WO2004001837A3 - Methods of forming electronic structures including conductive shunt layers and related structures - Google Patents
Methods of forming electronic structures including conductive shunt layers and related structures Download PDFInfo
- Publication number
- WO2004001837A3 WO2004001837A3 PCT/US2003/020790 US0320790W WO2004001837A3 WO 2004001837 A3 WO2004001837 A3 WO 2004001837A3 US 0320790 W US0320790 W US 0320790W WO 2004001837 A3 WO2004001837 A3 WO 2004001837A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- conductive shunt
- methods
- including conductive
- structures
- Prior art date
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003256360A AU2003256360A1 (en) | 2002-06-25 | 2003-06-23 | Methods of forming electronic structures including conductive shunt layers and related structures |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39151102P | 2002-06-25 | 2002-06-25 | |
US60/391,511 | 2002-06-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004001837A2 WO2004001837A2 (en) | 2003-12-31 |
WO2004001837A3 true WO2004001837A3 (en) | 2004-07-08 |
Family
ID=30000713
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/020790 WO2004001837A2 (en) | 2002-06-25 | 2003-06-23 | Methods of forming electronic structures including conductive shunt layers and related structures |
Country Status (4)
Country | Link |
---|---|
US (4) | US6960828B2 (en) |
AU (1) | AU2003256360A1 (en) |
TW (1) | TWI306654B (en) |
WO (1) | WO2004001837A2 (en) |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2002228926A1 (en) * | 2000-11-10 | 2002-05-21 | Unitive Electronics, Inc. | Methods of positioning components using liquid prime movers and related structures |
WO2004001837A2 (en) * | 2002-06-25 | 2003-12-31 | Unitive International Limited | Methods of forming electronic structures including conductive shunt layers and related structures |
US7531898B2 (en) * | 2002-06-25 | 2009-05-12 | Unitive International Limited | Non-Circular via holes for bumping pads and related structures |
US7547623B2 (en) * | 2002-06-25 | 2009-06-16 | Unitive International Limited | Methods of forming lead free solder bumps |
TWI225899B (en) * | 2003-02-18 | 2005-01-01 | Unitive Semiconductor Taiwan C | Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer |
US6822327B1 (en) * | 2003-06-13 | 2004-11-23 | Delphi Technologies, Inc. | Flip-chip interconnected with increased current-carrying capability |
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Also Published As
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AU2003256360A1 (en) | 2004-01-06 |
US20110084392A1 (en) | 2011-04-14 |
AU2003256360A8 (en) | 2004-01-06 |
US7297631B2 (en) | 2007-11-20 |
US8294269B2 (en) | 2012-10-23 |
TW200403827A (en) | 2004-03-01 |
US20040053483A1 (en) | 2004-03-18 |
US20060009023A1 (en) | 2006-01-12 |
WO2004001837A2 (en) | 2003-12-31 |
US7879715B2 (en) | 2011-02-01 |
US20080026560A1 (en) | 2008-01-31 |
TWI306654B (en) | 2009-02-21 |
US6960828B2 (en) | 2005-11-01 |
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