WO2004009336A1 - Molded hologram apparatus method and product - Google Patents

Molded hologram apparatus method and product Download PDF

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Publication number
WO2004009336A1
WO2004009336A1 PCT/US2002/023414 US0223414W WO2004009336A1 WO 2004009336 A1 WO2004009336 A1 WO 2004009336A1 US 0223414 W US0223414 W US 0223414W WO 2004009336 A1 WO2004009336 A1 WO 2004009336A1
Authority
WO
WIPO (PCT)
Prior art keywords
die
recess
block
frame
mold
Prior art date
Application number
PCT/US2002/023414
Other languages
French (fr)
Inventor
John A. Gelardi
Anthony L. Gelardi
Michael Thrower
Original Assignee
Sagoma Plastics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagoma Plastics Corporation filed Critical Sagoma Plastics Corporation
Priority to PCT/US2002/023414 priority Critical patent/WO2004009336A1/en
Priority to AU2002319655A priority patent/AU2002319655A1/en
Publication of WO2004009336A1 publication Critical patent/WO2004009336A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
    • B44BMACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
    • B44B5/00Machines or apparatus for embossing decorations or marks, e.g. embossing coins
    • B44B5/0052Machines or apparatus for embossing decorations or marks, e.g. embossing coins by pressing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/37Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B29C45/372Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings provided with means for marking or patterning, e.g. numbering articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/46Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C45/561Injection-compression moulding
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03HHOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/02Details of features involved during the holographic process; Replication of holograms without interference recording
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/46Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C45/561Injection-compression moulding
    • B29C2045/564Compression drive means acting independently from the mould closing and clamping means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/46Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C45/561Injection-compression moulding
    • B29C2045/5645Resilient compression means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/722Decorative or ornamental articles
    • B29L2031/7224Holograms
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03HHOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/02Details of features involved during the holographic process; Replication of holograms without interference recording
    • G03H1/0276Replicating a master hologram without interference recording
    • G03H2001/0284Replicating a master hologram without interference recording by moulding
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03HHOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H2227/00Mechanical components or mechanical aspects not otherwise provided for
    • G03H2227/04Production line for mass production

Definitions

  • Holographic images are well known. The holographic images may be used for decoration or security purposes. Holographic images may be found in credit cards, where they are often found in films laminated within the cards. Currency may have holographic images . Products and parts of products may have holographic images to avoid counterfeiting. When film is used for the holographic images, problems of counterfeiting continue. Recent attempts have been made to incorporate holographic images directly in the surface of products. Holographic films are created and etched, leaving irregular surfaces. Metal films are sputtered on the irregular surfaces of the films, and the films are removed, leaving an irregular surface on the metal.
  • the invention fulfills the needs of the prior art and produces better, clearer holograms directly on products and parts, which produce better holographic images when viewed.
  • hologram shim insert plates are held mechanically on mold inserts. Removing the insert assemblies, and separating insert plugs from insert frames separates the hologram plates from the insert assemblies for easy replacement.
  • New methods of molding produce better holograms .
  • the methods are useful in forming products by molding, injection molding, coating and vacuum or pressure forming.
  • hologram insert plates are placed in hologram insert assemblies which are held in pockets in die surfaces. Heat is precisely controlled on the insert plate by heating and controlling heat in the insert assembly.
  • the insert assembly is resiliently mounted within the pocket in preferred embodiments .
  • Forming materials in a closed die assembly under pressure forces the die insert assembly elements to compress .
  • the product begins to shrink within the die cavity.
  • the resilient mounting of the heated insert assembly follows the surface of the part with the insert plate as the part shrinks, transferring the precise lines on the inset plate to the surface of the cooling product.
  • the resiliency is provided by cushioning material and springs in preferred embodiments. Alternatively, or conjointly, the resiliency is provided hydraulically or pneumatically .
  • the hologram molded into the part produces apparent color in non-colored parts.
  • the hologram is molded into a clear formed product and is used in conjunction with print. At a greater portion of angles of viewing, the observer sees only the print. At appropriate angles of alignment and with incident light, the observer sees a holographic image as a dominant feature of the product surface .
  • holograms are impressed on opposite surfaces of a clear, transparent or translucent part. Using a correct angle of viewing, the observer sees a holographic image within another holographic image .
  • each layer of a multi-layer part formed of clear, transparent or translucent layers has a hologram molded into at least one surface. Viewing the product at appropriate viewing angles makes the observer see holograms within holograms. In all cases the holograms are subtle, and the observer does not see the holographic images until proper alignment is achieved.
  • the invention provides the forming of shapes that have holographic images molded in entire surface areas.
  • the invention provides a means of inserting and removing holographic dies in the forming tools.
  • the invention provides an independent controller to regulate holographic insert temperature.
  • One of the important features of the invention is the provision of coining the holographic image in the forming process.
  • the invention provides the use of multiple holographic images formed by holograms on one or more layers .
  • This invention is a method of forming a hologram image in a surface of a molded article including a die set with at least one die, a pocket in the of least one die, a hologram die insert assembly in the pocket, a die insert body in the die insert assembly and a hologram plate on the body.
  • the die insert assembly is supported in the pocket.
  • the die insert body is supported movably in the pocket.
  • the hologram plate is supported on the die insert body.
  • the die set is filled with a moldable material. The material is molded, hardened and shrunk in the die set. As the material shrinks in the die set, the die insert assembly moves the die insert body outward in the pocket and presses the hologram plate against the surface of the shrinking material as it hardens in the die set .
  • the die insert body is heated.
  • Supporting the die insert body in the pocket includes providing a resilient pad beneath the die insert body in the pocket. Supporting the die insert body in the pocket also includes providing at least one spring in the pocket beneath the die insert body.
  • supporting the die insert body in the pocket includes providing a compressible material in the pocket beneath the die insert body.
  • the moldable material includes a thermoforming plastic material .
  • the die apparatus includes a die set having at least one die, a pocket in the die, a die insert assembly mounted in the pocket, the die insert assembly including a die insert body, a holographic plate mounted on the die insert body and a compressible material between the die insert body and a bottom of the pocket.
  • a heater may also be connected to the die insert body.
  • the heater may be an electrical heater, a hot fluid circulating heater, and may be separate form the die cavity heater.
  • the compressible material may includes a resilient pad mounted in the pocket below the die insert body, a resilient pad connected to the die insert body opposite the holographic plate, or a compressible fluid in the pocket beneath the die insert body.
  • the die insert assembly for mounting in a pocket of a die comprising a die insert body, a holographic plate mounted on an outside of the die insert body and a resilient pad mounted on the die insert body opposite the holographic plate.
  • a heater may also be connected to the die insert body.
  • the heater may be an electrical heater including a heat control connected to the electrical heater for controlling temperature of the die insert body and the holographic plate.
  • the heater may also include fluid flow channels in the die insert body, fluid conduits connected to the fluid flow channels and a heat control connected to the fluid conduits.
  • the resilient pad is an elastomeric pad.
  • the molded article includes a transparent panel with an outer surface and an inner surface opposite the outer surface and a holographic image molded in the inner surface of the transparent panel.
  • the molded article may include a second holographic image on the outer surface of the transparent panel or may include multiple transparent panel layers with multiple outer surfaces and multiple inner surfaces with multiple holographic images molded on the multiple inner surfaces and with the multiple transparent panel layers joined by lamination.
  • Figure 1 is a schematic cross-sectional representation of a mold insert for producing the hologram in a molded part .
  • Figure 2 is a perspective detail of the mold insert.
  • Figure 3 is a perspective top view of a mold insert.
  • Figure 4 is a perspective side view of the mold insert.
  • Figure 5 is a partial sectional schematic view of a mold insert in a mold.
  • Figure 6 is an exploded view of a mold insert.
  • Figure 7 is an exploded perspective view of a mold insert.
  • Figure 8 is a detail of a round insert such as shown in Figure 7.
  • Figure 9 is a detail of a round hologram surface in molded part .
  • Figure 10 is a perspective view of an oval hologram insert .
  • Figure 11 is a perspective view of a triangular hologram insert .
  • Figure 12 is a perspective view of an in-mold hologram insert assembly.
  • Figure 13 is a sectional side perspective view of an in- mold hologram inserted assembly.
  • Figure 14 shows a mold half with an insertable hologram assembly.
  • Figure 15 shows a partially assembled in-mold hologram insert assembly showing how the temperature control tubes and retaining device are connected to the insert after the insert is placed in the mold half.
  • Figure 16 is a perspective detail of the in-mold insert.
  • Figure 17 is a sectional view of the insert shown in Figure 16.
  • Figure 18 is a perspective view of the insert assembly showing the connection of the temperature control tubes and retainer.
  • Figure 19 is an exploded view of the mold half and platen, the insert, and the tubes and retainer ready for connection with the mold insert.
  • Figure 20 is a perspective view of the mold insert mounted in the mold half.
  • Figure 21 is a top perspective view of a mold insert mounted in a mold half.
  • Figure 22 is a perspective view showing details of a mold insert in a mold half.
  • Figure 23 is a top plan view of a mold insert in a mold half.
  • Figure 24 is a schematic representation of a die for molding, casting or forming products or parts, showing a hologram die assembly for inserting in a pocket of a main die, with a temperature controller and heater for the hologram die insert .
  • Figure 25 is a schematic representation of a cross-section of the hologram die insert assembly within a pocket in a main die .
  • Figures 26 and 27 are schematic representations of a hologram die insert within a main die pocket .
  • Figure 28 is a schematic representational detail of a hologram die insert and heat controller.
  • Figure 29 is a schematic representation of a hologram viewed through a clear plastic article.
  • Figure 30 is a schematic representation of viewing a hologram through a clear plastic article.
  • Figure 31 shows a holographic image produced on both sides of a transparent part 25.
  • Figure 32 shows several holographic images on laminated parts 25.
  • Figure 1 shows the cross section of a mold 1 having an upper half 3 and a lower half 5 with a mold cavity 7 formed between the halves .
  • In-mold hologram insert assembly 10 is inserted in a recess 9 in the lower half.
  • the mold insert 10 has an outer frame 11, with sidewalls 13 surrounding an insert plug 15.
  • the side walls 13 have inward extensions 17 at their tops 19 to hold the hologram shim 21 on top of the plug 15, by engaging outer edge portions 23 of the shim which overlie outer edge portions 25 of the upper surface 27 of the mold plug 15.
  • the lower surface 29 of the mold plug is supported on a compression layer plate 31, which is contacted by the tops 33 of four or more springs 35 which are contained in cylinders 37 at the bottom of recess 9 in the lower mold half 5.
  • the cylinders 37 have volumes 39 filled with air or hydraulic fluid under pressure.
  • a compressible recovery material 41 which may be a resilient elastomeric material or a spring plate underlies the plug and preferably underlies the frame to cooperate with the springs 35 and air or hydraulic fluid in cylinders 39. Pressure in the mold tends to move the frame 11 and plug 15 downward in the recess 9 during injection of material in the mold cavity 7. After injection the plug or plug and outer frame move upward to follow the molded part as any shrinking of the molded part occurs, thereby pressing the hologram and shim continuously against the molded part until the molded part is fully set and is removed from the mold cavity 7 after opening the mold halves 3 and 5.
  • An outer portion of the outer frame 11 has vertically extended recesses 43 which cooperate with the extended ends 45 of retaining bolts 47 to restrict relative movement of the insert assembly 10 in the recess 9.
  • Retaining bolt 47 is inserted in a bore 49 and has male threads 51 which cooperate with female threads 53 at the bottom of the bore to hold the bolt 47 in the bore 49.
  • a counter bore 55 receives the head 57 of the bolt 47.
  • the base 59 of the counterbore 55 cooperates with the inner surface 61 of the bolt head 57 to position the bolt and to allow a clearance 63 between the end 45 of the bolt and in the groove 43 in the frame 11.
  • the frame 11 and the plug 15 are free to move within the limits of the grooves 43.
  • Enlarged bores 65 in the sides of the lower mold half 5 receive temperature control tubes 67. Fluid flows through the tubes 67 into and out of channels 69 in the mold plug 15 to precisely maintain temperature of the mold plug 15 and of the hologram shim 21, which is supported on the upper surface 27 of the mold plug 15.
  • the temperature control tubes include male threads 61 which are engaged in female threads 73 within the mold plug 15. Outer threads 75 are provided for connection to temperature controlled fluid sources and returns.
  • the first tube 77 is the inlet which connects to a pressurized source of hot fluid
  • the second tube 79 is an outlet tube which connects to a return on the hot fluid heater.
  • the heated fluid may be a gas, hydraulic oil such as used to press mold halves together, pressurized water or steam.
  • Partial removal of the retaining bolt 47 allows removal and replacement of the insert assembly 10.
  • the retaining bolt allows insert frame assembly to be held in the recessed pocket 9 in the mold 5, but also allows the insert assembly 10 to move in and out to remain in contact with the molded part .
  • the insert assembly 10 with the hologram shim plate 21 may be removed and replaced without taking the mold apart.
  • the insert assembly 10 is inserted in the mold pocket recess 9, the retaining bolt is tightened, and the tubes 67 are attached.
  • the insert assembly maintains surface contact with the molded plastic material in the mold cavity throughout the entire molding process, thus maintaining the hologram image shim plate in contact with the molded part .
  • Figures 3 and 4 show moveable insert assembly 80 with frame 11 having walls 13 and a moveable plug 81.
  • a spring or piston within recesses 83 and 85 moves the plug 81 and hologram shim plate 21 and frame 11 upward.
  • the moveable insert assembly 80 allows the insert assembly and hologram shim plate 21 to keep contact with a surface of the molded plastic part as it cools after injection into the mold.
  • the resins are injected into the mold in liquid form.
  • the liquid sets to a solid and cools, which is usually accompanied with shrinking.
  • the moveable insert assembly keeps the hologram plate 21 in contact with the plastic part as it cools, coining the hologram image into the part .
  • heated material may be placed in a mold, and the mold closed on the heated material.
  • the heated material may shrink as it cools and solidifies.
  • the moveable insert assembly allows the insert assembly to keep contact with the surface of the plastic as it cools, coining the hologram image from the hologram shim plate 21 into the surface of the molded part .
  • four or more springs 35 and compressible layer 31 urge the insert plug 15 and hologram shim 21 with its hologram image surface 22 and the frame 11 toward the mold cavity.
  • the insert springs and compressible layer allow the insert assembly to move and recover. Water or oil flows through the internal chambers 69 of the inner plug 15 to heat or cool the insert.
  • the temperature controlled insert plug 15 presses the hologram shim 21 and the hologram image into the molded part and follows the molded part as the part shrinks in the mold cavity.
  • the internal walls 91 of the frame 11 and rounded corners 92 cooperate with the smooth walls and rounded corners 94 of the inner plug 15 to allow the inner plug and hologram shim 21 to be removed and replaced in the frame 11.
  • the inner plug 15 has threaded holes 95, and the frame has enlarged bores 96 which receive respectively the threaded end 97 and the head 98 of set screws 99.
  • Holes 68 in the sidewalls 13 of frame 11 receive the tubes 67 shown in Figure 2 with ends of the tubes threaded into tapped openings 73 in the insert plug 15.
  • Figure 7 shows a lower mold half 100 with a round dark cavity 101.
  • a compressible layer 31 may be provided at the bottom of the circular recess 109.
  • a spring assembly may be provided beneath the compressible layer 31.
  • a cylindrical outer frame 11 surrounds a cylindrical inner plug, which supports a hologram shim 121 with a hologram image 122 against the inward extending lip 117 of the frame 111.
  • Tube 67 with end connectors 73 and 75 fits within an enlarged bore 65 in the mold half 100, extends through bore 168 in the cylindrical frame 111 and engages threads 171 in the inner plug.
  • Figure 8 is a detail of the frame, rim 117 and hologram shim 121 within the cylindrical cavity 101.
  • Figure 9 shows a molded part 175 with a hologram surface 177 and a cylindrical depression 179 around the hologram surface.
  • Figure 10 shows an oval frame 181 with an oval hologram shim 183.
  • Figure 11 shows a triangular frame 185 with a triangular hologram shim 187.
  • Figures 12 and 13 show a schematic representation of an assembled insert assembly 10 with a frame 11 having sidewalls 13.
  • An insert plug 15 is shown inserted in the frame with a hologram shim plate 21 positioned below the lip 17 of the frame.
  • the frame includes bores 68 for insertion of heating and cooling tubes, and a guide 43 having a chamfered countersink 44, which loosely receives the retaining bolt 47 as shown in Figure 1.
  • the holographic shim 21 is supported by the temperature- controlled plug 15 and is held beneath the rim 17 of the frame 11. As shown, a ridge 191 may be formed around the frame for cooperating with a complementary surface feature in the mold recess 9 which receives the insert assembly to prevent excessive movement of the assembly 10 into the recess.
  • Figure 14 shows the mold assembly 10 being inserted into a recess 9, which has a spring or piston holder 193 in its base 195 to cooperate with compressible layer 31.
  • Walls 197 of the recess have curved corners 198 to cooperate with the curved corners 199 of the insert assembly frame 11.
  • the mold half 5 has a large base 201, and a smaller portion 203, in which the mold cavity 7 is formed.
  • Retaining bolt 47 is inserted through counterbore 55 to engage internal threads.
  • the end 45 of the retaining bolt 47 fits loosely in retaining recess 43 to allow inward and outward movement of the hologram insert assembly 10 during molding.
  • Tubes 67 fit loosely within bores 65 and have joining ends 73 which are connected to internal threads 71 within the insert plug. Set screws 99 hold the insert assembly
  • the described apparatus provides a device and a method for inserting and removing a hologram shim plate into and out of a part forming device.
  • the invention provides a device and method for holding a hologram shim and for continuing to press the hologram shim against the part during the forming, cooling and shrinking of the part.
  • the invention also provides the above systems in combination with the addition of an independent temperature control device for controlling the temperature of the hologram insert plug and the hologram shim.
  • the hologram insert assembly retaining screw 47 allows slight movement of the hologram assembly 10 during the molding operations .
  • Figure 15 schematically shows connections of the retaining bolt 47 and the temperature control tubes 67 with respect to the hologram insert assembly 10.
  • the tubes 67 extend through bores 68 in the frame walls 13 into threaded receivers in the insert plug 15.
  • the end of the retaining bolt 47 is positioned with clearance in the receiver 43 in the wall 13 of the frame
  • the temperature control system tubes 67 are inserted through the mold and the frame wall into the insert plug.
  • the hologram retaining bolt 47 is inserted through the mold into the receiver 43 in the wall 13 of frame 11 to allow limited movement, the insert assembly 10 within the recess in the cavity.
  • Figure 16 shows the hologram insert assembly mounted in the recess in the cavity 7 of the mold half 5.
  • Figure 17 shows the mold half 5 positioned for receiving the upper mold half to close the cavity 7.
  • Figures 18 through 23 are details showing the hologram assembly mounted in the recess 9 of the cavity 7 in the lower mold half 5.
  • Figure 24 shows a holographic insert assembly 301 having a male or female hologram die 303, held by a vacuum applied through a foraminous layer 305 with solid sides on an electromagnet body 307 above a compressible layer 309.
  • the entire die assembly 301 is positioned within a pocket 311 in a die 313.
  • the die insert body 307 has one or more central openings 315 into which heaters 317 are inserted.
  • a heater is connected to power circuits 319, which are in turn connected to a temperature controller 321 with an adjustable temperature control 323.
  • the holographic insert assembly 301 is held in the pocket 311 of die 313.
  • material 325 is formed under pressure between dies 313 and 331, the dies are heated. Heat is removed from dies 313 and 331, pressure is removed, and the material 325 begins to set. Surfaces 327 and 329 of the material 325, tend to shrink away from the die surfaces .
  • the die insert 301 begins to move further into the pocket 311, compressing the compressible layer 309.
  • the compressible material 309 forces the holographic insert assembly 301 toward the material 325, keeping the pressure on the surface 327 adjacent the hologram 303.
  • Heat is maintained by heaters in the openings 315.
  • the heaters in conjunction with the compressible layer, enhance the image quality.
  • the insert assembly moves back and then returns as pressure is changed. The result is that a high level of embossing or coining takes place.
  • Figure 26 shows a holographic insert assembly 301 for inserting in the pocket 311 of the die 313.
  • the compressible layer 309 supports the electromagnetic body 307 of the insert 301, and the holographic plate 303 is held on the insert 307 by vacuum and by magnetic force.
  • the surface 333 of the holographic plate 303 contains a male or female holographic die.
  • the surface 335 of the die 313 may be curved 337 for molding the products.
  • Line 339 controls a vacuum to hold the holographic die plate 303 on the body 307, and also provides a conduit for heater lines 319.
  • the holographic die assembly 301 is held in the pocket 311 of die 313.
  • the holographic plate 303 and the assembly may move inward and outward in relation to the pocket 311.
  • Heaters 317 are positioned in cavities 315 within the insert body 307.
  • Heater lines 319 connect the heaters to a temperature controllers 321, which provide temperature regulation of the heaters.
  • the invention controls the hologram insert assembly temperature.
  • the system has the ability to apply die pressure to flat or contour shapes .
  • the system may be used in packaging for containing products and directly on products, such as on pills, toys and candy.
  • the holograms may mold images directly on frames, clear covers, and directly on products such as calculators and computer parts and drawings.
  • a holographic insert assembly 301 has a body 307 with a U-shaped cavity 341.
  • Cavity 341 has an inlet 343 and an outlet 345.
  • Fluid conduits 347 and 349 are connected to the respective inlet and outlet, and are connected to pump and heater 351 with a controller 353, which controls the temperature of the water or oil pumped through the conduits 347 and 349 and through the U-shaped cavity 341 in the body 307 of the insert 301.
  • Precise control of temperature of the body 307 controls temperature of the holographic plate 303 and of the holographic surface 333.
  • the holographic insert assembly 301 fits within pocket 311 in the die 313.
  • Pocket 311 is equipped with mechanical springs or a compressible cushion, or alternatively is equipped with a pressurizing mechanism which controls pressure in the pocket to resist inward pressure on the body 307 and holographic plate 303 during injection and to drive the body and plate outward as the part shrinks after reduction and removal of the forming pressure.
  • Figure 29 shows a clear part 325 in which a holographic image 355 is formed on the rear surface 327 of the part.
  • the holographic image is viewed from the front surface 329, as shown in Figure 30.
  • Figure 31 shows a part 325 on which holograms 355 and 357 are formed on the back and front of the plate . Viewing the holographic images produced by the holograms 355 and 357 at the same time produces an apparent hologram within a hologram.
  • Figure 32 shows several laminated plates 325 with holograms 355 formed on the rear surfaces. Viewing the holographic images produces the appearance of holograms within holograms .
  • Holograms may be formed on inner surfaces of clear, transparent or translucent parts, and the parts may be joined, abutting the holograms or spacing the holograms with plastic material or air.
  • the invention is useful in molding or casting, pressing or forming any products such as containers, caps, candy, pills, fasteners, packages; products of all kinds.
  • the invention is especially useful where product protection and certainty of authentication and source is required or useful. All kinds of materials such as, for example, compressed or sintered powders, tablets, plastic or metal products may use the process and apparatus of the invention.

Abstract

Holographic lines are formed directly on products by holding a holographic plate (21) and a block (15) under a lip on a frame (11) and mounting the frame for limited movement within a recess (9) in a mold half (5). As a mold cavity is filled, the frame, block and plate and heating tubes (67) connected to the block move in the recess. As the product sets, springs (35) push the frame, block and plate toward the shrinking product controlling the fine holographic lines. Lateral frame recesses (49) receive bolt ends (47) to limit frame travel. Partially withdrawing bolts and removing the tubes releases the frame for withdrawing the block and replacing the holographic plate.

Description

Molded Hologram Apparatus Method and Product BACKGROUND OF THE INVENTION
Holographic images are well known. The holographic images may be used for decoration or security purposes. Holographic images may be found in credit cards, where they are often found in films laminated within the cards. Currency may have holographic images . Products and parts of products may have holographic images to avoid counterfeiting. When film is used for the holographic images, problems of counterfeiting continue. Recent attempts have been made to incorporate holographic images directly in the surface of products. Holographic films are created and etched, leaving irregular surfaces. Metal films are sputtered on the irregular surfaces of the films, and the films are removed, leaving an irregular surface on the metal.
Difficulties with quality of the holograms on surfaces of the articles persist in holographic images produced by in molded holograms.
Needs exist for improved molding processes and improved dies for producing enhanced holographic images from holograms formed in product surfaces .
SUMMARY OF THE INVENTION
The invention fulfills the needs of the prior art and produces better, clearer holograms directly on products and parts, which produce better holographic images when viewed.
In preferred embodiments of the invention, hologram shim insert plates are held mechanically on mold inserts. Removing the insert assemblies, and separating insert plugs from insert frames separates the hologram plates from the insert assemblies for easy replacement.
New methods of molding produce better holograms . The methods are useful in forming products by molding, injection molding, coating and vacuum or pressure forming.
In preferred embodiments, hologram insert plates are placed in hologram insert assemblies which are held in pockets in die surfaces. Heat is precisely controlled on the insert plate by heating and controlling heat in the insert assembly. The insert assembly is resiliently mounted within the pocket in preferred embodiments .
Forming materials in a closed die assembly under pressure forces the die insert assembly elements to compress . As injection pressure is removed from the dies and the product sets, the product begins to shrink within the die cavity. The resilient mounting of the heated insert assembly follows the surface of the part with the insert plate as the part shrinks, transferring the precise lines on the inset plate to the surface of the cooling product.
The resiliency is provided by cushioning material and springs in preferred embodiments. Alternatively, or conjointly, the resiliency is provided hydraulically or pneumatically .
The hologram molded into the part produces apparent color in non-colored parts. In a preferred embodiment, the hologram is molded into a clear formed product and is used in conjunction with print. At a greater portion of angles of viewing, the observer sees only the print. At appropriate angles of alignment and with incident light, the observer sees a holographic image as a dominant feature of the product surface .
In one preferred embodiment, holograms are impressed on opposite surfaces of a clear, transparent or translucent part. Using a correct angle of viewing, the observer sees a holographic image within another holographic image . Alternately, each layer of a multi-layer part formed of clear, transparent or translucent layers has a hologram molded into at least one surface. Viewing the product at appropriate viewing angles makes the observer see holograms within holograms. In all cases the holograms are subtle, and the observer does not see the holographic images until proper alignment is achieved.
The invention provides the forming of shapes that have holographic images molded in entire surface areas. The invention provides a means of inserting and removing holographic dies in the forming tools. The invention provides an independent controller to regulate holographic insert temperature. One of the important features of the invention is the provision of coining the holographic image in the forming process. The invention provides the use of multiple holographic images formed by holograms on one or more layers .
This invention is a method of forming a hologram image in a surface of a molded article including a die set with at least one die, a pocket in the of least one die, a hologram die insert assembly in the pocket, a die insert body in the die insert assembly and a hologram plate on the body. The die insert assembly is supported in the pocket. The die insert body is supported movably in the pocket. The hologram plate is supported on the die insert body. The die set is filled with a moldable material. The material is molded, hardened and shrunk in the die set. As the material shrinks in the die set, the die insert assembly moves the die insert body outward in the pocket and presses the hologram plate against the surface of the shrinking material as it hardens in the die set .
In one embodiment, the die insert body is heated.
Supporting the die insert body in the pocket includes providing a resilient pad beneath the die insert body in the pocket. Supporting the die insert body in the pocket also includes providing at least one spring in the pocket beneath the die insert body.
In another embodiment, supporting the die insert body in the pocket includes providing a compressible material in the pocket beneath the die insert body.
In one embodiment, the moldable material includes a thermoforming plastic material .
The another embodiment , the die apparatus includes a die set having at least one die, a pocket in the die, a die insert assembly mounted in the pocket, the die insert assembly including a die insert body, a holographic plate mounted on the die insert body and a compressible material between the die insert body and a bottom of the pocket. A heater may also be connected to the die insert body. The heater may be an electrical heater, a hot fluid circulating heater, and may be separate form the die cavity heater.
The compressible material may includes a resilient pad mounted in the pocket below the die insert body, a resilient pad connected to the die insert body opposite the holographic plate, or a compressible fluid in the pocket beneath the die insert body.
In one embodiment, the die insert assembly for mounting in a pocket of a die comprising a die insert body, a holographic plate mounted on an outside of the die insert body and a resilient pad mounted on the die insert body opposite the holographic plate. A heater may also be connected to the die insert body. The heater may be an electrical heater including a heat control connected to the electrical heater for controlling temperature of the die insert body and the holographic plate. The heater may also include fluid flow channels in the die insert body, fluid conduits connected to the fluid flow channels and a heat control connected to the fluid conduits.
In this embodiment, the resilient pad is an elastomeric pad. In one embodiment, the molded article includes a transparent panel with an outer surface and an inner surface opposite the outer surface and a holographic image molded in the inner surface of the transparent panel. The molded article may include a second holographic image on the outer surface of the transparent panel or may include multiple transparent panel layers with multiple outer surfaces and multiple inner surfaces with multiple holographic images molded on the multiple inner surfaces and with the multiple transparent panel layers joined by lamination.
These and further and other objects and features of the invention are apparent in the disclosure, which includes the above and ongoing written specification, with the claims and the drawings . BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 is a schematic cross-sectional representation of a mold insert for producing the hologram in a molded part .
Figure 2 is a perspective detail of the mold insert.
Figure 3 is a perspective top view of a mold insert.
Figure 4 is a perspective side view of the mold insert.
Figure 5 is a partial sectional schematic view of a mold insert in a mold.
Figure 6 is an exploded view of a mold insert.
Figure 7 is an exploded perspective view of a mold insert.
Figure 8 is a detail of a round insert such as shown in Figure 7.
Figure 9 is a detail of a round hologram surface in molded part .
Figure 10 is a perspective view of an oval hologram insert .
Figure 11 is a perspective view of a triangular hologram insert .
Figure 12 is a perspective view of an in-mold hologram insert assembly.
Figure 13 is a sectional side perspective view of an in- mold hologram inserted assembly.
Figure 14 shows a mold half with an insertable hologram assembly.
Figure 15 shows a partially assembled in-mold hologram insert assembly showing how the temperature control tubes and retaining device are connected to the insert after the insert is placed in the mold half.
Figure 16 is a perspective detail of the in-mold insert.
Figure 17 is a sectional view of the insert shown in Figure 16.
Figure 18 is a perspective view of the insert assembly showing the connection of the temperature control tubes and retainer.
Figure 19 is an exploded view of the mold half and platen, the insert, and the tubes and retainer ready for connection with the mold insert.
Figure 20 is a perspective view of the mold insert mounted in the mold half.
Figure 21 is a top perspective view of a mold insert mounted in a mold half.
Figure 22 is a perspective view showing details of a mold insert in a mold half.
Figure 23 is a top plan view of a mold insert in a mold half.
Figure 24 is a schematic representation of a die for molding, casting or forming products or parts, showing a hologram die assembly for inserting in a pocket of a main die, with a temperature controller and heater for the hologram die insert .
Figure 25 is a schematic representation of a cross-section of the hologram die insert assembly within a pocket in a main die .
Figures 26 and 27 are schematic representations of a hologram die insert within a main die pocket .
Figure 28 is a schematic representational detail of a hologram die insert and heat controller.
Figure 29 is a schematic representation of a hologram viewed through a clear plastic article.
Figure 30 is a schematic representation of viewing a hologram through a clear plastic article.
Figure 31 shows a holographic image produced on both sides of a transparent part 25.
Figure 32 shows several holographic images on laminated parts 25.
DETAILED DESCRIPTION OF THE DRAWINGS
Referring to the drawings, Figure 1 shows the cross section of a mold 1 having an upper half 3 and a lower half 5 with a mold cavity 7 formed between the halves .
In-mold hologram insert assembly 10 is inserted in a recess 9 in the lower half. The mold insert 10 has an outer frame 11, with sidewalls 13 surrounding an insert plug 15. The side walls 13 have inward extensions 17 at their tops 19 to hold the hologram shim 21 on top of the plug 15, by engaging outer edge portions 23 of the shim which overlie outer edge portions 25 of the upper surface 27 of the mold plug 15. The lower surface 29 of the mold plug is supported on a compression layer plate 31, which is contacted by the tops 33 of four or more springs 35 which are contained in cylinders 37 at the bottom of recess 9 in the lower mold half 5. In addition to or instead of the springs 35 the cylinders 37 have volumes 39 filled with air or hydraulic fluid under pressure.
A compressible recovery material 41 which may be a resilient elastomeric material or a spring plate underlies the plug and preferably underlies the frame to cooperate with the springs 35 and air or hydraulic fluid in cylinders 39. Pressure in the mold tends to move the frame 11 and plug 15 downward in the recess 9 during injection of material in the mold cavity 7. After injection the plug or plug and outer frame move upward to follow the molded part as any shrinking of the molded part occurs, thereby pressing the hologram and shim continuously against the molded part until the molded part is fully set and is removed from the mold cavity 7 after opening the mold halves 3 and 5.
An outer portion of the outer frame 11 has vertically extended recesses 43 which cooperate with the extended ends 45 of retaining bolts 47 to restrict relative movement of the insert assembly 10 in the recess 9. Retaining bolt 47 is inserted in a bore 49 and has male threads 51 which cooperate with female threads 53 at the bottom of the bore to hold the bolt 47 in the bore 49. A counter bore 55 receives the head 57 of the bolt 47. The base 59 of the counterbore 55 cooperates with the inner surface 61 of the bolt head 57 to position the bolt and to allow a clearance 63 between the end 45 of the bolt and in the groove 43 in the frame 11. Thus, the frame 11 and the plug 15 are free to move within the limits of the grooves 43. Enlarged bores 65 in the sides of the lower mold half 5 receive temperature control tubes 67. Fluid flows through the tubes 67 into and out of channels 69 in the mold plug 15 to precisely maintain temperature of the mold plug 15 and of the hologram shim 21, which is supported on the upper surface 27 of the mold plug 15.
The temperature control tubes include male threads 61 which are engaged in female threads 73 within the mold plug 15. Outer threads 75 are provided for connection to temperature controlled fluid sources and returns.
As shown in Figure 2, two tubes 67 are provided. The first tube 77 is the inlet which connects to a pressurized source of hot fluid, and the second tube 79 is an outlet tube which connects to a return on the hot fluid heater.
The heated fluid may be a gas, hydraulic oil such as used to press mold halves together, pressurized water or steam.
Partial removal of the retaining bolt 47 allows removal and replacement of the insert assembly 10. When inserted, the retaining bolt allows insert frame assembly to be held in the recessed pocket 9 in the mold 5, but also allows the insert assembly 10 to move in and out to remain in contact with the molded part .
By draining the fluid through the temperature control tubes, removing the temperature control tubes, and by partially removing the retaining bolt, the insert assembly 10 with the hologram shim plate 21 may be removed and replaced without taking the mold apart. When the insert assembly 10 is inserted in the mold pocket recess 9, the retaining bolt is tightened, and the tubes 67 are attached. The insert assembly maintains surface contact with the molded plastic material in the mold cavity throughout the entire molding process, thus maintaining the hologram image shim plate in contact with the molded part .
Maintaining the contact coins the image into the molded part .
Figures 3 and 4 show moveable insert assembly 80 with frame 11 having walls 13 and a moveable plug 81. A spring or piston within recesses 83 and 85 moves the plug 81 and hologram shim plate 21 and frame 11 upward. The moveable insert assembly 80 allows the insert assembly and hologram shim plate 21 to keep contact with a surface of the molded plastic part as it cools after injection into the mold.
In most thermal plastic materials, the resins are injected into the mold in liquid form. The liquid sets to a solid and cools, which is usually accompanied with shrinking. The moveable insert assembly keeps the hologram plate 21 in contact with the plastic part as it cools, coining the hologram image into the part .
In other molding processes, heated material may be placed in a mold, and the mold closed on the heated material. The heated material may shrink as it cools and solidifies. The moveable insert assembly allows the insert assembly to keep contact with the surface of the plastic as it cools, coining the hologram image from the hologram shim plate 21 into the surface of the molded part .
As shown in Figures 5 and 6, four or more springs 35 and compressible layer 31 urge the insert plug 15 and hologram shim 21 with its hologram image surface 22 and the frame 11 toward the mold cavity. The insert springs and compressible layer allow the insert assembly to move and recover. Water or oil flows through the internal chambers 69 of the inner plug 15 to heat or cool the insert. The temperature controlled insert plug 15 presses the hologram shim 21 and the hologram image into the molded part and follows the molded part as the part shrinks in the mold cavity.
The internal walls 91 of the frame 11 and rounded corners 92 cooperate with the smooth walls and rounded corners 94 of the inner plug 15 to allow the inner plug and hologram shim 21 to be removed and replaced in the frame 11. The inner plug 15 has threaded holes 95, and the frame has enlarged bores 96 which receive respectively the threaded end 97 and the head 98 of set screws 99. Holes 68 in the sidewalls 13 of frame 11 receive the tubes 67 shown in Figure 2 with ends of the tubes threaded into tapped openings 73 in the insert plug 15.
Figure 7 shows a lower mold half 100 with a round dark cavity 101. A compressible layer 31 may be provided at the bottom of the circular recess 109. A spring assembly may be provided beneath the compressible layer 31. A cylindrical outer frame 11 surrounds a cylindrical inner plug, which supports a hologram shim 121 with a hologram image 122 against the inward extending lip 117 of the frame 111. Tube 67 with end connectors 73 and 75 fits within an enlarged bore 65 in the mold half 100, extends through bore 168 in the cylindrical frame 111 and engages threads 171 in the inner plug.
Figure 8 is a detail of the frame, rim 117 and hologram shim 121 within the cylindrical cavity 101.
Figure 9 shows a molded part 175 with a hologram surface 177 and a cylindrical depression 179 around the hologram surface. Figure 10 shows an oval frame 181 with an oval hologram shim 183. Figure 11 shows a triangular frame 185 with a triangular hologram shim 187.
Figures 12 and 13 show a schematic representation of an assembled insert assembly 10 with a frame 11 having sidewalls 13. An insert plug 15 is shown inserted in the frame with a hologram shim plate 21 positioned below the lip 17 of the frame. The frame includes bores 68 for insertion of heating and cooling tubes, and a guide 43 having a chamfered countersink 44, which loosely receives the retaining bolt 47 as shown in Figure 1.
The holographic shim 21 is supported by the temperature- controlled plug 15 and is held beneath the rim 17 of the frame 11. As shown, a ridge 191 may be formed around the frame for cooperating with a complementary surface feature in the mold recess 9 which receives the insert assembly to prevent excessive movement of the assembly 10 into the recess.
Figure 14 shows the mold assembly 10 being inserted into a recess 9, which has a spring or piston holder 193 in its base 195 to cooperate with compressible layer 31. Walls 197 of the recess have curved corners 198 to cooperate with the curved corners 199 of the insert assembly frame 11. The mold half 5 has a large base 201, and a smaller portion 203, in which the mold cavity 7 is formed. Retaining bolt 47 is inserted through counterbore 55 to engage internal threads. The end 45 of the retaining bolt 47 fits loosely in retaining recess 43 to allow inward and outward movement of the hologram insert assembly 10 during molding. Tubes 67 fit loosely within bores 65 and have joining ends 73 which are connected to internal threads 71 within the insert plug. Set screws 99 hold the insert assembly
10 assembled.
The described apparatus provides a device and a method for inserting and removing a hologram shim plate into and out of a part forming device. The invention provides a device and method for holding a hologram shim and for continuing to press the hologram shim against the part during the forming, cooling and shrinking of the part. The invention also provides the above systems in combination with the addition of an independent temperature control device for controlling the temperature of the hologram insert plug and the hologram shim.
The hologram insert assembly retaining screw 47 allows slight movement of the hologram assembly 10 during the molding operations .
Figure 15 schematically shows connections of the retaining bolt 47 and the temperature control tubes 67 with respect to the hologram insert assembly 10. The tubes 67 extend through bores 68 in the frame walls 13 into threaded receivers in the insert plug 15. The end of the retaining bolt 47 is positioned with clearance in the receiver 43 in the wall 13 of the frame
11 to limit movement of the hologram insert assembly 10 during molding.
After the insert assembly is placed in the mold, the temperature control system tubes 67 are inserted through the mold and the frame wall into the insert plug. The hologram retaining bolt 47 is inserted through the mold into the receiver 43 in the wall 13 of frame 11 to allow limited movement, the insert assembly 10 within the recess in the cavity.
Figure 16 shows the hologram insert assembly mounted in the recess in the cavity 7 of the mold half 5.
Figure 17 shows the mold half 5 positioned for receiving the upper mold half to close the cavity 7.
Figures 18 through 23 are details showing the hologram assembly mounted in the recess 9 of the cavity 7 in the lower mold half 5.
Figure 24 shows a holographic insert assembly 301 having a male or female hologram die 303, held by a vacuum applied through a foraminous layer 305 with solid sides on an electromagnet body 307 above a compressible layer 309. The entire die assembly 301 is positioned within a pocket 311 in a die 313. The die insert body 307 has one or more central openings 315 into which heaters 317 are inserted. A heater is connected to power circuits 319, which are in turn connected to a temperature controller 321 with an adjustable temperature control 323.
As shown in Figure 25, the holographic insert assembly 301 is held in the pocket 311 of die 313. As material 325 is formed under pressure between dies 313 and 331, the dies are heated. Heat is removed from dies 313 and 331, pressure is removed, and the material 325 begins to set. Surfaces 327 and 329 of the material 325, tend to shrink away from the die surfaces .
As the material 325 is placed into the dies 313 and 331, forming and forces are increased, the die insert 301 begins to move further into the pocket 311, compressing the compressible layer 309. As the pressure is decreased, the compressible material 309 forces the holographic insert assembly 301 toward the material 325, keeping the pressure on the surface 327 adjacent the hologram 303. Heat is maintained by heaters in the openings 315. In addition to controlling the holographic assembly temperature separate from the rest of the mold, the heaters, in conjunction with the compressible layer, enhance the image quality. During the insert assembly moves back and then returns as pressure is changed. The result is that a high level of embossing or coining takes place.
Figure 26 shows a holographic insert assembly 301 for inserting in the pocket 311 of the die 313. The compressible layer 309 supports the electromagnetic body 307 of the insert 301, and the holographic plate 303 is held on the insert 307 by vacuum and by magnetic force. The surface 333 of the holographic plate 303 contains a male or female holographic die. The surface 335 of the die 313 may be curved 337 for molding the products.
Line 339 controls a vacuum to hold the holographic die plate 303 on the body 307, and also provides a conduit for heater lines 319.
As shown schematically in the partial cross-section of Figure 27, the holographic die assembly 301 is held in the pocket 311 of die 313. The holographic plate 303 and the assembly may move inward and outward in relation to the pocket 311. Heaters 317 are positioned in cavities 315 within the insert body 307. Heater lines 319 connect the heaters to a temperature controllers 321, which provide temperature regulation of the heaters. The invention controls the hologram insert assembly temperature. The system has the ability to apply die pressure to flat or contour shapes . The system may be used in packaging for containing products and directly on products, such as on pills, toys and candy. The holograms may mold images directly on frames, clear covers, and directly on products such as calculators and computer parts and drawings.
In Figure 28 a holographic insert assembly 301 has a body 307 with a U-shaped cavity 341. Cavity 341 has an inlet 343 and an outlet 345. Fluid conduits 347 and 349 are connected to the respective inlet and outlet, and are connected to pump and heater 351 with a controller 353, which controls the temperature of the water or oil pumped through the conduits 347 and 349 and through the U-shaped cavity 341 in the body 307 of the insert 301. Precise control of temperature of the body 307 controls temperature of the holographic plate 303 and of the holographic surface 333. The holographic insert assembly 301 fits within pocket 311 in the die 313. Pocket 311 is equipped with mechanical springs or a compressible cushion, or alternatively is equipped with a pressurizing mechanism which controls pressure in the pocket to resist inward pressure on the body 307 and holographic plate 303 during injection and to drive the body and plate outward as the part shrinks after reduction and removal of the forming pressure.
Figure 29 shows a clear part 325 in which a holographic image 355 is formed on the rear surface 327 of the part. The holographic image is viewed from the front surface 329, as shown in Figure 30.
Figure 31 shows a part 325 on which holograms 355 and 357 are formed on the back and front of the plate . Viewing the holographic images produced by the holograms 355 and 357 at the same time produces an apparent hologram within a hologram.
Figure 32 shows several laminated plates 325 with holograms 355 formed on the rear surfaces. Viewing the holographic images produces the appearance of holograms within holograms .
Holograms may be formed on inner surfaces of clear, transparent or translucent parts, and the parts may be joined, abutting the holograms or spacing the holograms with plastic material or air.
The invention is useful in molding or casting, pressing or forming any products such as containers, caps, candy, pills, fasteners, packages; products of all kinds. The invention is especially useful where product protection and certainty of authentication and source is required or useful. All kinds of materials such as, for example, compressed or sintered powders, tablets, plastic or metal products may use the process and apparatus of the invention.
While the invention has been described with reference to specific embodiments, modifications and variations of the invention may be constructed without departing from the scope of the invention, which is defined in the following claims.

Claims

We claim :
1. Holographic image forming apparatus comprising: a frame for movably mounting in a recess in a mold; a block held in the frame; a holographic plate mounted on the block in the frame; and a force producer mounted in the recess beneath the block for urging the block outward in the mold.
2. The apparatus of claim 1, wherein the force producer comprises multiple springs in multiple cylinders at a bottom of the recess .
3. The apparatus of claim 1, wherein the force producer comprises a spring pad in a bottom of the recess .
4. The apparatus of claim 1, wherein the force producer comprises a resilient material in a bottom of the recess.
5. The apparatus of claim 1, wherein the force producer comprises a fluid-filled expansible chamber at a bottom of the recess .
6. The apparatus of claim 5, wherein the force producer further comprises a variable pressure source connected to the chamber.
7. The apparatus of claim 1, further comprising a lip on the frame overlying the holographic plate .
8. The apparatus of claim 1, wherein the force producer is mounted beneath the frame for moving the frame outward in the mold.
9. The apparatus of claim 8, further comprising lateral recesses in the frame and projections extending into the lateral recesses for limiting movement of the frame within the mold recess.
10. The apparatus of claim 9, wherein the projections are bolt ends extending into the lateral recesses from the mold, providing removal of the frame from the recess in the mold by withdrawing the bolt ends from the lateral recesses .
11. The apparatus of claim 1, further comprising a temperature controlling element in the block and at least one connector extending from the temperature-controlling element and the block and through the recess in the mold.
12. The apparatus of claim 11, further comprising at least one opening in a wall of the recess for extending the at least one connector out of the recess.
13. The apparatus of claim 1, further comprising a fluid conduit channel extending through the block for circulating temperature control fluid through the block.
14. The apparatus of claim 13, further comprising at least one tube extending from the fluid conduit channel out of the block and through a wall of the recess in the mold within at least one complementary opening which is larger than the tube for allowing movement of the tube in the opening.
15. The apparatus of claim 14, wherein the at least one tube extends laterally from the block, and wherein the at least one complementary opening is in a lateral wall of the recess in the mold.
16. The apparatus of claim 1, wherein the force producer is mounted beneath the frame for moving the frame outward in the mold, further comprising lateral recesses in the frame, bolt ends extending into the lateral recesses from the mold for limiting movement of the frame within the mold recess, and providing removal of the frame from the recess in the mold by withdrawing the bolt ends from the lateral recesses, a fluid conduit channel extending through the block for circulating temperature control fluid through the block, and tubes extending from the fluid conduit channel and laterally from the block and through a lateral wall of the recess in the mold within complementary openings which are larger than the tubes for allowing movement of the tubes in the openings.
17. A method of making a molded product with an integral holographic section, comprising: providing first and second mold halves; providing a recess in the first mold half; providing a block; placing a holographic plate on the block; placing the block and the holographic plate in a frame; placing the frame in the recess; closing the mold halves; forming a cavity between the mold halves; filling the cavity with molding material; forming the product in the cavity; urging the holographic plate toward the product in the cavity as the product sets in the cavity; and opening the mold halves and removing the product with the holographic section impressed on a surface of the product.
18. The method of claim 17, wherein the urging further comprises providing multiple springs in multiple cylinders beneath the block at a bottom of the recess, and moving the holographic plate and the block toward the product with the springs as the product sets in the cavity.
19. The method of claim 18, further comprising initially compressing the springs by moving the holographic plate and the block inward in the recess during the filling of the cavity.
20. The method of claim 17, further comprising providing a compressible pad beneath the block in a bottom of the recess.
21. The method of claim 17, further comprising providing a spring plate at a bottom of the recess.
22. The method of claim 17, further comprising providing an expansible chamber at a bottom of the recess.
23. The method of claim 17, further comprising providing a lip on the frame and holding the holographic plate and the block in the frame with the lip.
24. The method of claim 17, further comprising limiting movement of the frame within the recess by providing lateral recesses in the frame and extending projections from the first mold half into the lateral recesses.
25. The method of claim 24, wherein the extending projections comprises extending bolt ends from the first mold half into the lateral recesses and withdrawing the bolt ends from the lateral recesses for removing the frame, the block and the holographic plate from the recess.
26. The method of claim 17, further comprising controlling heat of the block and the holographic plate by a heat control element in the block and at least one connector extending from the element through a wall of the recess.
27. The method of claim 17, further comprising extending a fluid conduit through the block and controlling temperature of the block and the holographic plate with fluid in the fluid conduit, providing tubes extending from the conduit through openings in a wall of the recess, and circulating heat control fluid through the tubes and the conduit and moving the tubes in the openings during the urging of the holographic plate toward the cavity.
28. The method of claim 27, wherein the openings are provided in lateral walls of the recess and the tubes extend laterally from the block and move across the openings during the urging of the block and the holographic plate toward the cavity.
29. A product formed in a mold cavity, comprising a wall on the product having a set of holographic lines formed thereon during molding in a cavity formed between two mold halves, with a holographic plate and a block in a frame urged toward the wall during setting of the product in the mold cavity.
30. The product of claim 29, further comprising a second set of holographic lines on a surface of the product remote from and aligned with the wall and the first set of holographic lines .
31. A method of forming a hologram image in a surface of a molded article comprising providing a die set having at least one die, providing a pocket in the of least one die, providing a hologram die insert assembly in the pocket, providing a die insert body in the die insert assembly, providing a hologram plate on the body, supporting the die insert assembly in the pocket, supporting the die insert body movably in the pocket, supporting the hologram plate on the die insert body, filling the die set with a moldable material, molding the material in the die set, hardening and shrinking the material in the die set, and following the material as it shrinks in the die set with the die insert assembly by moving the die insert body outward in the pocket and pressing the hologram plate against the surface of the shrinking material as it hardens in the die set .
32. The method of claim 31, further comprising heating the die insert body.
33. The method of claim 31, wherein the supporting the die insert body in the pocket comprises providing a resilient pad beneath the die insert body in the pocket .
34. The method of claim 31, wherein the supporting the die insert body in the pocket further comprises providing at least one spring in the pocket beneath the die insert body.
35. The method of claim 31, wherein the supporting the die insert body in the pocket further comprises providing a compressible material in the pocket beneath the die insert body.
36. The method of claim 31, wherein the moldable material comprises a thermoforming plastic material.
37. Die apparatus comprising a die set having at least one die, a pocket in the die, a die insert assembly mounted in the pocket, the die insert assembly having a die insert body, a holographic plate mounted on the die insert body and a compressible material between the die insert body and a bottom of the pocket .
38. The die apparatus of claim 37, further comprising a heater connected to the die insert body.
39. The die apparatus of claim 38, wherein the heater is an electrical heater.
40. The die apparatus of claim 38, wherein the heater is a hot fluid circulating heater.
41. The die apparatus of claim 38, wherein the heater is separate from a die cavity heater.
42. The apparatus of claim 37, wherein the compressible material comprises a resilient pad mounted in the pocket below the die insert body.
43. The apparatus of claim 37, wherein the compressible material comprises a resilient pad connected to the die insert body opposite the holographic plate.
44. The apparatus of claim 37, wherein the compressible material comprises a compressible fluid in the pocket beneath the die insert body.
45. A die insert assembly for mounting in a pocket of a die comprising a die insert body, a holographic plate mounted on an outside of the die insert body and a resilient pad mounted on the die insert body opposite the holographic plate.
46. The die insert assembly of claim 45, further comprising a heater connected to the die insert body.
47. The die insert assembly of claim 46, wherein the heater is an electrical heater, and further comprising a heat control connected to the electrical heater for controlling temperature of the die insert body and the holographic plate .
48. The die insert assembly of claim 46, wherein the heater comprises fluid flow channels in the die insert body, fluid conduits connected to the fluid flow channels and a heat control connected to the fluid conduits.
49. he die insert assembly of claim 45, wherein the resilient pad is an elastomeric pad.
50. A molded article comprising a transparent panel with an outer surface and an inner surface opposite the outer surface and a holographic image molded in the inner surface of the transparent panel .
51. The molded article of claim 50, further comprising a second holographic image on the outer surface of the transparent panel .
52. The molded article of claim 50, further comprising multiple transparent panel layers with multiple outer surfaces and multiple inner surfaces, with multiple holographic images molded on the multiple inner surfaces and with the multiple transparent panel layers joined by lamination.
PCT/US2002/023414 2002-07-24 2002-07-24 Molded hologram apparatus method and product WO2004009336A1 (en)

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Cited By (7)

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WO2010085052A2 (en) 2009-01-20 2010-07-29 Lg Electronics Inc. Appliance having micro-pattern and method for fabricating structure having micro-pattern for appliance
WO2011131475A1 (en) * 2010-04-22 2011-10-27 U-Nica Technology Ag Object produced by a molding process and marked by a diffraction grating, and method for the production thereof
WO2012058565A3 (en) * 2010-10-29 2012-07-19 Nanoink, Inc. Injection molding of micron and nano scale features for pharmaceutical brand protection
WO2013165415A1 (en) * 2012-05-02 2013-11-07 Nanoink, Inc. Molding of micron and nano scale features
KR101913009B1 (en) 2016-04-26 2018-12-28 박행운 Method of generating product inserted truth distinction code using mold
CN110893734A (en) * 2019-12-16 2020-03-20 株洲瑞尔泰机电科技有限公司 Fill electric pile production and use shell embossing device

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Cited By (11)

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Publication number Priority date Publication date Assignee Title
NL1036359C2 (en) * 2008-12-23 2010-06-24 Bosch Sprang Beheer B V MOLDING DEVICE, MOLDING CAN, MOLDING AND METHOD FOR THERMOFORMING A PRODUCT.
WO2010085052A2 (en) 2009-01-20 2010-07-29 Lg Electronics Inc. Appliance having micro-pattern and method for fabricating structure having micro-pattern for appliance
EP2379962A2 (en) * 2009-01-20 2011-10-26 LG Electronics Inc. Appliance having micro-pattern and method for fabricating structure having micro-pattern for appliance
EP2379962A4 (en) * 2009-01-20 2012-06-13 Lg Electronics Inc Appliance having micro-pattern and method for fabricating structure having micro-pattern for appliance
US8834771B2 (en) 2009-01-20 2014-09-16 Lg Electronics Inc. Appliance having micro-pattern and method for fabricating structure having micro-pattern for appliance
WO2011131475A1 (en) * 2010-04-22 2011-10-27 U-Nica Technology Ag Object produced by a molding process and marked by a diffraction grating, and method for the production thereof
US9429911B2 (en) 2010-04-22 2016-08-30 U-Nica Technology Ag Object produced by a molding process and marked by a diffraction grating, and method for the production thereof
WO2012058565A3 (en) * 2010-10-29 2012-07-19 Nanoink, Inc. Injection molding of micron and nano scale features for pharmaceutical brand protection
WO2013165415A1 (en) * 2012-05-02 2013-11-07 Nanoink, Inc. Molding of micron and nano scale features
KR101913009B1 (en) 2016-04-26 2018-12-28 박행운 Method of generating product inserted truth distinction code using mold
CN110893734A (en) * 2019-12-16 2020-03-20 株洲瑞尔泰机电科技有限公司 Fill electric pile production and use shell embossing device

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