WO2004005560A3 - Copper alloy containing cobalt, nickel, and silicon - Google Patents

Copper alloy containing cobalt, nickel, and silicon Download PDF

Info

Publication number
WO2004005560A3
WO2004005560A3 PCT/US2003/020664 US0320664W WO2004005560A3 WO 2004005560 A3 WO2004005560 A3 WO 2004005560A3 US 0320664 W US0320664 W US 0320664W WO 2004005560 A3 WO2004005560 A3 WO 2004005560A3
Authority
WO
WIPO (PCT)
Prior art keywords
alloy
copper
temperature
nickel
silicon
Prior art date
Application number
PCT/US2003/020664
Other languages
French (fr)
Other versions
WO2004005560A2 (en
Inventor
Frank N Mandigo
Peter W Robinson
Derek E Tyler
Andreas Boegel
Hans-Achim Kuhn
Frank M Keppeler
Joerg Seeger
Original Assignee
Olin Corp
Wieland Werke Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=30115641&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2004005560(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to US10/610,433 priority Critical patent/US7182823B2/en
Application filed by Olin Corp, Wieland Werke Ag filed Critical Olin Corp
Priority to JP2004519717A priority patent/JP2005532477A/en
Priority to CA2490799A priority patent/CA2490799C/en
Priority to AU2003247661A priority patent/AU2003247661A1/en
Priority to EP03763072.0A priority patent/EP1520054B8/en
Priority to ES03763072.0T priority patent/ES2605354T3/en
Priority to MXPA05000148A priority patent/MXPA05000148A/en
Publication of WO2004005560A2 publication Critical patent/WO2004005560A2/en
Publication of WO2004005560A3 publication Critical patent/WO2004005560A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)

Abstract

A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, with a total nickel plus cobalt content of from 1.7% to 4.3%, from 0.5% to 1.5% of silicon with a ratio of (Ni+Co)/Si of between 3.5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1 % of silver. A process to manufacture the alloys of the invention as well as other copper-nickel-silicon alloys includes the sequential steps of (a). casting (10) the copper alloy; (b). hot working (12) the cast copper-base alloy to effect a first reduction in cross-sectional area; (c). solutionizing (14) the cast copper-base alloy at a temperature and for a time effective to substantially form a single phase alloy; (d). first age annealing (18) the alloy at a temperature and for a time effective to precipitate an amount of a second phase effective to form a multi-phase alloy having silicides; (e). cold working (20) the multi-phase alloy to effect a second reduction in cross-sectional area; and (f). second age annealing (22) the multiphase alloy at a temperature and for a time effective to precipitate additional silicides thereby raising conductivity, wherein the second age annealing temperature is less than the first age annealing temperature.
PCT/US2003/020664 2002-07-05 2003-07-01 Copper alloy containing cobalt, nickel, and silicon WO2004005560A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
US10/610,433 US7182823B2 (en) 2002-07-05 2003-06-30 Copper alloy containing cobalt, nickel and silicon
JP2004519717A JP2005532477A (en) 2002-07-05 2003-07-01 Copper alloy containing cobalt, nickel and silicon
CA2490799A CA2490799C (en) 2002-07-05 2003-07-01 Copper alloy containing cobalt, nickel, and silicon
AU2003247661A AU2003247661A1 (en) 2002-07-05 2003-07-01 Copper alloy containing cobalt, nickel, and silicon
EP03763072.0A EP1520054B8 (en) 2002-07-05 2003-07-01 Copper alloy containing cobalt, nickel, and silicon
ES03763072.0T ES2605354T3 (en) 2002-07-05 2003-07-01 Copper alloy containing cobalt, nickel and silicon
MXPA05000148A MXPA05000148A (en) 2002-07-05 2003-07-01 Copper alloy containing cobalt, nickel, and silicon.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39376502P 2002-07-05 2002-07-05
US60/393,765 2002-07-05

Publications (2)

Publication Number Publication Date
WO2004005560A2 WO2004005560A2 (en) 2004-01-15
WO2004005560A3 true WO2004005560A3 (en) 2004-06-17

Family

ID=30115641

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/020664 WO2004005560A2 (en) 2002-07-05 2003-07-01 Copper alloy containing cobalt, nickel, and silicon

Country Status (11)

Country Link
US (4) US7182823B2 (en)
EP (1) EP1520054B8 (en)
JP (3) JP2005532477A (en)
KR (2) KR20080111170A (en)
CN (4) CN101792872B (en)
AU (1) AU2003247661A1 (en)
CA (1) CA2490799C (en)
ES (1) ES2605354T3 (en)
MX (1) MXPA05000148A (en)
TW (1) TWI327601B (en)
WO (1) WO2004005560A2 (en)

Families Citing this family (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7182823B2 (en) * 2002-07-05 2007-02-27 Olin Corporation Copper alloy containing cobalt, nickel and silicon
US7291232B2 (en) * 2003-09-23 2007-11-06 Luvata Oy Process for high strength, high conductivity copper alloy of Cu-Ni-Si group
CN101166840B (en) * 2005-02-28 2012-07-18 古河电气工业株式会社 Copper alloy
US8317948B2 (en) 2005-03-24 2012-11-27 Jx Nippon Mining & Metals Corporation Copper alloy for electronic materials
JP4068626B2 (en) * 2005-03-31 2008-03-26 日鉱金属株式会社 Cu-Ni-Si-Co-Cr-based copper alloy for electronic materials and method for producing the same
US7120046B1 (en) 2005-05-13 2006-10-10 Micron Technology, Inc. Memory array with surrounding gate access transistors and capacitors with global and staggered local bit lines
US7371627B1 (en) 2005-05-13 2008-05-13 Micron Technology, Inc. Memory array with ultra-thin etched pillar surround gate access transistors and buried data/bit lines
US7888721B2 (en) 2005-07-06 2011-02-15 Micron Technology, Inc. Surround gate access transistors with grown ultra-thin bodies
US7768051B2 (en) 2005-07-25 2010-08-03 Micron Technology, Inc. DRAM including a vertical surround gate transistor
US7696567B2 (en) 2005-08-31 2010-04-13 Micron Technology, Inc Semiconductor memory device
US7557032B2 (en) 2005-09-01 2009-07-07 Micron Technology, Inc. Silicided recessed silicon
US7687342B2 (en) * 2005-09-01 2010-03-30 Micron Technology, Inc. Method of manufacturing a memory device
US7416943B2 (en) * 2005-09-01 2008-08-26 Micron Technology, Inc. Peripheral gate stacks and recessed array gates
JP2007169765A (en) * 2005-12-26 2007-07-05 Furukawa Electric Co Ltd:The Copper alloy and its production method
EP2048251B1 (en) * 2006-05-26 2012-01-25 Kabushiki Kaisha Kobe Seiko Sho Copper alloy having high strength, high electric conductivity and excellent bending workability
JP5355865B2 (en) 2006-06-01 2013-11-27 古河電気工業株式会社 Copper alloy wire manufacturing method and copper alloy wire
EP1967596B1 (en) * 2007-02-13 2010-06-16 Dowa Metaltech Co., Ltd. Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
US20080190523A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP4357536B2 (en) * 2007-02-16 2009-11-04 株式会社神戸製鋼所 Copper alloy sheet for electrical and electronic parts with excellent strength and formability
JP4934493B2 (en) * 2007-05-09 2012-05-16 古河電気工業株式会社 Heat treatment method for aging precipitation type alloy strip
US8287669B2 (en) * 2007-05-31 2012-10-16 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic equipments
JP4981748B2 (en) * 2007-05-31 2012-07-25 古河電気工業株式会社 Copper alloy for electrical and electronic equipment
US7923373B2 (en) 2007-06-04 2011-04-12 Micron Technology, Inc. Pitch multiplication using self-assembling materials
WO2009041292A1 (en) * 2007-09-28 2009-04-02 Nippon Mining & Metals Co., Ltd. Copper foil for printed circuit and copper clad laminate
EP2194151B1 (en) * 2007-09-28 2014-08-13 JX Nippon Mining & Metals Corporation Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy
CN101874122A (en) * 2007-10-10 2010-10-27 Gbc金属有限公司 Copper tin nickel phosphorus alloys with improved strength and formability
KR20100080617A (en) * 2007-11-01 2010-07-09 후루카와 덴키 고교 가부시키가이샤 Conductor material for electronic device and electric wire for wiring using the same
CN101849027B (en) * 2007-11-05 2013-05-15 古河电气工业株式会社 Copper alloy sheet material
US20090183803A1 (en) * 2007-12-21 2009-07-23 Mutschler Ralph A Copper-nickel-silicon alloys
CN101952465B (en) * 2008-01-31 2012-09-19 古河电气工业株式会社 Copper alloy material for electric/electronic component and method for manufacturing the copper alloy material
WO2009116649A1 (en) * 2008-03-21 2009-09-24 古河電気工業株式会社 Copper alloy material for electric and electronic components
KR101331339B1 (en) 2008-12-01 2013-11-19 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Cu-ni-si-co based copper ally for electronic materials and manufacturing method therefor
JP5261161B2 (en) * 2008-12-12 2013-08-14 Ｊｘ日鉱日石金属株式会社 Ni-Si-Co-based copper alloy and method for producing the same
JP4708485B2 (en) 2009-03-31 2011-06-22 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si based copper alloy for electronic materials and method for producing the same
JP5506806B2 (en) 2009-09-28 2014-05-28 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP5578827B2 (en) * 2009-10-13 2014-08-27 Ｄｏｗａメタルテック株式会社 High-strength copper alloy sheet and manufacturing method thereof
JP4677505B1 (en) 2010-03-31 2011-04-27 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP6045635B2 (en) * 2010-04-05 2016-12-14 Ｄｏｗａメタルテック株式会社 Method for producing copper alloy sheet
JP5961335B2 (en) * 2010-04-05 2016-08-02 Ｄｏｗａメタルテック株式会社 Copper alloy sheet and electrical / electronic components
JP4830035B2 (en) 2010-04-14 2011-12-07 Ｊｘ日鉱日石金属株式会社 Cu-Si-Co alloy for electronic materials and method for producing the same
JP4672804B1 (en) * 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si based copper alloy for electronic materials and method for producing the same
JP4708497B1 (en) 2010-06-03 2011-06-22 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si alloy plate and method for producing the same
JP4834781B1 (en) 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si alloy for electronic materials
JP2012072470A (en) 2010-09-29 2012-04-12 Jx Nippon Mining & Metals Corp Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING THE SAME
CN102560191A (en) * 2010-12-09 2012-07-11 北京有色金属研究总院 High-performance elastic copper alloy and preparation and processing method thereof
JP5441876B2 (en) * 2010-12-13 2014-03-12 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
CN102011075B (en) * 2010-12-25 2012-09-05 河南科技大学 Preparing method for non-online solid solution of copper alloy slab band
JP5451674B2 (en) 2011-03-28 2014-03-26 Ｊｘ日鉱日石金属株式会社 Cu-Si-Co based copper alloy for electronic materials and method for producing the same
JP4799701B1 (en) * 2011-03-29 2011-10-26 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si based copper alloy strip for electronic materials and method for producing the same
CN102220514B (en) * 2011-06-13 2012-12-12 苏州撼力铜合金材料有限公司 Special low-lead copper alloy using silicon to replace lead for bathroom
CN102418003B (en) * 2011-11-24 2013-05-08 中铝洛阳铜业有限公司 Processing method of nickel-chromium-silicon-bronze alloy
CN103173649A (en) * 2011-12-21 2013-06-26 北京有色金属研究总院 Anti-stress relaxation beryllium free copper alloy with high strength and high elasticity as well as preparation and processing methods thereof
JP5802150B2 (en) * 2012-02-24 2015-10-28 株式会社神戸製鋼所 Copper alloy
CN102996865B (en) * 2012-09-29 2015-06-17 铜陵国方水暖科技有限责任公司 Method for casting valve body of ball check valve
KR101274063B1 (en) * 2013-01-22 2013-06-12 한국기계연구원 A metal matrix composite with two-way shape precipitation and method for manufacturing thereof
JP5647703B2 (en) * 2013-02-14 2015-01-07 Ｄｏｗａメタルテック株式会社 High-strength Cu-Ni-Co-Si-based copper alloy sheet, its manufacturing method, and current-carrying parts
JP5773015B2 (en) 2013-05-24 2015-09-02 三菱マテリアル株式会社 Copper alloy wire
CN103352139B (en) * 2013-08-02 2015-04-08 贵州合润铝业高新科技发展有限公司 Copper-nickel alloy
KR101708285B1 (en) * 2015-07-29 2017-02-20 창원대학교 산학협력단 Metal composite material including an aligned precipitation and method of manufacturing the metal composite material
JP6246173B2 (en) * 2015-10-05 2017-12-13 Ｊｘ金属株式会社 Cu-Co-Ni-Si alloy for electronic parts
CN106636734B (en) * 2015-10-30 2019-01-15 北京有色金属研究总院 High-intensitive, highly conductive, high resistance to stress relaxation copper alloy elastic material and preparation method thereof
CN105401109A (en) * 2015-11-19 2016-03-16 张家港市广大机械锻造有限公司 Heat treatment process for cunico
KR101733409B1 (en) 2016-11-11 2017-05-10 일진머티리얼즈 주식회사 Electrolytic Copper Foil of secondary battery and manufacturing method thereof
KR102648370B1 (en) * 2017-02-04 2024-03-15 마테리온 코포레이션 Copper-nickel-tin alloy
DE102017001846A1 (en) * 2017-02-25 2018-08-30 Wieland-Werke Ag Sliding element made of a copper alloy
TWI768097B (en) * 2017-08-10 2022-06-21 日商田中貴金屬工業股份有限公司 High-strength and high-conductivity copper alloy sheet and method for producing the same
CN108642419A (en) * 2018-05-31 2018-10-12 太原晋西春雷铜业有限公司 A kind of corson alloy band and preparation method thereof that bending is excellent
KR20210149830A (en) * 2019-04-12 2021-12-09 마테리온 코포레이션 Copper alloys having high strength and high conductivity and methods for producing such copper alloys
KR102021442B1 (en) * 2019-07-26 2019-09-16 주식회사 풍산 A method of manufacturing a copper alloy sheet material excellent in strength and conductivity and a copper alloy sheet material produced therefrom
JP7215735B2 (en) * 2019-10-03 2023-01-31 三芳合金工業株式会社 Age-hardenable copper alloy
CN110629140B (en) * 2019-10-14 2021-05-07 江苏泰祥电线电缆有限公司 High strength alloy copper conductor annealing device
CN112458332B (en) * 2020-10-13 2022-01-11 宁波博威合金材料股份有限公司 Titanium bronze alloy bar and preparation method and application thereof
CN112626371B (en) * 2020-12-10 2022-07-29 中色奥博特铜铝业有限公司 High-strength medium-conductivity copper-nickel-silicon-tin-magnesium alloy foil and processing method thereof
CN112877624B (en) * 2021-01-13 2022-01-18 广东省科学院材料与加工研究所 Corrosion-resistant Al-Zn-Mg-Cu alloy, and preparation method and application thereof
CN113293306A (en) * 2021-05-28 2021-08-24 金川镍钴研究设计院有限责任公司 Preparation method of raw material for producing cupronickel B30 from copper-nickel slag
CN114250383A (en) * 2021-12-23 2022-03-29 无锡市蓝格林金属材料科技有限公司 Superconducting copper alloy and preparation method thereof
CN114540664B (en) * 2022-01-11 2023-01-17 中南大学 Copper alloy and preparation method and application thereof
CN114752810B (en) * 2022-03-24 2023-04-11 江苏恒盈电子科技有限公司 High-strength semiconductor lead frame for circuit board and preparation method thereof
CN114990379A (en) * 2022-05-11 2022-09-02 常熟市精工模具制造有限公司 Heat treatment process of copper-based alloy glass mold material
CN115026514B (en) * 2022-05-25 2023-07-18 西安理工大学 Preparation method of bidirectional threaded rod based on carbon alloy material
WO2023248453A1 (en) * 2022-06-24 2023-12-28 福田金属箔粉工業株式会社 Copper alloy powder for additive manufacturing, additively manufactured copper alloy article, and method for manufacturing copper alloy additively-manufactured article
CN115821109A (en) * 2022-12-29 2023-03-21 南通尔东金属科技有限公司 Preparation process of high-strength high-conductivity metal
CN117070867B (en) * 2023-10-11 2024-01-30 中铝科学技术研究院有限公司 Method for improving softening temperature of copper alloy and copper alloy

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU456019A1 (en) * 1973-02-26 1975-01-05 Государственный Научно-Исслкдовательский И Проектный Институ Сплавов И Обработки Цветных Металлов Copper based alloy
PL119918B2 (en) * 1980-06-18 1982-01-30 Copper alloy
JPS63105943A (en) * 1986-06-26 1988-05-11 Furukawa Electric Co Ltd:The Copper alloy for semiconductor device and its production
US4792365A (en) * 1986-11-13 1988-12-20 Ngk Insulators, Ltd. Production of beryllium-copper alloys and alloys produced thereby
JPH05179377A (en) * 1991-12-27 1993-07-20 Kobe Steel Ltd High strength copper alloy excellent in bendability and its production
JPH0790520A (en) * 1993-09-27 1995-04-04 Mitsubishi Shindoh Co Ltd Production of high-strength cu alloy sheet bar
JPH0920943A (en) * 1995-06-30 1997-01-21 Furukawa Electric Co Ltd:The Copper alloy for electronic and electrical parts and its production
JPH10296398A (en) * 1997-04-24 1998-11-10 Ngk Insulators Ltd Wire for coil and production thereof
JPH11222641A (en) * 1998-01-30 1999-08-17 Furukawa Electric Co Ltd:The Copper alloy for elctrically conductive spring and its production
US6251199B1 (en) * 1999-05-04 2001-06-26 Olin Corporation Copper alloy having improved resistance to cracking due to localized stress
US20020029827A1 (en) * 1999-01-15 2002-03-14 Jin-Yaw Liu High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes and method of making the same

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US584346A (en) * 1897-06-15 Boot or shoe lacing
US650269A (en) * 1900-03-13 1900-05-22 Albert H Ordway Process of twisting wooden rods into rope form.
US2157934A (en) * 1938-08-12 1939-05-09 Mallory & Co Inc P R Copper-magnesium alloys of improved properties
US2178992A (en) * 1939-08-15 1939-11-07 Mallory & Co Inc P R Copper alloy
GB1358055A (en) 1971-09-22 1974-06-26 Langley Alloys Ltd Copper-based alloys
US4191601A (en) * 1979-02-12 1980-03-04 Ampco-Pittsburgh Corporation Copper-nickel-silicon-chromium alloy having improved electrical conductivity
GB2051127B (en) 1979-04-30 1983-01-26 Delta Enfield Metals Precipitation hardening copper alloys
US4260435A (en) * 1979-07-02 1981-04-07 Ampco-Pittsburgh Corporation Copper-nickel-silicon-chromium alloy having improved electrical conductivity
JPS59145749A (en) 1983-12-13 1984-08-21 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor apparatus
JPS59145746A (en) 1983-12-13 1984-08-21 Nippon Mining Co Ltd Copper alloy for lead material of semiconductor apparatus
US4692192A (en) * 1984-10-30 1987-09-08 Ngk Insulators, Ltd. Electroconductive spring material
EP0189745B1 (en) * 1985-02-01 1988-06-29 Kabushiki Kaisha Kobe Seiko Sho Lead material for ceramic package ic
JPS61183426A (en) * 1985-02-06 1986-08-16 Furukawa Electric Co Ltd:The High strength, highly conductive heat resisting copper alloy
US4594221A (en) 1985-04-26 1986-06-10 Olin Corporation Multipurpose copper alloys with moderate conductivity and high strength
US4728372A (en) 1985-04-26 1988-03-01 Olin Corporation Multipurpose copper alloys and processing therefor with moderate conductivity and high strength
JPS63109134A (en) 1986-10-23 1988-05-13 Furukawa Electric Co Ltd:The Copper alloy for lead frame and its production
US4732365A (en) * 1987-01-23 1988-03-22 Kloster Kenneth D Bench mounted spring compressor
JPH01156454A (en) * 1987-12-11 1989-06-20 Kobe Steel Ltd Manufacture of high-strength and high-conductivity copper alloy
US5028391A (en) * 1989-04-28 1991-07-02 Amoco Metal Manufacturing Inc. Copper-nickel-silicon-chromium alloy
JPH034613A (en) 1989-05-31 1991-01-10 Tdk Corp Surface acoustic wave device
JPH03162553A (en) 1989-11-22 1991-07-12 Nippon Mining Co Ltd Manufacture of high strength and high conductivity copper alloy having good bendability
JP2724903B2 (en) * 1990-05-23 1998-03-09 矢崎総業 株式会社 High-strength copper alloy for electrical conduction with excellent bending resistance
JP2593107B2 (en) * 1990-11-15 1997-03-26 同和鉱業株式会社 Manufacturing method of high strength and high conductivity copper base alloy
JP2982446B2 (en) 1991-12-12 1999-11-22 株式会社豊田自動織機製作所 Loom control method
JPH05222467A (en) 1992-02-12 1993-08-31 Furukawa Electric Co Ltd:The Laminated bending member for damper
JP3391492B2 (en) 1992-12-23 2003-03-31 日鉱金属株式会社 High-strength, high-conductivity copper alloy for lead materials of semiconductor equipment and conductive spring materials
JPH06310593A (en) 1993-04-23 1994-11-04 Sony Corp Manufacture of element isolation region
FR2706488B1 (en) 1993-06-14 1995-09-01 Tech Ind Fonderie Centre Copper, nickel, silicon and chromium alloy and process for the preparation of said alloy.
JPH0718356A (en) 1993-07-01 1995-01-20 Mitsubishi Electric Corp Copper alloy for electronic equipment, its production and ic lead frame
JP3162553B2 (en) 1993-09-13 2001-05-08 本田技研工業株式会社 Air-fuel ratio feedback control device for internal combustion engine
KR0157257B1 (en) 1995-12-08 1998-11-16 정훈보 Method for manufacturing cu alloy and the same product
JP3407527B2 (en) 1996-02-23 2003-05-19 日立電線株式会社 Copper alloy materials for electronic equipment
JP3465541B2 (en) 1997-07-16 2003-11-10 日立電線株式会社 Lead frame material manufacturing method
JP3739214B2 (en) * 1998-03-26 2006-01-25 株式会社神戸製鋼所 Copper alloy sheet for electronic parts
DE10025107A1 (en) 2000-05-20 2001-11-22 Stolberger Metallwerke Gmbh Electrically conductive metal band and connector
JP3465108B2 (en) 2000-05-25 2003-11-10 株式会社神戸製鋼所 Copper alloy for electric and electronic parts
US7182823B2 (en) * 2002-07-05 2007-02-27 Olin Corporation Copper alloy containing cobalt, nickel and silicon

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU456019A1 (en) * 1973-02-26 1975-01-05 Государственный Научно-Исслкдовательский И Проектный Институ Сплавов И Обработки Цветных Металлов Copper based alloy
PL119918B2 (en) * 1980-06-18 1982-01-30 Copper alloy
JPS63105943A (en) * 1986-06-26 1988-05-11 Furukawa Electric Co Ltd:The Copper alloy for semiconductor device and its production
US4792365A (en) * 1986-11-13 1988-12-20 Ngk Insulators, Ltd. Production of beryllium-copper alloys and alloys produced thereby
JPH05179377A (en) * 1991-12-27 1993-07-20 Kobe Steel Ltd High strength copper alloy excellent in bendability and its production
JPH0790520A (en) * 1993-09-27 1995-04-04 Mitsubishi Shindoh Co Ltd Production of high-strength cu alloy sheet bar
JPH0920943A (en) * 1995-06-30 1997-01-21 Furukawa Electric Co Ltd:The Copper alloy for electronic and electrical parts and its production
JPH10296398A (en) * 1997-04-24 1998-11-10 Ngk Insulators Ltd Wire for coil and production thereof
JPH11222641A (en) * 1998-01-30 1999-08-17 Furukawa Electric Co Ltd:The Copper alloy for elctrically conductive spring and its production
US20020029827A1 (en) * 1999-01-15 2002-03-14 Jin-Yaw Liu High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes and method of making the same
US6251199B1 (en) * 1999-05-04 2001-06-26 Olin Corporation Copper alloy having improved resistance to cracking due to localized stress

Also Published As

Publication number Publication date
CN102816980A (en) 2012-12-12
ES2605354T3 (en) 2017-03-14
CN101792872A (en) 2010-08-04
CN101041868A (en) 2007-09-26
CN101792872B (en) 2016-03-16
EP1520054A2 (en) 2005-04-06
US20070131315A1 (en) 2007-06-14
JP2014095150A (en) 2014-05-22
US20040079456A1 (en) 2004-04-29
CA2490799A1 (en) 2004-01-15
TWI327601B (en) 2010-07-21
KR20080111170A (en) 2008-12-22
US20060076090A1 (en) 2006-04-13
US8430979B2 (en) 2013-04-30
TW200419001A (en) 2004-10-01
AU2003247661A1 (en) 2004-01-23
EP1520054B8 (en) 2017-07-26
US8257515B2 (en) 2012-09-04
JP2005532477A (en) 2005-10-27
US7182823B2 (en) 2007-02-27
AU2003247661A8 (en) 2004-01-23
KR20050061401A (en) 2005-06-22
JP2011157630A (en) 2011-08-18
MXPA05000148A (en) 2005-04-11
EP1520054A4 (en) 2007-03-07
WO2004005560A2 (en) 2004-01-15
CA2490799C (en) 2012-01-24
CN1671877A (en) 2005-09-21
CN1323188C (en) 2007-06-27
EP1520054B1 (en) 2016-10-26
US20140014239A1 (en) 2014-01-16

Similar Documents

Publication Publication Date Title
WO2004005560A3 (en) Copper alloy containing cobalt, nickel, and silicon
JP2005532477A5 (en)
WO2004024964A3 (en) Age-hardening copper-base alloy and processing
JP3803981B2 (en) Method for producing copper alloy having high strength and high conductivity
CN103958708A (en) Brass with excellent corrosion resistance
CN102560191A (en) High-performance elastic copper alloy and preparation and processing method thereof
TW200802711A (en) Method and structure for reducing contact resistance between silicide contact and overlying metallization
JP2009007673A (en) Copper-zinc alloy, method for producing tube or rod made of the alloy, and use of the alloy
EP2252718A1 (en) Aluminum-zinc-magnesium-silver alloy
TW200426232A (en) Cu-Ni-Si alloy and production method thereof
JPH0229737B2 (en)
ES2210063T3 (en) METAL DRIVING BAND OF ELECTRICITY AND CONNECTOR MADE OF THE SAME.
EP1063309A3 (en) Copper alloy
RU2661691C2 (en) Copper casting alloy for asynchronous machines
CN107419141A (en) A kind of Al Si Fe RE B alloy conductor materials and preparation method
JP3800269B2 (en) High strength copper alloy with excellent stamping workability and silver plating
CN108754221A (en) Bullet train motor frictional disk material and preparation method thereof
JPS6250426A (en) Copper alloy for electronic appliance
JPS58210140A (en) Heat resistant conductive copper alloy
JPH0582203A (en) Copper-alloy electric socket structural component
CA2702358A1 (en) Copper tin nickel phosphorus alloys with improved strength and formability
JP2001049366A (en) High strength and high conductivity copper alloy excellent in heat resistance
CN107460378A (en) A kind of Al Si Fe Mg Cu alloy conductor materials and preparation method thereof
KR950032666A (en) Copper (Cu) -zirconium (Cr) -cerium (Ce) -lanthanum (La) -nidium (Nd) -promethium (Pr) alloys and heat treatment
JPS6239214B2 (en)

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SC SD SE SG SK SL TJ TM TN TR TT TZ UA UG UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
REEP Request for entry into the european phase

Ref document number: 2003763072

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2003763072

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2490799

Country of ref document: CA

WWE Wipo information: entry into national phase

Ref document number: 2004519717

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020047021553

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: PA/a/2005/000148

Country of ref document: MX

WWE Wipo information: entry into national phase

Ref document number: 20038174324

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 2003763072

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1020047021553

Country of ref document: KR