WO2004012300A3 - Anisotropic conductive compound - Google Patents
Anisotropic conductive compound Download PDFInfo
- Publication number
- WO2004012300A3 WO2004012300A3 PCT/US2003/022980 US0322980W WO2004012300A3 WO 2004012300 A3 WO2004012300 A3 WO 2004012300A3 US 0322980 W US0322980 W US 0322980W WO 2004012300 A3 WO2004012300 A3 WO 2004012300A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- binder
- anisotropic conductive
- nickel
- conductive compound
- catalyst
- Prior art date
Links
- 150000001875 compounds Chemical class 0.000 title abstract 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 6
- 239000011230 binding agent Substances 0.000 abstract 3
- 229910052759 nickel Inorganic materials 0.000 abstract 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 2
- 125000003118 aryl group Chemical group 0.000 abstract 2
- 239000003054 catalyst Substances 0.000 abstract 2
- 239000007795 chemical reaction product Substances 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 2
- 239000004332 silver Substances 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 235000014113 dietary fatty acids Nutrition 0.000 abstract 1
- 239000000539 dimer Substances 0.000 abstract 1
- 150000002148 esters Chemical class 0.000 abstract 1
- 229930195729 fatty acid Natural products 0.000 abstract 1
- 239000000194 fatty acid Substances 0.000 abstract 1
- 150000004665 fatty acids Chemical class 0.000 abstract 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 abstract 1
Classifications
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- H—ELECTRICITY
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06526—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of metals
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- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06573—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder
- H01C17/06586—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the permanent binder composed of organic material
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
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- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- H—ELECTRICITY
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83909—Post-treatment of the layer connector or bonding area
- H01L2224/83951—Forming additional members, e.g. for reinforcing, fillet sealant
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- H01L2924/01033—Arsenic [As]
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- H01L2924/01047—Silver [Ag]
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- H01L2924/01061—Promethium [Pm]
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- H01L2924/01074—Tungsten [W]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01082—Lead [Pb]
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- H01L2924/0665—Epoxy resin
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003252121A AU2003252121A1 (en) | 2002-07-25 | 2003-07-24 | Anisotropic conductive compound |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/205,251 US6838022B2 (en) | 2002-07-25 | 2002-07-25 | Anisotropic conductive compound |
US10/205,251 | 2002-07-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004012300A2 WO2004012300A2 (en) | 2004-02-05 |
WO2004012300A3 true WO2004012300A3 (en) | 2004-06-10 |
Family
ID=30770029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/022980 WO2004012300A2 (en) | 2002-07-25 | 2003-07-24 | Anisotropic conductive compound |
Country Status (3)
Country | Link |
---|---|
US (1) | US6838022B2 (en) |
AU (1) | AU2003252121A1 (en) |
WO (1) | WO2004012300A2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
US7123332B2 (en) * | 2003-05-12 | 2006-10-17 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device, electronic device having the same, and semiconductor device |
DE102004014214B3 (en) * | 2004-03-23 | 2005-09-15 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Gluing system for fastening transponder chip to substrate uses thick layer of electrically conducting glue with matrix loaded with conducting particles forming bridges between electrodes |
KR101194201B1 (en) * | 2004-07-15 | 2012-10-25 | 세키스이가가쿠 고교가부시키가이샤 | Conductive microparticle, process for producing the same and anisotropic conductive material |
EP1861872A1 (en) * | 2005-03-24 | 2007-12-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for linking a chip and a substrate |
US20070224737A1 (en) * | 2006-03-21 | 2007-09-27 | Berlin Carl W | Method for creating and tuning Electromagnetic Bandgap structure and device |
US7785494B2 (en) * | 2007-08-03 | 2010-08-31 | Teamchem Company | Anisotropic conductive material |
WO2009035906A2 (en) * | 2007-09-11 | 2009-03-19 | Dow Corning Corporation | Composite, thermal interface material containing the composite, and methods for their preparation and use |
WO2009035907A2 (en) * | 2007-09-11 | 2009-03-19 | Dow Corning Corporation | Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use |
US20100252783A1 (en) * | 2009-04-07 | 2010-10-07 | Syh-Tau Yeh | Ambient-curable anisotropic conductive adhesive |
WO2013146604A1 (en) * | 2012-03-26 | 2013-10-03 | 積水化学工業株式会社 | Conductive material and connecting structure |
US9365749B2 (en) | 2013-05-31 | 2016-06-14 | Sunray Scientific, Llc | Anisotropic conductive adhesive with reduced migration |
US9777197B2 (en) | 2013-10-23 | 2017-10-03 | Sunray Scientific, Llc | UV-curable anisotropic conductive adhesive |
Citations (3)
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---|---|---|---|---|
US5225966A (en) * | 1991-07-24 | 1993-07-06 | At&T Bell Laboratories | Conductive adhesive film techniques |
US5344593A (en) * | 1991-03-27 | 1994-09-06 | Japan Synthetic Rubber Co., Ltd. | Electroconductive elastomer-forming composition |
US5965064A (en) * | 1997-10-28 | 1999-10-12 | Sony Chemicals Corporation | Anisotropically electroconductive adhesive and adhesive film |
Family Cites Families (23)
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US4170677A (en) | 1977-11-16 | 1979-10-09 | The United States Of America As Represented By The Secretary Of The Army | Anisotropic resistance bonding technique |
JPS5964685A (en) | 1982-10-05 | 1984-04-12 | Shin Etsu Polymer Co Ltd | Anisotropically conductive, heat-bondable film |
JPH0629367B2 (en) | 1985-12-02 | 1994-04-20 | ポリプラスチックス株式会社 | Conductive resin composition |
US4878978A (en) | 1986-06-19 | 1989-11-07 | Ashland Oil, Inc. | Bonding method employing high performance induction curable two-component structural adhesive with nonsagging behavior |
US4737112A (en) | 1986-09-05 | 1988-04-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Anisotropically conductive composite medium |
US5045249A (en) | 1986-12-04 | 1991-09-03 | At&T Bell Laboratories | Electrical interconnection by a composite medium |
FR2614130B1 (en) | 1987-04-15 | 1992-01-17 | Lorraine Carbone | MATERIAL HAVING A POSITIVE TEMPERATURE COEFFICIENT RESISTIVITY |
JPH04115407A (en) | 1990-09-03 | 1992-04-16 | Soken Kagaku Kk | Anisotropic conductive adhesive composite |
JPH04245109A (en) | 1991-01-31 | 1992-09-01 | Shin Etsu Chem Co Ltd | Anisotropic conductive film composition |
US5169471A (en) | 1991-07-29 | 1992-12-08 | Strasser Gene W | Auto electrical connecting circuit board assembly |
US5286417A (en) | 1991-12-06 | 1994-02-15 | International Business Machines Corporation | Method and composition for making mechanical and electrical contact |
US5453148A (en) | 1992-04-14 | 1995-09-26 | Industrial Technology Research Institute | Adhesive for connecting a circuit member to a substrate |
US5429701A (en) | 1992-04-14 | 1995-07-04 | Industrial Technology Research Institute | Method of electrically interconnecting conductors |
US5443876A (en) | 1993-12-30 | 1995-08-22 | Minnesota Mining And Manufacturing Company | Electrically conductive structured sheets |
US5769996A (en) | 1994-01-27 | 1998-06-23 | Loctite (Ireland) Limited | Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors |
WO1996000969A1 (en) | 1994-06-29 | 1996-01-11 | Robert Bosch Gmbh | Anisotropically conducting adhesive and process for its production |
US5851644A (en) | 1995-08-01 | 1998-12-22 | Loctite (Ireland) Limited | Films and coatings having anisotropic conductive pathways therein |
US5785913A (en) | 1996-05-30 | 1998-07-28 | Westinghouse Electric Corporation | Method of magnetically forming a particle filled polymer having enhanced material characteristics |
US5840215A (en) | 1996-12-16 | 1998-11-24 | Shell Oil Company | Anisotropic conductive adhesive compositions |
US6048599A (en) | 1997-01-17 | 2000-04-11 | 3M Innovative Properties Company | Susceptor composite material patterned in neat polymer |
US6190509B1 (en) | 1997-03-04 | 2001-02-20 | Tessera, Inc. | Methods of making anisotropic conductive elements for use in microelectronic packaging |
TW459032B (en) | 1998-03-18 | 2001-10-11 | Sumitomo Bakelite Co | An anisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesive |
US6171107B1 (en) | 1999-03-05 | 2001-01-09 | Robert H. Milne | Magnetic adhesive and removal apparatus and method |
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2002
- 2002-07-25 US US10/205,251 patent/US6838022B2/en not_active Expired - Fee Related
-
2003
- 2003-07-24 AU AU2003252121A patent/AU2003252121A1/en not_active Abandoned
- 2003-07-24 WO PCT/US2003/022980 patent/WO2004012300A2/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5344593A (en) * | 1991-03-27 | 1994-09-06 | Japan Synthetic Rubber Co., Ltd. | Electroconductive elastomer-forming composition |
US5225966A (en) * | 1991-07-24 | 1993-07-06 | At&T Bell Laboratories | Conductive adhesive film techniques |
US5965064A (en) * | 1997-10-28 | 1999-10-12 | Sony Chemicals Corporation | Anisotropically electroconductive adhesive and adhesive film |
Also Published As
Publication number | Publication date |
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AU2003252121A1 (en) | 2004-02-16 |
WO2004012300A2 (en) | 2004-02-05 |
US20040016911A1 (en) | 2004-01-29 |
US6838022B2 (en) | 2005-01-04 |
AU2003252121A8 (en) | 2004-02-16 |
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