WO2004023510A3 - Capacitively coupled plasma reactor with uniform radial distribution of plasma - Google Patents

Capacitively coupled plasma reactor with uniform radial distribution of plasma Download PDF

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Publication number
WO2004023510A3
WO2004023510A3 PCT/US2003/027538 US0327538W WO2004023510A3 WO 2004023510 A3 WO2004023510 A3 WO 2004023510A3 US 0327538 W US0327538 W US 0327538W WO 2004023510 A3 WO2004023510 A3 WO 2004023510A3
Authority
WO
WIPO (PCT)
Prior art keywords
bias power
conductor
working surface
sleeve
plasma
Prior art date
Application number
PCT/US2003/027538
Other languages
French (fr)
Other versions
WO2004023510A2 (en
Inventor
Jang Gyoo Yang
Daniel J Hoffman
James D Carducci
Douglas A Buchberger Jr
Robert B Hagen
Matthew L Miller
Kang-Lie Chiang
Gerardo A Delgadino
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to JP2004534479A priority Critical patent/JP4698222B2/en
Publication of WO2004023510A2 publication Critical patent/WO2004023510A2/en
Publication of WO2004023510A3 publication Critical patent/WO2004023510A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J7/00—Details not provided for in the preceding groups and common to two or more basic types of discharge tubes or lamps
    • H01J7/24—Cooling arrangements; Heating arrangements; Means for circulating gas or vapour within the discharge space

Abstract

A plasma reactor for processing a semiconductor wafer (20) includes a wall (5) and an overhead ceiling (10) defining a chamber, a workpiece support cathode (105) within the chamber having a surface facing the ceiling (10) for supporting a process gas inlets for introducing process gas (25) into the chamber and an RF bias power generator (40) having a bias power frequency. There is a bias power feed at the working surface and an RF conductor is connected between the RF bias power generator and the bias power feed point at the working surface. A dielectric sleeve surrounds a portion of conductor, the sleeve having an axial length along the RF conductor, a dielectric constant and an axial location along the RF conductor, the length, dielectric constant and location of the sleeve being such that the sleeve provides a reactance that enhances plasma ion density uniformity over the working surface. In accordance with a further aspect, the reactor can include an annular RF having an inner diameter corresponding generally to a periphery of the workpiece, the RF coupling ring extending a sufficient portion of a distance between the working surface and the overhead electrode to enhance plasma density near a periphery of workpiece.
PCT/US2003/027538 2002-09-04 2003-09-03 Capacitively coupled plasma reactor with uniform radial distribution of plasma WO2004023510A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004534479A JP4698222B2 (en) 2002-09-04 2003-09-03 Capacitively coupled plasma reactor that distributes plasma uniformly in radial direction

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/235,988 2002-09-04
US10/235,988 US6900596B2 (en) 2002-07-09 2002-09-04 Capacitively coupled plasma reactor with uniform radial distribution of plasma

Publications (2)

Publication Number Publication Date
WO2004023510A2 WO2004023510A2 (en) 2004-03-18
WO2004023510A3 true WO2004023510A3 (en) 2006-07-13

Family

ID=31977594

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/027538 WO2004023510A2 (en) 2002-09-04 2003-09-03 Capacitively coupled plasma reactor with uniform radial distribution of plasma

Country Status (6)

Country Link
US (1) US6900596B2 (en)
JP (1) JP4698222B2 (en)
KR (1) KR100882757B1 (en)
CN (1) CN100532637C (en)
TW (1) TWI348333B (en)
WO (1) WO2004023510A2 (en)

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