WO2004010114A3 - Device for wafer inspection - Google Patents

Device for wafer inspection Download PDF

Info

Publication number
WO2004010114A3
WO2004010114A3 PCT/EP2003/007677 EP0307677W WO2004010114A3 WO 2004010114 A3 WO2004010114 A3 WO 2004010114A3 EP 0307677 W EP0307677 W EP 0307677W WO 2004010114 A3 WO2004010114 A3 WO 2004010114A3
Authority
WO
WIPO (PCT)
Prior art keywords
illumination
axis
imaging
wafer inspection
inspected
Prior art date
Application number
PCT/EP2003/007677
Other languages
German (de)
French (fr)
Other versions
WO2004010114A2 (en
Inventor
Henning Backhauss
Original Assignee
Leica Microsystems
Henning Backhauss
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leica Microsystems, Henning Backhauss filed Critical Leica Microsystems
Priority to AU2003250961A priority Critical patent/AU2003250961A1/en
Priority to EP03764995A priority patent/EP1523670A2/en
Priority to JP2004522463A priority patent/JP2005533260A/en
Publication of WO2004010114A2 publication Critical patent/WO2004010114A2/en
Publication of WO2004010114A3 publication Critical patent/WO2004010114A3/en
Priority to US11/037,668 priority patent/US20050122509A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention relates to a device for wafer inspection. Said device comprises an incident light illumination element having an illumination axis and an imaging element having an imaging axis, both elements being inclined towards each other and oriented towards a region of the surface of the wafer, which is to be inspected. An imaging plane is defined by the illumination axis and the imaging axis by means of the bright field illumination adjustment of the device. The device is characterised in that the illumination axis rotated out of the imaging plane about a dark field angle Ϝ > 0 is arranged in such a way that a dark field illumination is present in the region to be inspected.
PCT/EP2003/007677 2002-07-18 2003-07-16 Device for wafer inspection WO2004010114A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2003250961A AU2003250961A1 (en) 2002-07-18 2003-07-16 Device for wafer inspection
EP03764995A EP1523670A2 (en) 2002-07-18 2003-07-16 Device for wafer inspection
JP2004522463A JP2005533260A (en) 2002-07-18 2003-07-16 Wafer inspection equipment
US11/037,668 US20050122509A1 (en) 2002-07-18 2005-01-18 Apparatus for wafer inspection

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10232781.5 2002-07-18
DE10232781A DE10232781B4 (en) 2002-07-18 2002-07-18 Device for wafer inspection

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/037,668 Continuation US20050122509A1 (en) 2002-07-18 2005-01-18 Apparatus for wafer inspection

Publications (2)

Publication Number Publication Date
WO2004010114A2 WO2004010114A2 (en) 2004-01-29
WO2004010114A3 true WO2004010114A3 (en) 2004-10-21

Family

ID=30010202

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2003/007677 WO2004010114A2 (en) 2002-07-18 2003-07-16 Device for wafer inspection

Country Status (5)

Country Link
EP (1) EP1523670A2 (en)
JP (1) JP2005533260A (en)
AU (1) AU2003250961A1 (en)
DE (1) DE10232781B4 (en)
WO (1) WO2004010114A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004029012B4 (en) * 2004-06-16 2006-11-09 Leica Microsystems Semiconductor Gmbh Method for inspecting a wafer
EP1744147B1 (en) * 2005-07-13 2009-12-09 Audi Ag Method and device for optical testing of carbon ceramic brake and clutch components
DE102007042271B3 (en) * 2007-09-06 2009-02-05 Vistec Semiconductor Systems Gmbh Methods for determining position of stripping edge of disk-shaped object, involves recording boundary region of object in line-by-line manner, where boundary region has stripping edge
TWI601952B (en) * 2016-01-25 2017-10-11 Wafer edge measurement module (a)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264912A (en) * 1992-02-07 1993-11-23 Tencor Instruments Speckle reduction track filter apparatus for optical inspection of patterned substrates
US5864394A (en) * 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
WO1999006823A1 (en) * 1997-08-01 1999-02-11 Kla-Tencor Corporation System for detecting anomalies and/or features of a surface
EP1102058A1 (en) * 1999-11-17 2001-05-23 Applied Materials, Inc. Method and apparatus for inspecting articles

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264912A (en) * 1992-02-07 1993-11-23 Tencor Instruments Speckle reduction track filter apparatus for optical inspection of patterned substrates
US5864394A (en) * 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
WO1999006823A1 (en) * 1997-08-01 1999-02-11 Kla-Tencor Corporation System for detecting anomalies and/or features of a surface
EP1102058A1 (en) * 1999-11-17 2001-05-23 Applied Materials, Inc. Method and apparatus for inspecting articles

Also Published As

Publication number Publication date
AU2003250961A8 (en) 2004-02-09
DE10232781A1 (en) 2004-02-05
AU2003250961A1 (en) 2004-02-09
WO2004010114A2 (en) 2004-01-29
DE10232781B4 (en) 2013-03-28
EP1523670A2 (en) 2005-04-20
JP2005533260A (en) 2005-11-04

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