook Research Pty Ltd Pressure sensor with laminated membrane
US7121145B2 (en) 2004-10-18 2006-10-17 Silverbrook Research Pty Ltd Capacitative pressure sensor
US7143652B2 (en) 2004-10-18 2006-12-05 Silverbrook Research Pty Ltd Pressure sensor for high acceleration environment
KR100965325B1 (en) 2004-10-18 2010-06-22 실버브룩 리서치 피티와이 리미티드 Micro Electromechanical Pressure Sensor
US7240560B2 (en) 2004-10-18 2007-07-10 Silverbrook Research Pty Ltd Pressure sensor with remote power source
US7124643B2 (en) 2004-10-18 2006-10-24 Silverbrook Research Pty Ltd Pressure sensor with non-planar membrane
US7089798B2 (en) 2004-10-18 2006-08-15 Silverbrook Research Pty Ltd Pressure sensor with thin membrane
US6968744B1 (en) 2004-10-18 2005-11-29 Silverbrook Research Pty Ltd Capacitative pressure sensor with close electrodes
US7234357B2 (en) 2004-10-18 2007-06-26 Silverbrook Research Pty Ltd Wafer bonded pressure sensor
US7426780B2 (en) * 2004-11-10 2008-09-23 Enpirion, Inc. Method of manufacturing a power module
US20060174712A1 (en) 2005-02-10 2006-08-10 Cardiomems, Inc. Hermetic chamber with electrical feedthroughs
US20060191351A1 (en) * 2005-02-25 2006-08-31 Meehan Peter G Sealed capacitive sensor
US8118748B2 (en) * 2005-04-28 2012-02-21 Medtronic, Inc. Implantable capacitive pressure sensor system and method
AU2012247061B2 (en) * 2005-06-21 2014-07-17 Cardiomems, Inc. Implantable wireless sensor for in vivo pressure measurement
AU2006262287A1 (en) * 2005-06-21 2007-01-04 Cardiomems, Inc. Method of manufacturing implantable wireless sensor for in vivo pressure measurement
CN1901161B (en) * 2005-07-22 2010-10-27 米辑电子股份有限公司 Method for fabricating a circuitry component by continuous electroplating and circuitry component structure
US20070074579A1 (en) * 2005-10-03 2007-04-05 Honeywell International Inc. Wireless pressure sensor and method of forming same
US7219021B2 (en) * 2005-09-13 2007-05-15 Honeywell International Inc. Multiple wireless sensors for dialysis application
US7466143B2 (en) * 2005-09-16 2008-12-16 General Electric Company Clearance measurement systems and methods of operation
US8701272B2 (en) 2005-10-05 2014-04-22 Enpirion, Inc. Method of forming a power module with a magnetic device having a conductive clip
US7688172B2 (en) * 2005-10-05 2010-03-30 Enpirion, Inc. Magnetic device having a conductive clip
US8631560B2 (en) * 2005-10-05 2014-01-21 Enpirion, Inc. Method of forming a magnetic device having a conductive clip
US7679162B2 (en) * 2005-12-19 2010-03-16 Silicon Laboratories Inc. Integrated current sensor package
EP1806569A1 (en) * 2006-01-09 2007-07-11 Infineon Technologies SensoNor AS Inductive-capactive sensor
US7638988B2 (en) * 2006-02-21 2009-12-29 Virginia Tech Intellectual Properties, Inc. Co-fired ceramic inductors with variable inductance, and voltage regulator having same
US7932800B2 (en) * 2006-02-21 2011-04-26 Virginia Tech Intellectual Properties, Inc. Method and apparatus for three-dimensional integration of embedded power module
US7990132B2 (en) * 2006-06-30 2011-08-02 Silicon Laboratories Inc. Current sensor including an integrated circuit die including a first and second coil
US7652586B2 (en) * 2006-08-15 2010-01-26 General Electric Company Early fouling detection
US7636053B2 (en) * 2006-09-20 2009-12-22 Toyota Motor Engineering & Manufacturing North America, Inc. Article and method for monitoring temperature and pressure within a pressurized gas cylinder
US7404331B2 (en) * 2006-09-27 2008-07-29 General Electric Company Sensor assembly, transformers and methods of manufacture
US8127618B1 (en) 2007-05-18 2012-03-06 Pacesetter, Inc. Implantable micro-electromechanical system sensor
US8177474B2 (en) * 2007-06-26 2012-05-15 General Electric Company System and method for turbine engine clearance control with rub detection
US8531193B2 (en) * 2007-07-11 2013-09-10 Marimils Oy Method and device for capacitive detection of objects
US7920042B2 (en) * 2007-09-10 2011-04-05 Enpirion, Inc. Micromagnetic device and method of forming the same
US7980145B2 (en) * 2007-12-27 2011-07-19 Y Point Capital, Inc Microelectromechanical capacitive device
US7829366B2 (en) * 2008-02-29 2010-11-09 Freescale Semiconductor, Inc. Microelectromechanical systems component and method of making same
US7728578B2 (en) * 2008-05-15 2010-06-01 Silicon Laboratories Inc. Method and apparatus for high current measurement
JP4843657B2 (en) * 2008-09-30 2011-12-21 アルプス電気株式会社 Magnetic disk unit
US8339802B2 (en) * 2008-10-02 2012-12-25 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
US9054086B2 (en) * 2008-10-02 2015-06-09 Enpirion, Inc. Module having a stacked passive element and method of forming the same
US8266793B2 (en) * 2008-10-02 2012-09-18 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
US9126271B2 (en) * 2008-10-07 2015-09-08 Wisconsin Alumni Research Foundation Method for embedding thin film sensor in a material
US8467548B2 (en) * 2009-04-07 2013-06-18 The United States Of America As Represented By The Secretary Of The Navy Miniature micro-electromechanical system (MEMS) based directional sound sensor
FR2947629B1 (en) * 2009-07-06 2012-03-30 Tronic S Microsystems PRESSURE MEASURING DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2355138B1 (en) * 2010-01-28 2016-08-24 Canon Kabushiki Kaisha Liquid composition, method of producing silicon substrate, and method of producing liquid discharge head substrate
US20110188646A1 (en) * 2010-02-02 2011-08-04 Brian Taylor Adaptive Communication Device with Telephonic Interface Capabilities
DE102010022204B4 (en) * 2010-05-20 2016-03-31 Epcos Ag Electric component with flat design and manufacturing process
DE102010061795A1 (en) * 2010-11-23 2012-05-24 Robert Bosch Gmbh Method for producing a micromechanical membrane structure and MEMS device
US9775982B2 (en) 2010-12-29 2017-10-03 Medtronic, Inc. Implantable medical device fixation
US8578795B2 (en) 2011-03-31 2013-11-12 DePuy Synthes Products, LLC Monitoring and recording implantable silicon active pressure transducer
JP2013028155A (en) * 2011-06-21 2013-02-07 Canon Inc Method for producing liquid-discharge-head substrate
US20130152694A1 (en) * 2011-11-01 2013-06-20 Ilkka Urvas Sensor with vacuum cavity and method of fabrication
US20130160567A1 (en) * 2011-12-21 2013-06-27 Canon Kabushiki Kaisha Force sensor
US9717421B2 (en) 2012-03-26 2017-08-01 Medtronic, Inc. Implantable medical device delivery catheter with tether
US10485435B2 (en) 2012-03-26 2019-11-26 Medtronic, Inc. Pass-through implantable medical device delivery catheter with removeable distal tip
DE102013001085A1 (en) * 2013-01-23 2014-07-24 Abb Technology Ag Inductive pressure sensor for measuring pressure in e.g. gas, has membrane which is concentrically coated with thin coating which is formed of amorphous metal alloy having high magnetic permeability
US9848775B2 (en) 2013-05-22 2017-12-26 The Board Of Trustees Of The Leland Stanford Junior University Passive and wireless pressure sensor
US9962084B2 (en) * 2013-06-15 2018-05-08 Purdue Research Foundation Wireless interstitial fluid pressure sensor
US9738511B2 (en) * 2013-09-13 2017-08-22 Invensense, Inc. Reduction of chipping damage to MEMS structure
DE102014200500A1 (en) * 2014-01-14 2015-07-16 Robert Bosch Gmbh Micromechanical pressure sensor device and corresponding manufacturing method
CN103926026A (en) * 2014-05-04 2014-07-16 厦门大学 Built-in high-temperature wireless pressure sensor
US9939331B2 (en) 2014-05-21 2018-04-10 Infineon Technologies Ag System and method for a capacitive thermometer
GB2523266B (en) * 2014-07-15 2016-09-21 Univ Bristol Wireless sensor
KR101463429B1 (en) * 2014-08-20 2014-11-20 한국지질자원연구원 Apparatus of detecting infrasound
FR3025311B1 (en) 2014-08-26 2016-12-30 Commissariat Energie Atomique PRESSURE SENSOR OF A FLUID
US10458860B2 (en) * 2014-10-30 2019-10-29 3M Innovative Properties Company Capacitive temperature sensing for electrical conductor
KR101811214B1 (en) * 2015-05-29 2017-12-22 고려대학교 세종산학협력단 Flexible pressure sensor using an amorphous metal, and flexible bimodal sensor for simultaneously sensing pressure and temperature
US9490620B1 (en) * 2015-09-18 2016-11-08 HGST Netherlands B.V. Low permeability electrical feed-through
DE102016104760A1 (en) 2015-12-22 2017-06-22 Endress + Hauser Gmbh + Co. Kg Pressure measuring device
DE202016101491U1 (en) 2016-03-17 2016-04-04 Endress + Hauser Gmbh + Co. Kg Pressure measuring device
DE102016105001A1 (en) 2016-03-17 2017-09-21 Endress + Hauser Gmbh + Co. Kg Pressure measuring device
KR101807062B1 (en) * 2016-11-08 2018-01-18 현대자동차 주식회사 Microphone and method manufacturing the same
DE102017205054A1 (en) 2017-03-24 2018-10-18 Zf Friedrichshafen Ag Device for measuring pressure
DE102017109183A1 (en) 2017-04-28 2018-10-31 Endress+Hauser SE+Co. KG Pressure measuring device
CN108362406A (en) * 2017-06-08 2018-08-03 深圳信息职业技术学院 Inductance pressure transducer and pressure measurement circuitry
US10395694B1 (en) 2017-08-09 2019-08-27 Western Digital Technologies, Inc. Low permeability electrical feed-through
US10424345B1 (en) 2018-06-11 2019-09-24 Western Digital Technologies, Inc. Misalignment-tolerant flexible type electrical feed-through
US10594100B1 (en) 2018-06-11 2020-03-17 Western Digital Technologies, Inc. Flexible type electrical feed-through connector assembly
US11015994B2 (en) 2018-08-22 2021-05-25 Rosemount Aerospace Inc. Differential MEMS pressure sensors with a ceramic header body and methods of making differential MEMS pressure sensors
US10629244B1 (en) 2018-11-07 2020-04-21 Western Digital Technologies, Inc. Sealed electrical feed-through having reduced leak rate
DE102019111695A1 (en) * 2019-05-06 2020-11-12 Endress+Hauser SE+Co. KG Measuring device
DE102020100244A1 (en) 2020-01-08 2021-07-08 X-FAB Global Services GmbH Method for producing a membrane component and a membrane component
CN112683428B (en) * 2020-11-26 2022-07-01 南京高华科技股份有限公司 MEMS inductive pressure sensor and preparation method thereof
CN112683427B (en) * 2020-11-26 2022-04-29 南京高华科技股份有限公司 LC composite MEMS pressure sensor and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6532834B1 (en) * 1999-08-06 2003-03-18 Setra Systems, Inc. Capacitive pressure sensor having encapsulated resonating components
US20030230145A1 (en) * 1999-08-06 2003-12-18 Pinto Gino A. Capacitive pressure sensor having encapsulated resonating components

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3916365A (en) 1972-01-31 1975-10-28 Bailey Motor Company Integrated single crystal pressure transducer
US3893228A (en) 1972-10-02 1975-07-08 Motorola Inc Silicon pressure sensor
US4203327A (en) 1978-06-29 1980-05-20 Honeywell Inc. Piezoresistive silicon strain sensors and pressure transducers incorporating them
JPS5516228A (en) 1978-07-21 1980-02-04 Hitachi Ltd Capacity type sensor
US4625561A (en) 1984-12-06 1986-12-02 Ford Motor Company Silicon capacitive pressure sensor and method of making
US4763098A (en) 1985-04-08 1988-08-09 Honeywell Inc. Flip-chip pressure transducer
US4881410A (en) 1987-06-01 1989-11-21 The Regents Of The University Of Michigan Ultraminiature pressure sensor and method of making same
US5936164A (en) 1997-08-27 1999-08-10 Delco Electronics Corporation All-silicon capacitive pressure sensor
KR100300527B1 (en) 1998-09-03 2001-10-27 윤덕용 Remote pressure monitoring device of sealed type and manufacture method for the same
DE10226201A1 (en) 2002-06-12 2003-12-24 Ifac Gmbh & Co Kg Inst Fuer An Ether alcohols as solvents and emulsions and dispersions containing them

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6532834B1 (en) * 1999-08-06 2003-03-18 Setra Systems, Inc. Capacitive pressure sensor having encapsulated resonating components
US20030230145A1 (en) * 1999-08-06 2003-12-18 Pinto Gino A. Capacitive pressure sensor having encapsulated resonating components
US20040035211A1 (en) * 1999-08-06 2004-02-26 Pinto Gino A. Capacitive pressure sensor having encapsulated resonating components
US6789429B2 (en) * 1999-08-06 2004-09-14 Setra System, Inc. Capacitive pressure sensor having encapsulated resonating components

Also Published As

Publication number Publication date
AU2003253656A8 (en) 2003-12-31
US7188530B2 (en) 2007-03-13
AU2003253656A1 (en) 2003-12-31
US20050028601A1 (en) 2005-02-10
WO2003106952A2 (en) 2003-12-24
US20050103112A1 (en) 2005-05-19
US7017419B2 (en) 2006-03-28
US20040057589A1 (en) 2004-03-25
US7024936B2 (en) 2006-04-11

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