WO2004019663A3 - The laminate structures and method for the electrical testing thereof - Google Patents

The laminate structures and method for the electrical testing thereof Download PDF

Info

Publication number
WO2004019663A3
WO2004019663A3 PCT/US2003/026874 US0326874W WO2004019663A3 WO 2004019663 A3 WO2004019663 A3 WO 2004019663A3 US 0326874 W US0326874 W US 0326874W WO 2004019663 A3 WO2004019663 A3 WO 2004019663A3
Authority
WO
WIPO (PCT)
Prior art keywords
sheet
thin
electrical testing
laminate structures
testing
Prior art date
Application number
PCT/US2003/026874
Other languages
French (fr)
Other versions
WO2004019663A2 (en
Inventor
Mark Dhaenens
Scott Mckee
William Zidar
Todd Bingham
Original Assignee
Park Electrochemical Corp
Mark Dhaenens
Scott Mckee
William Zidar
Todd Bingham
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Park Electrochemical Corp, Mark Dhaenens, Scott Mckee, William Zidar, Todd Bingham filed Critical Park Electrochemical Corp
Priority to AU2003262924A priority Critical patent/AU2003262924A1/en
Publication of WO2004019663A2 publication Critical patent/WO2004019663A2/en
Publication of WO2004019663A3 publication Critical patent/WO2004019663A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

A method for testing for defects in a thin-laminate structure suitable for use in a number of different applications, including the manufacture of capacitive PCBs, is provided in which the testing is conducted on the thin-laminate sheet immediately after lamination but prior to formation of multiple panels from the sheet. The invention includes a thin-laminate sheet that is constructed so that the two conductive layers are electrically isolated from one another along the peripheral edges of the sheet.
PCT/US2003/026874 2002-08-26 2003-08-26 The laminate structures and method for the electrical testing thereof WO2004019663A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003262924A AU2003262924A1 (en) 2002-08-26 2003-08-26 The laminate structures and method for the electrical testing thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40629302P 2002-08-26 2002-08-26
US60/406,293 2002-08-26

Publications (2)

Publication Number Publication Date
WO2004019663A2 WO2004019663A2 (en) 2004-03-04
WO2004019663A3 true WO2004019663A3 (en) 2004-04-01

Family

ID=31946964

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/026874 WO2004019663A2 (en) 2002-08-26 2003-08-26 The laminate structures and method for the electrical testing thereof

Country Status (2)

Country Link
AU (1) AU2003262924A1 (en)
WO (1) WO2004019663A2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5802471A (en) * 1994-12-28 1998-09-01 Ntt Mobile Communications Network, Inc. Mobile communication system, automatic call receiving method, and mobile station
US6114015A (en) * 1998-10-13 2000-09-05 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6134433A (en) * 1996-12-09 2000-10-17 Telefonaktiebolaget L M Ericsson (Publ) System and method of forwarding data calls in a radio telecommunications network
US6256513B1 (en) * 1997-01-07 2001-07-03 Matsushita Electric Industrial Co., Ltd. Multimedia terminal device
US6370394B1 (en) * 1997-04-30 2002-04-09 Nokia Mobile Phones Limited System and a method for transferring a call and a mobile station
US6404615B1 (en) * 2000-02-16 2002-06-11 Intarsia Corporation Thin film capacitors

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5802471A (en) * 1994-12-28 1998-09-01 Ntt Mobile Communications Network, Inc. Mobile communication system, automatic call receiving method, and mobile station
US6134433A (en) * 1996-12-09 2000-10-17 Telefonaktiebolaget L M Ericsson (Publ) System and method of forwarding data calls in a radio telecommunications network
US6256513B1 (en) * 1997-01-07 2001-07-03 Matsushita Electric Industrial Co., Ltd. Multimedia terminal device
US6370394B1 (en) * 1997-04-30 2002-04-09 Nokia Mobile Phones Limited System and a method for transferring a call and a mobile station
US6114015A (en) * 1998-10-13 2000-09-05 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6404615B1 (en) * 2000-02-16 2002-06-11 Intarsia Corporation Thin film capacitors

Also Published As

Publication number Publication date
AU2003262924A8 (en) 2004-03-11
WO2004019663A2 (en) 2004-03-04
AU2003262924A1 (en) 2004-03-11

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