WO2004005560A2 - Copper alloy containing cobalt, nickel, and silicon - Google Patents
Copper alloy containing cobalt, nickel, and silicon Download PDFInfo
- Publication number
- WO2004005560A2 WO2004005560A2 PCT/US2003/020664 US0320664W WO2004005560A2 WO 2004005560 A2 WO2004005560 A2 WO 2004005560A2 US 0320664 W US0320664 W US 0320664W WO 2004005560 A2 WO2004005560 A2 WO 2004005560A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper
- alloy
- temperature
- nickel
- copper alloy
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/610,433 US7182823B2 (en) | 2002-07-05 | 2003-06-30 | Copper alloy containing cobalt, nickel and silicon |
EP03763072.0A EP1520054B8 (en) | 2002-07-05 | 2003-07-01 | Copper alloy containing cobalt, nickel, and silicon |
CA2490799A CA2490799C (en) | 2002-07-05 | 2003-07-01 | Copper alloy containing cobalt, nickel, and silicon |
MXPA05000148A MXPA05000148A (en) | 2002-07-05 | 2003-07-01 | Copper alloy containing cobalt, nickel, and silicon. |
JP2004519717A JP2005532477A (en) | 2002-07-05 | 2003-07-01 | Copper alloy containing cobalt, nickel and silicon |
ES03763072.0T ES2605354T3 (en) | 2002-07-05 | 2003-07-01 | Copper alloy containing cobalt, nickel and silicon |
AU2003247661A AU2003247661A1 (en) | 2002-07-05 | 2003-07-01 | Copper alloy containing cobalt, nickel, and silicon |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39376502P | 2002-07-05 | 2002-07-05 | |
US60/393,765 | 2002-07-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004005560A2 true WO2004005560A2 (en) | 2004-01-15 |
WO2004005560A3 WO2004005560A3 (en) | 2004-06-17 |
Family
ID=30115641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/020664 WO2004005560A2 (en) | 2002-07-05 | 2003-07-01 | Copper alloy containing cobalt, nickel, and silicon |
Country Status (11)
Country | Link |
---|---|
US (4) | US7182823B2 (en) |
EP (1) | EP1520054B8 (en) |
JP (3) | JP2005532477A (en) |
KR (2) | KR20050061401A (en) |
CN (4) | CN101041868A (en) |
AU (1) | AU2003247661A1 (en) |
CA (1) | CA2490799C (en) |
ES (1) | ES2605354T3 (en) |
MX (1) | MXPA05000148A (en) |
TW (1) | TWI327601B (en) |
WO (1) | WO2004005560A2 (en) |
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EP1997920A3 (en) * | 2007-05-31 | 2009-07-01 | The Furukawa Electric Co., Ltd. | Copper alloy for electric and electronic equipments |
EP2194151A1 (en) * | 2007-09-28 | 2010-06-09 | Nippon Mining & Metals Co., Ltd. | Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy |
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US9460825B2 (en) | 2010-05-31 | 2016-10-04 | Jx Nippon Mining & Metals Corporation | Cu-Co-Si-based copper alloy for electronic materials, and method of manufacturing same |
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US7182823B2 (en) * | 2002-07-05 | 2007-02-27 | Olin Corporation | Copper alloy containing cobalt, nickel and silicon |
US7291232B2 (en) * | 2003-09-23 | 2007-11-06 | Luvata Oy | Process for high strength, high conductivity copper alloy of Cu-Ni-Si group |
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US7557032B2 (en) * | 2005-09-01 | 2009-07-07 | Micron Technology, Inc. | Silicided recessed silicon |
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- 2003-07-01 CN CNA2007100890982A patent/CN101041868A/en active Pending
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- 2003-07-01 KR KR1020047021553A patent/KR20050061401A/en active Search and Examination
- 2003-07-01 KR KR1020087030326A patent/KR20080111170A/en active Search and Examination
- 2003-07-01 CA CA2490799A patent/CA2490799C/en not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
---|---|
US7182823B2 (en) | 2007-02-27 |
AU2003247661A8 (en) | 2004-01-23 |
KR20080111170A (en) | 2008-12-22 |
EP1520054A2 (en) | 2005-04-06 |
CN1671877A (en) | 2005-09-21 |
CN101792872A (en) | 2010-08-04 |
US20070131315A1 (en) | 2007-06-14 |
WO2004005560A3 (en) | 2004-06-17 |
TWI327601B (en) | 2010-07-21 |
CA2490799A1 (en) | 2004-01-15 |
EP1520054B1 (en) | 2016-10-26 |
CN102816980A (en) | 2012-12-12 |
MXPA05000148A (en) | 2005-04-11 |
CN101792872B (en) | 2016-03-16 |
US20040079456A1 (en) | 2004-04-29 |
KR20050061401A (en) | 2005-06-22 |
CN101041868A (en) | 2007-09-26 |
CA2490799C (en) | 2012-01-24 |
ES2605354T3 (en) | 2017-03-14 |
US8257515B2 (en) | 2012-09-04 |
JP2005532477A (en) | 2005-10-27 |
EP1520054A4 (en) | 2007-03-07 |
US8430979B2 (en) | 2013-04-30 |
US20140014239A1 (en) | 2014-01-16 |
TW200419001A (en) | 2004-10-01 |
EP1520054B8 (en) | 2017-07-26 |
CN1323188C (en) | 2007-06-27 |
JP2011157630A (en) | 2011-08-18 |
JP2014095150A (en) | 2014-05-22 |
AU2003247661A1 (en) | 2004-01-23 |
US20060076090A1 (en) | 2006-04-13 |
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