WO2004023574A1 - Methods for producing full-color organic electroluminescent devices - Google Patents

Methods for producing full-color organic electroluminescent devices Download PDF

Info

Publication number
WO2004023574A1
WO2004023574A1 PCT/US2003/027424 US0327424W WO2004023574A1 WO 2004023574 A1 WO2004023574 A1 WO 2004023574A1 US 0327424 W US0327424 W US 0327424W WO 2004023574 A1 WO2004023574 A1 WO 2004023574A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
wells
electroluminescent
dopant
depositing
Prior art date
Application number
PCT/US2003/027424
Other languages
French (fr)
Other versions
WO2004023574A8 (en
Inventor
Gang Yu
Gordana Srdanov
Matthew Stainer
Original Assignee
E.I. Du Pont De Nemours And Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by E.I. Du Pont De Nemours And Company filed Critical E.I. Du Pont De Nemours And Company
Priority to KR1020057003747A priority Critical patent/KR101059008B1/en
Priority to CA002497691A priority patent/CA2497691A1/en
Priority to JP2004534430A priority patent/JP2005538511A/en
Priority to EP03749326A priority patent/EP1535352B1/en
Priority to AT03749326T priority patent/ATE479202T1/en
Priority to AU2003268365A priority patent/AU2003268365A1/en
Priority to DE60333926T priority patent/DE60333926D1/en
Publication of WO2004023574A1 publication Critical patent/WO2004023574A1/en
Publication of WO2004023574A8 publication Critical patent/WO2004023574A8/en
Priority to HK06104149.6A priority patent/HK1084232A1/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/125OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/17Passive-matrix OLED displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/35Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118Masterslice integrated circuits
    • H01L27/11803Masterslice integrated circuits using field effect technology
    • H01L27/11807CMOS gate arrays
    • H01L2027/11809Microarchitecture
    • H01L2027/11859Connectibility characteristics, i.e. diffusion and polysilicon geometries
    • H01L2027/11861Substrate and well contacts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/17Passive-matrix OLED displays
    • H10K59/173Passive-matrix OLED displays comprising banks or shadow masks
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to methods for the production of organic electroluminescent (EL) devices that display full-color images, such as full- color organic light emitting diodes (OLEDs).
  • EL organic electroluminescent
  • OLEDs Organic light emitting diodes
  • Such displays are especially promising for battery- powered, portable electronic devices, including cell-phones, personal digital assistants, handheld personal computers, and DVD players.
  • These applications call for displays with high information content, full color, and fast video rate response time in addition to low power consumption.
  • the invention provides methods for the production of organic electroluminescent (EL) devices.
  • Substrates used in the methods of the invention for production of EL devices do not require CF 4 plasma surface treatment prior to deposition of electroluminescent material.
  • the invention methods are particularly useful in the production of EL devices where ink-jetting is used to deposit electroluminescent material.
  • the invention methods are useful for producing both subpixellated and non-subpixellated devices.
  • the invention methods are useful for producing EL devices which contain one type of EL material or several types of EL material.
  • EL devices produced by providing a substrate, depositing an anode layer onto the substrate, establishing a plurality of discreet wells on the substrate, wherein the discreet wells are formed by circumscribing walls to form the wells, depositing an un-pattemed buffer layer onto the anode layer in each of the wells, depositing an un-pattemed EL host polymer layer into each of said wells, depositing at least one patterned dopant layer in at least one of said wells without prior surface treatment of the walls of the well, and depositing a cathode layer, thereby producing an organic electroluminescent (EL) device.
  • EL organic electroluminescent
  • full- color, subpixellated organic EL devices produced by providing a substrate, depositing an anode layer onto the substrate, establishing a plurality of discreet wells in sets of three on the substrate, wherein the discreet wells are formed by circumscribing walls to form the wells, wherein each well defines a subpixel and each set of three wells defines a pixel, depositing an un-patterned buffer layer onto the anode layer in each of the wells, depositing an un-patterned EL host polymer layer selected to produce blue light in each of the wells, depositing a first patterned dopant layer selected to produce red light in a first well in at least one of the set of three wells without prior surface treatment of the walls of the well, depositing a second patterned dopant layer selected to produce green light in a second well in at least one of the set of three wells without prior surface treatment of the walls of the well, and depositing a cathode layer, thereby producing an electroluminescent device.
  • electroluminescent devices including a substrate having a plurality of discreet wells, wherein each of the discreet wells has at least one wall surface that is substantially free of fluorine.
  • the present invention relates to electroluminescent devices having a plurality of first and second subpixels, containing at least one layer of electroluminescent polymer, wherein the electroluminescent polymer layer in at least one of the first subpixels has diffused therein a first dopant, and the electroluminescent polymer layer in at least one of the second subpixels has diffused therein a second dopant, and the at least one first subpixel exhibits a photoluminescence spectrum displaying emission only from the first dopant, and the at least one second subpixel exhibits a photoluminescence spectrum displaying emission only from the second dopant.
  • Figs. 1-3 illustrate exemplary alternative device structures prepared according to the methods of the invention.
  • Fig. 4 illustrates intensity voltage dependence of a blue pixel (single layer) and a red pixel (bilayer) processed by coating blue and red polymers.
  • Fig. 5 illustrates EL emission spectra with single layer EL polymers.
  • Fig. 6 illustrates EL emission spectra produced by a device with the structure shown in Fig. 1.
  • Fig. 7 illustrates EL spectra with single layer EL polymers doped with fluorescent dopants: green dopant C545T (peak maxima -520 nm) and red dopant DCJTB (peak maxima -650 nm.
  • Fig. 8 illustrates EL spectra with single layer polymers doped with green and red fluorescent Ir complexes.
  • Fig. 9 illustrates EL emission spectra with single layer EL polymers doped with fluorescent dopants.
  • Fig. 10 illustrates photoluminescent spectra of CN-PPP/Dopants under UV illumination (emission in 300 to 400 nm range is due to the UV excitation source ).
  • a method for producing an organic electroluminescent (EL) device comprising: a) providing a substrate, b) depositing an anode layer onto said substrate, c) establishing a plurality of discreet wells on said substrate, wherein said discreet wells are formed by circumscribing walls to form said wells, d) depositing an un-patterned buffer layer onto said anode layer in each of said wells, e) depositing an un-patterned EL host polymer layer into each of said wells, f) depositing at least one patterned dopant layer in at least one of said wells without prior surface treatment of said walls of said well, and g) depositing a cathode layer, thereby producing an organic electroluminescent (EL) device.
  • EL organic electroluminescent
  • a method for producing a full-color, subpixellated organic electroluminescent (EL) device comprising: a) providing a substrate, b) depositing an anode layer onto said substrate, c) establishing a plurality of discreet wells in sets of three on said substrate, wherein said discreet wells are formed by circumscribing walls to form said wells, wherein each well defines a subpixel and each set of three wells defines a full-color pixel, d) depositing an un-patterned buffer layer onto said anode layer in each of said wells, e) depositing an un-patterned EL host polymer layer selected to produce blue light in each of said wells, f) depositing a first patterned dopant layer selected to produce red light in a first well in at least one of said set of three wells without prior surface treatment of said walls of said well, g) depositing a second patterned dopant layer selected to produce green light in a second well in at least one of said set of
  • un-patterned when used in conjunction with an organic layer used in the production of an EL device, means that the organic layer has been deposited across the entire pixel array, as opposed to being deposited in a specific pattern across the pixel array.
  • the term "patterned", when used in conjunction with a dopant layer used in the production of an EL device, means that the dopant is deposited into specified wells within specified pixels across the pixel array.
  • the phrase "surface treatment” refers to a process commonly used in the art to modify the wetting properties of the walls of wells in subpixellated EL devices.
  • “Surface treatment” refers to exposure to a dry plasma, using CF gas after the wells are formed with walls made of organic materials, such as photoresists or acrylic resins.
  • the surface of the substrate and the walls of the wells are substantially fluorinated.
  • fluorinated means that fluorine is associated with the surface of the substrate. Fluorine may be associated with the surface in a number of ways, for example, the fluorine may be physically adsorbed onto the surface, chemically bonded to the surface, and the like.
  • the terms “comprises,” “comprising,” “includes,” “including,” “has,” “having” or any other variation thereof, are intended to cover a non-exclusive inclusion.
  • a process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
  • “or” refers to an inclusive or and not to an exclusive or. For example, a condition A or B is satisfied by any one of the following: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), and both A and B are true (or present).
  • Figure 1 illustrates one embodiment of the invention for producing full-color EL devices.
  • the substrate is either embedded with microcircuitry (active matrix substrate) or has no embedded microcircuitry (passive matrix substrate).
  • a rigid or flexible substrate 10 is provided with a patterned anode layer 20, and then walls 30 are provided so as to form a plurality of wells in sets of three on the substrate.
  • the wells may have any convenient shape, for example, rectangular, circular (including oval-shaped), triangular, and the like.
  • the walls form rectangular wells.
  • Each well contains an anode and forms a subpixel, and each set of three wells forms a pixel.
  • the walls may be constructed from organic material such as epoxy resin, acrylic resin, polyimide resin, and the like, or the walls may be constructed from inorganic material such as glass. Conventional photolithography techniques may be used to form the pattern of walls and wells. Upon complete fabrication of the device, the three subpixels will emit the three primary display colors, i.e., red, green, and blue. Electronic devices containing subpixels improve the contrast of a device and prevent light from leaking between pixels.
  • anode surface is then cleaned to remove surface contaminants using methods well known to those skilled in the art (for example, see US Patent No. 5,798,170).
  • an un-patterned buffer layer 40 is deposited onto the anode layer 20, and an un-patterned blue EL polymer layer 50 is then coated over the entire active area (i.e., all of the subpixels) by methods well-known to those skilled in the art e.g., spin coating, silk-screen printing, and the like.
  • the un-patterned blue EL polymer layer can serve as a host to receive green and red dopants in their respective subpixels for formation of a full-color display.
  • subpixels that emit green and red light are next formed by ink-jetting drops of polymer solutions containing green dopant into a first set of subpixels and ink-jetting drops of polymer solutions containing red dopant into a second set of subpixels to form the green 52 and red 54 EL polymer layers.
  • the polymer solutions contain small amounts of green and red dopants in a polymer host material, wherein the polymer host material is the same polymer used for the un- patterned blue EL polymer layer 50.
  • blend layers 56 and 58 Fig.
  • a cathode material 60 is deposited over the entire surface to complete the device.
  • the term “monolayer” refers to a host EL polymer having a dopant diffused therein with a uniform density distribution, wherein the photoluminescence spectrum of the host EL polymer containing dopant diffused therein displays emission from the dopant only.
  • the term “blend layer” refers to an EL polymer layer that is formed when the same EL polymer is used in consecutive deposition steps, doped or undoped, for the purpose of introducing specific dopants into the layer that alter the characteristic luminescence of that layer.
  • the blend layer can have a gradient density distribution and exhibit the characteristic photoluminescence of both the host and the dopant, or it can have the uniform density distribution of a monolayer as defined above.
  • Figure 2 illustrates another embodiment of the invention methods for producing full-color EL devices.
  • patterned green and red polymer layers 52 and 54 may be deposited into two of the three wells in a pixel, Fig. 2A, before an un-patterned blue EL polymer 50 is deposited, Fig. 2B.
  • the un-patterned buffer layer 40 coating alone that prevents wetting of the walls by the dopant layers when they are deposited in the subpixels.
  • the host polymer for the green and red dopants is the same polymer used for the un-patterned blue EL polymer layer 50.
  • blend layers 56 and 58 can be formed, Fig. 2C.
  • a cathode layer 60 is deposited to complete the device, Fig. 2D.
  • An additional un-patterned organic layer 70 which conducts electrons and may or may not emit light, is coated before the cathode 60 and after the EL polymer layers 50, 56 and 58.
  • This additional layer which lies adjacent to the cathode layer 60, facilitates injection and transport of electrons from the cathode into the EL polymer and/or eliminates EL quenching due to the cathode.
  • the manufacture of EL devices according to the invention is advantageous for several reasons. For example, blue pixels and blue subpixels are formed by an un-patterned deposition process (e.g., spin coating). Thus, emission homogeneity and device performance are both optimized.
  • the process time for formation of each of the polymer layers is markedly reduced by eliminating ink-jet processing time and setting time for the buffer and blue EL polymer layers. This further reduction in process time also contributes to improved device performance (both efficiency and operation life).
  • the gradient density profile in the green and red subpixels is readily tuned by the wetting process when a dopant is deposited from solution using the same host polymer as used for the un- patterned blue EL polymer layer. This tuning provides an effective means to optimize emission of the OLED and thus the device performance. Indeed, since the same blue light-emitting EL materials used for blue subpixels are used as host materials for green and red subpixels, the intensity vs. voltage dependence of the red, green and blue subpixels follows the same trends.
  • the optional un-patterned organic layer 70 adjacent to the cathode layer 60 in Fig. 3 facilitates injection and transport of electrons into the EL layer, thereby providing an additional means for optimizing device performance.
  • the diffusion of the green and red dopants into the blue EL host polymer can be uniform and complete. Indeed, as set forth in Examples 6, 7, 8, 10, 11 and 12 and in Figure 10, the inventive EL devices contain green and red subpixels which exhibit photoluminescence spectra displaying emission from the green and red dopants only.
  • EL devices comprising a substrate, an anode layer, an electroluminescent polymer layer selected to produce blue light, and a cathode layer, wherein in at least one first subpixel the electroluminescent polymer layer has diffused therein a first dopant selected to produce red light and in at least one second subpixel the electroluminescent polymer layer has diffused therein a second dopant selected to produce green light, wherein the at least one first subpixel exhibits a photoluminescence spectrum displaying emission only from the first dopant, and the at least one second subpixel exhibits a photoluminescence spectrum displaying emission only from the second dopant.
  • the methods of this invention are not limited to producing red, green, and blue subpixellated full-color displays, but can be used to form any number of subpixels with any combination of characteristic emissions, based on the properties of the electroluminescent materials used.
  • EL devices are produced according to the methods of the invention, there is no need for surface treatment of the substrate prior to deposition of either the un-patterned blue EL polymer or the red and green dopant materials.
  • plasma surface treatment of wells prior to deposition of polymer layers can damage the underlying substrate and especially damage the transistors embedded in the substrate of an active matrix device. Indeed, the surfaces of the walls of the wells employed in the invention EL devices are substantially free of fluorine.
  • the phrase "substantially free of fluorine” means that the surfaces contain an amount of fluorine which is normally present, based on the composition of the materials, and is to be distinguished from an amount of fluorine that would be present on the surface after surface treatment with CF 4 .
  • Substrates 10 contemplated for use in the practice of the invention can be flexible or rigid, organic or inorganic. Generally, glass or organic films in either rigid or flexible form are used as a support.
  • the anode layer 20 is an electrode that is more efficient for injecting holes compared to the cathode layer.
  • the anode can include materials containing a metal, mixed metal, alloy, metal oxide or mixed oxide. Suitable materials include, but are not limited to, the mixed oxides of the Group 2 elements (i.e., Be, Mg, Ca, Sr, Ba, Ra), the Group 11 elements, the elements of Groups 4, 5, and 6, and the Group 8-10 transition elements.
  • mixed oxides of Groups 12, 13 and 14 elements such as indium- tin-oxide
  • the phrase "mixed oxide” refers to oxides having two or more different cations selected from the Group 2 elements or the Groups 12, 13, or 14 elements.
  • materials for the anode layer include indium-tin-oxide ("ITO"), aluminum-tin-oxide, gold, silver, copper, and nickel.
  • the anode may also comprise an organic material, such as a conducting polyaniline (G. Gustafsson, Y. Cao, G. M. Treacy, F. Klavetter, N. Colaneri, and A.J. Heeger, Nature 357, 477 (1992)), PEDOT-PSSA (Y. Cao, G. Yu, C. Zhang, R. Menon and AJ. Heeger, Synth. Metals, 87, 171 (1997)) and poIypyrrole-4-dodecylbenzenesulfonic acid (DBSA) (J. Gao, AJ. Heeger, J.Y. Lee and CN. Kim, Synth. Metals 82, 221 (1996)).
  • a conducting polyaniline G. Gustafsson, Y. Cao, G. M. Treacy, F. Klavetter, N. Colaneri, and A.J. Heeger, Nature 357, 477 (1992)
  • PEDOT-PSSA Y. Cao
  • the anode layer may be formed by a chemical or physical vapor deposition process or by a spin-cast process.
  • Chemical vapor deposition may be performed as a plasma-enhanced chemical vapor deposition ("PECVD") or metal organic chemical vapor deposition ("MOCVD”).
  • Physical vapor deposition can include all forms of sputtering, including ion beam sputtering, as well as e-beam evaporation and resistance evaporation.
  • Specific forms of physical vapor deposition include rf magnetron sputtering and inductively-coupled plasma physical vapor deposition ("IMP-PVD"). These deposition techniques are well known within the semiconductor fabrication arts.
  • the anode layer is patterned using a lithographic operation.
  • the pattern may vary as desired.
  • the layers can be formed in a pattern by, for example, positioning a patterned mask or resist on the first flexible composite barrier structure prior to applying the first electrical contact layer material.
  • the layers can be applied as an overall layer (also called blanket deposit) and subsequently patterned using, for example, a patterned resist layer and wet chemical or dry etching techniques. Other processes for patterning that are well known in the art can also be used.
  • the electronic devices form a passive matrix array
  • the anode layer typically is formed into substantially parallel strips having lengths that extend in substantially the same direction.
  • the anode layer is patterned to form a discrete electrode for each electronic device, or subpixel.
  • the buffer layer 40 functions to facilitate injection of holes into the EL polymer layer and to smoothen the anode surface to prevent shorts in the device.
  • Buffer layers are typically polymeric materials, such as polyaniline (PA ⁇ I) or polyethylenedioxythiophene (PEDOT), which are often doped with protonic acids, or can be organic charge transfer compounds, and the like, such as the tetrathiafulvalene- tetracyanoquinodimethane system (TTF-TC ⁇ Q).
  • Protonic acids contemplated for use in the practice of the invention include, for example, poly(styrenesulfonic acid), poly(2-acrylamido-2-methyl-1-propanesulfonic acid), and the like.
  • the buffer layer is usually cast onto substrates using a variety of techniques well known to those skilled in the art. Typical casting techniques include, for example, solution casting, drop casting, curtain casting, spin-coating, screen printing, inkjet printing, and the like. Alternatively, the buffer layer can be patterned using a number of such processes, such as ink-jet printing.
  • the electroluminescent (EL) layer 50 may typically be a conjugated polymer such as poly(paraphenylenevinylene) (PPV), PPV copolymers, polyfluorenes, polyphenylenes, polyacetylenes, polyalkylthiophenes, and the like.
  • PPV poly(paraphenylenevinylene)
  • PPV copolymers polyfluorenes, polyphenylenes, polyacetylenes, polyalkylthiophenes, and the like.
  • the particular material chosen may depend on the specific application, voltage potentials used during operation, or other factors.
  • the EL layer can also be made with oligomers or dendrimers
  • Dopants contemplated for use in the practice of the invention are typically organometallic materials.
  • Exemplary metals contemplated for use include lanthanide metals (e.g., Eu, Tb), Group 7 metals (e.g., Re), Group 8 metals (e.g., Ru, Os), Group 9 metals (e.g., Rh, Ir), Group 10 metals (e.g., Pd, Pt), Group 11 metals (e.g., Au), Group 12 metals (e.g., Zn), Group 13 metals (e.g., Al), and the like.
  • the organometallic materials may be cyclometallated complexes of Ir or Pt, with ligands such as phenylpyridines.
  • the organometallic materials may be functionalized polymers comprising functional groups coordinated to at least one metal.
  • the metals may be those discussed above.
  • Exemplary functional groups contemplated for use include carboxylic acids, carboxylic acid salts, sulfonic acid groups, sulfonic acid salts, groups having an OH moiety, amines, imines, diimines, N-oxides, phosphines, phosphine oxides, ⁇ -dicarbonyl groups, and the like.
  • Typical polymeric organometallic dopants contemplated for use in the practice of the invention are disclosed in Published PCT Application No. WO 02/31896, the entire contents of which are incorporated herein by reference.
  • Dopants contemplated for use in the practice of the invention can also be an organic dye molecule such as 4-dicyanmethylene-2-methyl-6- (p-dimethyaminostyryl)-4H-pyran (DCM), coumarin and the like.
  • DCM 4-dicyanmethylene-2-methyl-6- (p-dimethyaminostyryl)-4H-pyran
  • Dopants contemplated for use in the practice of the invention can also be a red or green EL polymer in conjugated or non-conjugated form.
  • each pixel column contains three subpixels wherein one subpixel emits red light, one subpixel emits green light, and one subpixel emits blue light (with emission profile dominating in 400-500 nm range).
  • an optional un-patterned layer 70 may be deposited prior to deposition of the cathode layer.
  • This optional layer can function both to facilitate electron injection/transport, and also serve as a confinement layer to prevent quenching reactions at layer interfaces. More specifically, this layer may promote electron mobility and reduce the likelihood of a quenching reaction if the EL polymer layer and the cathode layer would otherwise be in direct contact.
  • Examples of materials for this optional un-patterned layer include metal-chelated oxinoid compounds (e.g., Alq3 or the like); phenanthroline-based compounds (e.g., 2,9-dimethyl-4,7-diphenyl-1 ,10-phenanthroline ("DDPA"), 4,7-diphenyl- 1 ,10-phenanthroline (“DPA”), or the like); azole compounds (e.g., 2-(4- biphenylyl)-5-(4-t-butylphenyl)-1 ,3,4-oxadiazole (“PBD” or the like), 3-(4- biphenylyl)-4-phenyl-5-(4-t-butylphenyl)-1 ,2,4-triazole (“TAZ” or the like); other similar compounds; or any one or more combinations thereof.
  • metal-chelated oxinoid compounds e.g., Alq3 or the like
  • phenanthroline-based compounds e.g., 2,9-
  • the optional unpatterned layer may be inorganic and comprise BaO, LiF, Li 2 0, or the like.
  • This optional unpatterned layer can also be an oligomer, dendrimer or conjugated polymer. Examples of conjugated polymers for this layer are provided in Published PCT Application No. WO 01/77203.
  • the cathode layer 60 is an electrode that is particularly efficient for injecting electrons or negative charge carriers.
  • the cathode layer can be any metal or nonmetal having a lower work function than the first electrical contact layer (in this case, the anode layer).
  • the term "lower work function” is intended to mean a material having a work function no greater than about 4.4 eV.
  • “higher work function” is intended to mean a material having a work function of at least approximately 4.4 eV.
  • Materials for the cathode layer can be selected from alkali metals of Group 1 (e.g., Li, Na, K, Rb, Cs,), the Group 2 metals (e.g., Mg, Ca, Ba, or the like), the Group 12 metals, the lanthanides (e.g., Ce, Sm, Eu, or the like), and the actinides (e.g., Th, U, or the like).
  • the cathode comprises materials such as aluminum, indium, yttrium, barium, lithium, cerium, cesium, europium, rubidium, magnesium, samarium, and combinations thereof.
  • the cathode can also be a metal alloy, for example, BaAI, LiAI, CaAI, Cain, and the like, or can be in a multiple layer form with each layer containing a different metal or metal alloy composition. In this case, only the layer adjacent to the organic emission layer or optional electron transport layer requires a lower work function.
  • the thickness of the first layer is typically in the range of 1-300 nm.
  • the cathode layer is usually formed by a chemical or physical vapor deposition process.
  • the cathode layer can be patterned, as discussed above in reference to the anode layer, or un-patterned. If the device lies within a passive matrix array, the cathode layer may be patterned into substantially parallel strips, where the lengths of the cathode layer strips extend in substantially the same direction and substantially perpendicular to the lengths of the anode layer strips.
  • the pixels are formed at the cross points (where an anode layer strip intersects a cathode layer strip when the array is seen from a plan or top view).
  • the cathode can be un-patterned, or monolithic, with the pixels and subpixels defined by the patterning of the anode layer.
  • the different layers may have any suitable thickness.
  • the inorganic anode layer is usually no greater than approximately 500 nm, for example, approximately 10-200 nm; the buffer layer is usually no greater than approximately 500 nm, for example, approximately 20-200 nm; the EL layer is usually no greater than approximately 200 nm, for example, approximately 10-80 nm; the optional un-patterned layer is usually no greater than approximately 100 nm, for example, approximately 20-80 nm; and the cathode layer is usually no greater than approximately 1000 nm, for example, approximately 50-500 nm. If the anode layer or the cathode layer needs to transmit at least some light, the thickness of such layer may not exceed approximately 100 nm.
  • OLEDs organic light emitting diodes
  • electrons and holes injected from the cathode and anode layers, respectively, into the EL layer, form negative and positively charged polarons in the polymer. These polarons migrate under the influence of the applied electric field, forming a polaron exciton with an oppositely charged species and subsequently undergoing radiative recombination.
  • a sufficient potential difference between the anode and cathode usually less than approximately 15 volts, and in many instances no greater than approximately 5 volts, may be applied to the device. The actual potential difference may depend on the use of the device in a larger electronic component.
  • the anode layer is biased to a positive voltage and the cathode layer is at substantially ground potential or zero volts during the operation of the electronic device.
  • a battery or other power source(s) may be electrically connected to the electronic device as part of a circuit.
  • the substrates were 30 x 30 mm ITO coated glass.
  • the buffer layer was a PEDOT material (BAYTRON-P, Bayer AG, Germany).
  • the EL polymers were polyfluorene derivative blue and green materials (Blue-1 , Blue-2, Blue-3, Green-1 ), or bis-cyclometallated iridium complexes (lr-R1 ) for red emission.
  • the EL polymer layer was spin-coated to a thickness of 77-100 nm. Toluene was used for the solution casting of the blue and green EL materials and dichloromethane was used for the solution casting of red Ir complex EL materials.
  • the cathode used was 3.5 nm Ba with 500 nm Al.
  • Green and blue reference devices with a single coating of EL polymer were also fabricated for comparison.
  • the reference devices were made by spin-coating the EL polymer in a 1-1.5 % solution of polymer in toluene followed by immediate cathode deposition.
  • a thin layer (30-40 nm) of the blue EL polymer was spin-coated, and the layer was annealed for 10 minutes at 60°C followed by spinning of the second layer (40-50 nm).
  • the second layer was applied as a toluene solution of a polymer containing up to 5 % (50 mg in 1 ml of solution) of an Ir complex red emitter in the same blue polymer host as the blue layer.
  • Device performance is summarized in Table 1. The data demonstrate that one can use a double layer configuration without sacrificing efficiency or operation voltage.
  • the structures depicted in Figs. 1-3 provide a unified relationship between emission intensity and operation voltage.
  • EL spectra for single layer and bilayer devices are shown in Figs. 5 and 6, respectively. Red, green and blue emissions, which form the fundamental color subpixels in full-color displays, were demonstrated.
  • Example 2 devices were fabricated as in Example 1 , but with a spin-coated cyano-poly(p-phenylene) (CN-PPP) blue layer (-70 nm).
  • the green devices were produced by vapor deposition of a green dopant molecule (Coumarin 545T, Eastman Kodak Co., Rochester, New York) over the blue EL polymer layer.
  • a green dopant molecule Coumarin 545T, Eastman Kodak Co., Rochester, New York
  • One of the devices was treated under toluene solvent vapor to let the green dopant diffuse into the blue EL polymer host.
  • Another device was heated to allow the dopant to diffuse into the host.
  • the cathode was prepared as in Example 1. Red devices were prepared in the same manner as the green devices, using a red dopant (DCJTB, Eastman Kodak Co.). The results are summarized in Table 2.
  • EL emission spectra produced by single layer EL polymers doped with fluorescent dopants are shown in Fig. 7. This example demonstrated that green and red pixels can be prepared by depositing dopant molecules 5 on top of a blue EL polymer layer. Diffusing a layer into a single organic layer with a desired density profile can be achieved by post heating or solvent vapor treatment.
  • Example 1 was repeated using a soluble poly(aryl- 0 oxadiazole) conjugated polymer to form a continuous, un-patterned electron transport layer before the cathode was deposited. Its thickness was 20-30 nm.
  • the cathode materials used in this experiment were calcium and aluminum.
  • RGB OLEDs can be fabricated with cathode materials with higher work functions than those 0 most commonly used.
  • Air stable cathodes (such as Al) can be used for full-color PLED displays.
  • EXAMPLE 4 In this example, devices were fabricated as in example 1 , but with a CN-PPP spin-coated blue layer (-70 nm). Green emitters were obtained 5 by spin-coating a green Ir complex dopant (lr-G1 ) (see, Y. Wang et al. , Appl. Phys. Lett. 79, 449 (2001)) over the blue polymer layer. Red devices were also made according to the same procedure but the green dopant was replaced with a red Ir complex dopant (lr-R2) (similar to that in Example 1 ). The emission spectra of these devices are shown in Fig. 8. 0 The corresponding EL efficiencies are shown in Table 3.
  • green and red emitters can be made by coating a phosphorescent dopant molecule onto a blue EL polymer layer using a solution process (such as drop coating, jetting, etc.).
  • a solution process such as drop coating, jetting, etc.
  • Single green and red EL blend layers with desired density profiles can be achieved by proper selection of solvent and process conditions.
  • Example 6 In this Example, Example 5 was repeated with the following modifications. After spin-coating a buffer layer and a blue EL polymer 25 layer, green and red molecular dopants were vapor deposited into defined areas by means of a pair of shadow masks. The dopants were then diffused into the underlying blue EL polymer layer to form single green and red monolayers, by exposing the panel to organic solvent vapor.
  • Exemplary solvent vapors that can be used for this purpose include xylene, toluene, chlorobenzene, etc., with a toluene vaporization temperature of 70° C.
  • Fig. 10 shows PL emission spectra of the green and red subpixels.
  • Example 5 a device was fabricated as in Example 5, however, the dopant was diffused into the host layer by thermal treatment rather than diffusion from a wetting process. After spin-coating a buffer layer and a blue EL polymer layer, green and red molecular dopants were deposited into defined areas by means of a pair of shadow masks. The panel was then heated under vacuum, or under a N 2 or Ar atmosphere at 200 °C for 10 minutes. The formation of a red and green polymer blend monolayers was confirmed by PL imaging and PL spectra as in the previous example.
  • Example 5 was repeated using an external biasing field for a diffusion process. After spin-coating the buffer layer and the blue EL polymer layer, green and red molecular dopants were deposited into defined areas by means of a pair of shadow masks, followed by cathode deposition. The diffusion of red and green dopants into the blue EL polymer layer was observed when the device was biased to a field of 1 x 0 5 V/cm. The formation of red and green polymer monolayers was confirmed by photoluminescence (PL) imaging and PL spectra after the biasing process.
  • PL photoluminescence
  • Examples 6, 7 and 8 demonstrated that full-color displays can be made with dopant (fluorescent or phosphorescent) dispersed red and green molecules using various diffusion processes (thermal, solvent vapor and bias field) disclosed in this invention.
  • EXAMPLE 9 Experiments in Examples 5-8 were repeated with active matrix substrates. Similar color performance was observed. These results demonstrated that the dopant coating and dispersion processes disclosed in this invention can be used for different types of substrates.
  • EXAMPLE 10 Blue, green and red color pixels were fabricated as in Example 1. The substrate size was 4"x 4". The active area was 3.2" x 2.4" with 4" diagonal direction. The color pixel size was 100 pixels-per-inch (ppi) (equivalent to 254 ⁇ m). Blue subpixels were formed by spin-coating a blue EL polymer over the entire substrate.
  • Red and green subpixels were formed by applying the corresponding red and green polymer solution drops into defined areas with a commercial ink-jetter made by MicroFab Technologies, Inc., (Piano, Texas). Jetting green and red polymer solutions (1 :1 ratio of p-xylene:anisole) into the corresponding subpixels produced green and red polymer blend monolayers automatically. This was confirmed by photoluminescence image and PL spectra.
  • Example 10 was repeated.
  • the blue EL layer was formed by spin- coating a blue EL polymer over the entire panel.
  • Red and green subpixels were formed by applying the corresponding EL dopant molecule solutions into defined areas.
  • Ink-jetting green and red molecular dopant solutions into the corresponding zones forms green and red polymer monolayers automatically, as confirmed by photoluminescence imaging and PL spectra.
  • This example demonstrated that high resolution, full-color display pixels can be fabricated by means of coating un-patterned blue layer and ink-jetting green and red EL dopant solutions into the corresponding zones.
  • EXAMPLE 12 Example 10 was repeated.
  • the blue EL layer was formed by spin- coating a blue EL polymer over the entire panel.
  • Red and green subpixels were formed by depositing drops of polymer/molecular blend solutions made with a blue host polymer and green or red dopants (either fluorescent or phosphorescent molecules or polymers).
  • Ink-jetting green and red polymer/molecular blend solutions into their corresponding zones formed green and red polymer/molecular blend monolayers automatically, as confirmed by photoluminescence imaging and PL spectra in green and red zones.
  • This example demonstrated that high resolution, full-color display pixels can be fabricated by means of coating an un-patterned blue layer and drop-coating green and red polymer/molecule blend solutions into their corresponding zones.
  • Example 10 was repeated with an active matrix substrate with pixel driver circuit embedded into each pixel.
  • the physical dimensions of the color pixels and the corresponding subpixels were identical to that used in Example 10.
  • a video rate, full-color, 320x240 QVGA (Quarter Video Graphics Array) active matrix PLED display was fabricated. This example demonstrated that high resolution, video rate (60 frames per second), full- color active matrix PLED displays can be fabricated using the method disclosed in this invention.

Abstract

The invention provides methods for the production of full-color, subpixellated organic electroluminescent (EL) devices. Substrates used in the methods of the invention for production of EL devices comprise wells wherein the walls of the wells do not require surface treatment prior to deposition of electroluminescent material. Also provided are EL devices produced by the methods described herein.

Description

TITLE
METHODS FOR PRODUCING FULL-COLOR ORGANIC
ELECTROLUMINESCENT DEVICES
FIELD OF THE INVENTION The invention relates to methods for the production of organic electroluminescent (EL) devices that display full-color images, such as full- color organic light emitting diodes (OLEDs).
BACKGROUND OF THE INVENTION Organic light emitting diodes (OLEDs) are promising for display applications due to their high power-conversion efficiency and low processing costs. Such displays are especially promising for battery- powered, portable electronic devices, including cell-phones, personal digital assistants, handheld personal computers, and DVD players. These applications call for displays with high information content, full color, and fast video rate response time in addition to low power consumption.
Current research in the production of full-color OLEDs is directed toward the development of cost effective, high throughput processes for producing color pixels. For the manufacture of monochromatic displays, spin-coating processes have been widely adopted (see, e.g., David Braun and Alan J. Heeger, Appl. Phys. Letters 58, 1982 (1991)). However, manufacture of full-color displays requires certain modifications to procedures used in manufacture of monochromatic displays. For example, to make a display with full-color images, each display pixel is divided into three subpixels, each emitting one of the three primary display colors, red, green, and blue. This division of full-color pixels into three subpixels has resulted in a need to modify current processes for depositing different organic polymeric materials onto a single substrate during the manufacture of OLED displays.
One such process for depositing polymer layers on a substrate is ink-jetting (see, e.g., U.S. Patent Application Publication No. 2001/0001050). In order to form an emitting layer with a uniform thickness, proper formulation of the ink and proper design and treatment of the substrate is generally required. However, it has proven quite challenging to properly design and treat substrates to form full-color displays while maintaining suitable device performance (such as efficiency and lifetime). For example, structures used for retaining polymer inks in the subpixels tend to reduce the aperture ratio of a display. In addition, methods used for surface treatment of subpixellated substrates prior to addition of polymer inks can damage the underlying active matrix substrate. Accordingly, there is a need for alternative methods for the cost effective production of full-color EL devices that do not deleteriously effect device performance.
SUMMARY OF THE INVENTION The invention provides methods for the production of organic electroluminescent (EL) devices. Substrates used in the methods of the invention for production of EL devices do not require CF4 plasma surface treatment prior to deposition of electroluminescent material. Thus, the invention methods are particularly useful in the production of EL devices where ink-jetting is used to deposit electroluminescent material. In addition, the invention methods are useful for producing both subpixellated and non-subpixellated devices. Moreover, the invention methods are useful for producing EL devices which contain one type of EL material or several types of EL material. In another embodiment of the invention, there are provided organic
EL devices produced by providing a substrate, depositing an anode layer onto the substrate, establishing a plurality of discreet wells on the substrate, wherein the discreet wells are formed by circumscribing walls to form the wells, depositing an un-pattemed buffer layer onto the anode layer in each of the wells, depositing an un-pattemed EL host polymer layer into each of said wells, depositing at least one patterned dopant layer in at least one of said wells without prior surface treatment of the walls of the well, and depositing a cathode layer, thereby producing an organic electroluminescent (EL) device. In still another embodiment of the invention, there are provided full- color, subpixellated organic EL devices produced by providing a substrate, depositing an anode layer onto the substrate, establishing a plurality of discreet wells in sets of three on the substrate, wherein the discreet wells are formed by circumscribing walls to form the wells, wherein each well defines a subpixel and each set of three wells defines a pixel, depositing an un-patterned buffer layer onto the anode layer in each of the wells, depositing an un-patterned EL host polymer layer selected to produce blue light in each of the wells, depositing a first patterned dopant layer selected to produce red light in a first well in at least one of the set of three wells without prior surface treatment of the walls of the well, depositing a second patterned dopant layer selected to produce green light in a second well in at least one of the set of three wells without prior surface treatment of the walls of the well, and depositing a cathode layer, thereby producing an electroluminescent device. In yet another embodiment, there are provided electroluminescent devices including a substrate having a plurality of discreet wells, wherein each of the discreet wells has at least one wall surface that is substantially free of fluorine. In still another embodiment, the present invention relates to electroluminescent devices having a plurality of first and second subpixels, containing at least one layer of electroluminescent polymer, wherein the electroluminescent polymer layer in at least one of the first subpixels has diffused therein a first dopant, and the electroluminescent polymer layer in at least one of the second subpixels has diffused therein a second dopant, and the at least one first subpixel exhibits a photoluminescence spectrum displaying emission only from the first dopant, and the at least one second subpixel exhibits a photoluminescence spectrum displaying emission only from the second dopant. BRIEF DESCRIPTION OF THE FIGURES
The invention is illustrated by way of example and not limitation in the accompanying figures.
Figs. 1-3 illustrate exemplary alternative device structures prepared according to the methods of the invention. Fig. 4 illustrates intensity voltage dependence of a blue pixel (single layer) and a red pixel (bilayer) processed by coating blue and red polymers.
Fig. 5 illustrates EL emission spectra with single layer EL polymers. Fig. 6 illustrates EL emission spectra produced by a device with the structure shown in Fig. 1.
Fig. 7 illustrates EL spectra with single layer EL polymers doped with fluorescent dopants: green dopant C545T (peak maxima -520 nm) and red dopant DCJTB (peak maxima -650 nm. Fig. 8 illustrates EL spectra with single layer polymers doped with green and red fluorescent Ir complexes.
Fig. 9 illustrates EL emission spectra with single layer EL polymers doped with fluorescent dopants.
Fig. 10 illustrates photoluminescent spectra of CN-PPP/Dopants under UV illumination (emission in 300 to 400 nm range is due to the UV excitation source ).
DETAILED DESCRIPTION OF THE INVENTION Methods are provided for the production of organic electroluminescent devices. In one embodiment, there is provided a method for producing an organic electroluminescent (EL) device comprising: a) providing a substrate, b) depositing an anode layer onto said substrate, c) establishing a plurality of discreet wells on said substrate, wherein said discreet wells are formed by circumscribing walls to form said wells, d) depositing an un-patterned buffer layer onto said anode layer in each of said wells, e) depositing an un-patterned EL host polymer layer into each of said wells, f) depositing at least one patterned dopant layer in at least one of said wells without prior surface treatment of said walls of said well, and g) depositing a cathode layer, thereby producing an organic electroluminescent (EL) device.
In another embodiment, there is provided a method for producing a full-color, subpixellated organic electroluminescent (EL) device, the method comprising: a) providing a substrate, b) depositing an anode layer onto said substrate, c) establishing a plurality of discreet wells in sets of three on said substrate, wherein said discreet wells are formed by circumscribing walls to form said wells, wherein each well defines a subpixel and each set of three wells defines a full-color pixel, d) depositing an un-patterned buffer layer onto said anode layer in each of said wells, e) depositing an un-patterned EL host polymer layer selected to produce blue light in each of said wells, f) depositing a first patterned dopant layer selected to produce red light in a first well in at least one of said set of three wells without prior surface treatment of said walls of said well, g) depositing a second patterned dopant layer selected to produce green light in a second well in at least one of said set of three wells without prior surface treatment of said walls of said well, h) depositing a cathode layer, thereby producing a full-color, subpixellated organic electroluminescent device. As used herein, the term "dopant" refers to a material suitable to alter the light emitting properties of an un-doped host material.
As used herein, the term "un-patterned", when used in conjunction with an organic layer used in the production of an EL device, means that the organic layer has been deposited across the entire pixel array, as opposed to being deposited in a specific pattern across the pixel array.
As used herein, the term "patterned", when used in conjunction with a dopant layer used in the production of an EL device, means that the dopant is deposited into specified wells within specified pixels across the pixel array.
As used herein, the phrase "surface treatment" refers to a process commonly used in the art to modify the wetting properties of the walls of wells in subpixellated EL devices. "Surface treatment" refers to exposure to a dry plasma, using CF gas after the wells are formed with walls made of organic materials, such as photoresists or acrylic resins. As a result of such surface treatment, the surface of the substrate and the walls of the wells are substantially fluorinated. As used herein, the term "fluorinated" means that fluorine is associated with the surface of the substrate. Fluorine may be associated with the surface in a number of ways, for example, the fluorine may be physically adsorbed onto the surface, chemically bonded to the surface, and the like. Indeed, those skilled in the art recognize that a chemical analysis of a surface treated with CF would show the presence of fluorine. It is commonly known that plasma CF treatment can damage the underlying electronic components in an active matrix EL device, a process that limits useable process conditions for substrates containing active matrix pixel drivers.
As used herein, the terms "comprises," "comprising," "includes," "including," "has," "having" or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Further, unless expressly stated to the contrary, "or" refers to an inclusive or and not to an exclusive or. For example, a condition A or B is satisfied by any one of the following: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), and both A and B are true (or present).
Also, use of the "a" or "an" are employed to describe elements and components of the invention. This is done merely for convenience and to give a general sense of the invention. This description should be read to include one or at least one and the singular also includes the plural unless it is obvious that it is meant otherwise.
Figure 1 illustrates one embodiment of the invention for producing full-color EL devices. The substrate is either embedded with microcircuitry (active matrix substrate) or has no embedded microcircuitry (passive matrix substrate). In Fig. 1A, a rigid or flexible substrate 10 is provided with a patterned anode layer 20, and then walls 30 are provided so as to form a plurality of wells in sets of three on the substrate. The wells may have any convenient shape, for example, rectangular, circular (including oval-shaped), triangular, and the like. In one embodiment, the walls form rectangular wells. Each well contains an anode and forms a subpixel, and each set of three wells forms a pixel. The walls may be constructed from organic material such as epoxy resin, acrylic resin, polyimide resin, and the like, or the walls may be constructed from inorganic material such as glass. Conventional photolithography techniques may be used to form the pattern of walls and wells. Upon complete fabrication of the device, the three subpixels will emit the three primary display colors, i.e., red, green, and blue. Electronic devices containing subpixels improve the contrast of a device and prevent light from leaking between pixels.
The anode surface is then cleaned to remove surface contaminants using methods well known to those skilled in the art (for example, see US Patent No. 5,798,170). As shown in Fig 1 B, an un-patterned buffer layer 40 is deposited onto the anode layer 20, and an un-patterned blue EL polymer layer 50 is then coated over the entire active area (i.e., all of the subpixels) by methods well-known to those skilled in the art e.g., spin coating, silk-screen printing, and the like. By depositing the un-patterned buffer layer 40 and un-patterned blue EL polymer layer 50 over the entire active area, the need for plasma surface treatment of the walls is obviated. In addition to providing the emission for the blue subpixels, the un- patterned blue EL polymer layer can serve as a host to receive green and red dopants in their respective subpixels for formation of a full-color display.
As shown in Fig. 1C, subpixels that emit green and red light are next formed by ink-jetting drops of polymer solutions containing green dopant into a first set of subpixels and ink-jetting drops of polymer solutions containing red dopant into a second set of subpixels to form the green 52 and red 54 EL polymer layers. The polymer solutions contain small amounts of green and red dopants in a polymer host material, wherein the polymer host material is the same polymer used for the un- patterned blue EL polymer layer 50. Through wetting by the green and red polymer solutions of the unpatterned blue EL polymer layer, blend layers 56 and 58 (Fig. 1 D) with uniform (monolayer) or gradient density distributions of green and red dopants can be formed in the green and red subpixels. Finally, as shown in Fig. 1 E, a cathode material 60 is deposited over the entire surface to complete the device.
As used herein, the term "monolayer" refers to a host EL polymer having a dopant diffused therein with a uniform density distribution, wherein the photoluminescence spectrum of the host EL polymer containing dopant diffused therein displays emission from the dopant only. As used herein, the term "blend layer" refers to an EL polymer layer that is formed when the same EL polymer is used in consecutive deposition steps, doped or undoped, for the purpose of introducing specific dopants into the layer that alter the characteristic luminescence of that layer. The blend layer can have a gradient density distribution and exhibit the characteristic photoluminescence of both the host and the dopant, or it can have the uniform density distribution of a monolayer as defined above. Figure 2 illustrates another embodiment of the invention methods for producing full-color EL devices. After formation of subpixels, anode, and buffer layers as described above with reference to Fig. 1 , patterned green and red polymer layers 52 and 54 may be deposited into two of the three wells in a pixel, Fig. 2A, before an un-patterned blue EL polymer 50 is deposited, Fig. 2B. In this embodiment, it is the un-patterned buffer layer 40 coating alone that prevents wetting of the walls by the dopant layers when they are deposited in the subpixels. As in the previous embodiment, the host polymer for the green and red dopants is the same polymer used for the un-patterned blue EL polymer layer 50. Through wetting of the dopant layers 52 and 54 by the un-patterned blue EL polymer layer 50, blend layers 56 and 58 can be formed, Fig. 2C. A cathode layer 60 is deposited to complete the device, Fig. 2D.
Yet another embodiment of the invention methods is shown in Figure 3. An additional un-patterned organic layer 70, which conducts electrons and may or may not emit light, is coated before the cathode 60 and after the EL polymer layers 50, 56 and 58. This additional layer, which lies adjacent to the cathode layer 60, facilitates injection and transport of electrons from the cathode into the EL polymer and/or eliminates EL quenching due to the cathode. The manufacture of EL devices according to the invention is advantageous for several reasons. For example, blue pixels and blue subpixels are formed by an un-patterned deposition process (e.g., spin coating). Thus, emission homogeneity and device performance are both optimized. In addition, the process time for formation of each of the polymer layers is markedly reduced by eliminating ink-jet processing time and setting time for the buffer and blue EL polymer layers. This further reduction in process time also contributes to improved device performance (both efficiency and operation life). Moreover, the gradient density profile in the green and red subpixels is readily tuned by the wetting process when a dopant is deposited from solution using the same host polymer as used for the un- patterned blue EL polymer layer. This tuning provides an effective means to optimize emission of the OLED and thus the device performance. Indeed, since the same blue light-emitting EL materials used for blue subpixels are used as host materials for green and red subpixels, the intensity vs. voltage dependence of the red, green and blue subpixels follows the same trends. This feature creates an ideal situation for color balance and compensation in full-color displays by simplifying corresponding driving circuits. The optional un-patterned organic layer 70 adjacent to the cathode layer 60 in Fig. 3 facilitates injection and transport of electrons into the EL layer, thereby providing an additional means for optimizing device performance.
The diffusion of the green and red dopants into the blue EL host polymer can be uniform and complete. Indeed, as set forth in Examples 6, 7, 8, 10, 11 and 12 and in Figure 10, the inventive EL devices contain green and red subpixels which exhibit photoluminescence spectra displaying emission from the green and red dopants only. Thus, in one embodiment of the invention, there are provided EL devices comprising a substrate, an anode layer, an electroluminescent polymer layer selected to produce blue light, and a cathode layer, wherein in at least one first subpixel the electroluminescent polymer layer has diffused therein a first dopant selected to produce red light and in at least one second subpixel the electroluminescent polymer layer has diffused therein a second dopant selected to produce green light, wherein the at least one first subpixel exhibits a photoluminescence spectrum displaying emission only from the first dopant, and the at least one second subpixel exhibits a photoluminescence spectrum displaying emission only from the second dopant. Those skilled in the art recognize that the methods of this invention are not limited to producing red, green, and blue subpixellated full-color displays, but can be used to form any number of subpixels with any combination of characteristic emissions, based on the properties of the electroluminescent materials used. Furthermore, when EL devices are produced according to the methods of the invention, there is no need for surface treatment of the substrate prior to deposition of either the un-patterned blue EL polymer or the red and green dopant materials. Those skilled in the art recognize that plasma surface treatment of wells prior to deposition of polymer layers can damage the underlying substrate and especially damage the transistors embedded in the substrate of an active matrix device. Indeed, the surfaces of the walls of the wells employed in the invention EL devices are substantially free of fluorine. As used herein, the phrase "substantially free of fluorine" means that the surfaces contain an amount of fluorine which is normally present, based on the composition of the materials, and is to be distinguished from an amount of fluorine that would be present on the surface after surface treatment with CF4.
Substrates 10 contemplated for use in the practice of the invention can be flexible or rigid, organic or inorganic. Generally, glass or organic films in either rigid or flexible form are used as a support. The anode layer 20 is an electrode that is more efficient for injecting holes compared to the cathode layer. The anode can include materials containing a metal, mixed metal, alloy, metal oxide or mixed oxide. Suitable materials include, but are not limited to, the mixed oxides of the Group 2 elements (i.e., Be, Mg, Ca, Sr, Ba, Ra), the Group 11 elements, the elements of Groups 4, 5, and 6, and the Group 8-10 transition elements. Group numbers corresponding to columns within the periodic table of the elements use the "New Notation" convention as seen in the CRC Handbook of Chemistry and Physics, 81st Edition (2000). If the anode layer is to be light transmitting in the visible spectral range, mixed oxides of Groups 12, 13 and 14 elements, such as indium- tin-oxide, may be used. As used herein, the phrase "mixed oxide" refers to oxides having two or more different cations selected from the Group 2 elements or the Groups 12, 13, or 14 elements. Some non-limiting, specific examples of materials for the anode layer include indium-tin-oxide ("ITO"), aluminum-tin-oxide, gold, silver, copper, and nickel. The anode may also comprise an organic material, such as a conducting polyaniline (G. Gustafsson, Y. Cao, G. M. Treacy, F. Klavetter, N. Colaneri, and A.J. Heeger, Nature 357, 477 (1992)), PEDOT-PSSA (Y. Cao, G. Yu, C. Zhang, R. Menon and AJ. Heeger, Synth. Metals, 87, 171 (1997)) and poIypyrrole-4-dodecylbenzenesulfonic acid (DBSA) (J. Gao, AJ. Heeger, J.Y. Lee and CN. Kim, Synth. Metals 82, 221 (1996)).
The anode layer may be formed by a chemical or physical vapor deposition process or by a spin-cast process. Chemical vapor deposition may be performed as a plasma-enhanced chemical vapor deposition ("PECVD") or metal organic chemical vapor deposition ("MOCVD"). Physical vapor deposition can include all forms of sputtering, including ion beam sputtering, as well as e-beam evaporation and resistance evaporation. Specific forms of physical vapor deposition include rf magnetron sputtering and inductively-coupled plasma physical vapor deposition ("IMP-PVD"). These deposition techniques are well known within the semiconductor fabrication arts.
Usually, the anode layer is patterned using a lithographic operation. The pattern may vary as desired. The layers can be formed in a pattern by, for example, positioning a patterned mask or resist on the first flexible composite barrier structure prior to applying the first electrical contact layer material. Alternatively, the layers can be applied as an overall layer (also called blanket deposit) and subsequently patterned using, for example, a patterned resist layer and wet chemical or dry etching techniques. Other processes for patterning that are well known in the art can also be used. When the electronic devices form a passive matrix array, the anode layer typically is formed into substantially parallel strips having lengths that extend in substantially the same direction. In an active matrix array, the anode layer is patterned to form a discrete electrode for each electronic device, or subpixel.
The buffer layer 40 functions to facilitate injection of holes into the EL polymer layer and to smoothen the anode surface to prevent shorts in the device. Buffer layers are typically polymeric materials, such as polyaniline (PAΝI) or polyethylenedioxythiophene (PEDOT), which are often doped with protonic acids, or can be organic charge transfer compounds, and the like, such as the tetrathiafulvalene- tetracyanoquinodimethane system (TTF-TCΝQ). Protonic acids contemplated for use in the practice of the invention include, for example, poly(styrenesulfonic acid), poly(2-acrylamido-2-methyl-1-propanesulfonic acid), and the like. The buffer layer is usually cast onto substrates using a variety of techniques well known to those skilled in the art. Typical casting techniques include, for example, solution casting, drop casting, curtain casting, spin-coating, screen printing, inkjet printing, and the like. Alternatively, the buffer layer can be patterned using a number of such processes, such as ink-jet printing.
The electroluminescent (EL) layer 50 may typically be a conjugated polymer such as poly(paraphenylenevinylene) (PPV), PPV copolymers, polyfluorenes, polyphenylenes, polyacetylenes, polyalkylthiophenes, and the like. The particular material chosen may depend on the specific application, voltage potentials used during operation, or other factors. The EL layer can also be made with oligomers or dendrimers
Dopants contemplated for use in the practice of the invention are typically organometallic materials. Exemplary metals contemplated for use include lanthanide metals (e.g., Eu, Tb), Group 7 metals (e.g., Re), Group 8 metals (e.g., Ru, Os), Group 9 metals (e.g., Rh, Ir), Group 10 metals (e.g., Pd, Pt), Group 11 metals (e.g., Au), Group 12 metals (e.g., Zn), Group 13 metals (e.g., Al), and the like. In one embodiment, the organometallic materials may be cyclometallated complexes of Ir or Pt, with ligands such as phenylpyridines. Typical cyclometallated complex dopants contemplated for use in the practice of the invention are disclosed in published PCT application WO 02/2714, the entire contents of which are incorporated herein by reference. In another embodiment, the organometallic materials may be functionalized polymers comprising functional groups coordinated to at least one metal. The metals may be those discussed above. Exemplary functional groups contemplated for use include carboxylic acids, carboxylic acid salts, sulfonic acid groups, sulfonic acid salts, groups having an OH moiety, amines, imines, diimines, N-oxides, phosphines, phosphine oxides, β-dicarbonyl groups, and the like. Typical polymeric organometallic dopants contemplated for use in the practice of the invention are disclosed in Published PCT Application No. WO 02/31896, the entire contents of which are incorporated herein by reference. Dopants contemplated for use in the practice of the invention can also be an organic dye molecule such as 4-dicyanmethylene-2-methyl-6- (p-dimethyaminostyryl)-4H-pyran (DCM), coumarin and the like. Dopants contemplated for use in the practice of the invention can also be a red or green EL polymer in conjugated or non-conjugated form. When used for the production of full-color EL devices, a first dopant is selected to emit red light (with emission profile dominating in 600-700 nm range) and a second dopant is selected to emit green light (with emission profile dominating in 500-600 nm range). After deposition of each of the dopants, each pixel column contains three subpixels wherein one subpixel emits red light, one subpixel emits green light, and one subpixel emits blue light (with emission profile dominating in 400-500 nm range).
As shown in Fig. 3, an optional un-patterned layer 70 may be deposited prior to deposition of the cathode layer. This optional layer can function both to facilitate electron injection/transport, and also serve as a confinement layer to prevent quenching reactions at layer interfaces. More specifically, this layer may promote electron mobility and reduce the likelihood of a quenching reaction if the EL polymer layer and the cathode layer would otherwise be in direct contact. Examples of materials for this optional un-patterned layer include metal-chelated oxinoid compounds (e.g., Alq3 or the like); phenanthroline-based compounds (e.g., 2,9-dimethyl-4,7-diphenyl-1 ,10-phenanthroline ("DDPA"), 4,7-diphenyl- 1 ,10-phenanthroline ("DPA"), or the like); azole compounds (e.g., 2-(4- biphenylyl)-5-(4-t-butylphenyl)-1 ,3,4-oxadiazole ("PBD" or the like), 3-(4- biphenylyl)-4-phenyl-5-(4-t-butylphenyl)-1 ,2,4-triazole ("TAZ" or the like); other similar compounds; or any one or more combinations thereof. Alternatively, the optional unpatterned layer may be inorganic and comprise BaO, LiF, Li20, or the like. This optional unpatterned layer can also be an oligomer, dendrimer or conjugated polymer. Examples of conjugated polymers for this layer are provided in Published PCT Application No. WO 01/77203.
The cathode layer 60 is an electrode that is particularly efficient for injecting electrons or negative charge carriers. The cathode layer can be any metal or nonmetal having a lower work function than the first electrical contact layer (in this case, the anode layer). As used herein, the term "lower work function" is intended to mean a material having a work function no greater than about 4.4 eV. As used herein, "higher work function" is intended to mean a material having a work function of at least approximately 4.4 eV.
Materials for the cathode layer can be selected from alkali metals of Group 1 (e.g., Li, Na, K, Rb, Cs,), the Group 2 metals (e.g., Mg, Ca, Ba, or the like), the Group 12 metals, the lanthanides (e.g., Ce, Sm, Eu, or the like), and the actinides (e.g., Th, U, or the like). In one embodiment, the cathode comprises materials such as aluminum, indium, yttrium, barium, lithium, cerium, cesium, europium, rubidium, magnesium, samarium, and combinations thereof. The cathode can also be a metal alloy, for example, BaAI, LiAI, CaAI, Cain, and the like, or can be in a multiple layer form with each layer containing a different metal or metal alloy composition. In this case, only the layer adjacent to the organic emission layer or optional electron transport layer requires a lower work function. The thickness of the first layer is typically in the range of 1-300 nm.
The cathode layer is usually formed by a chemical or physical vapor deposition process. The cathode layer can be patterned, as discussed above in reference to the anode layer, or un-patterned. If the device lies within a passive matrix array, the cathode layer may be patterned into substantially parallel strips, where the lengths of the cathode layer strips extend in substantially the same direction and substantially perpendicular to the lengths of the anode layer strips. The pixels are formed at the cross points (where an anode layer strip intersects a cathode layer strip when the array is seen from a plan or top view). If the device lies within an active matrix array, the cathode can be un-patterned, or monolithic, with the pixels and subpixels defined by the patterning of the anode layer. The different layers may have any suitable thickness. The inorganic anode layer is usually no greater than approximately 500 nm, for example, approximately 10-200 nm; the buffer layer is usually no greater than approximately 500 nm, for example, approximately 20-200 nm; the EL layer is usually no greater than approximately 200 nm, for example, approximately 10-80 nm; the optional un-patterned layer is usually no greater than approximately 100 nm, for example, approximately 20-80 nm; and the cathode layer is usually no greater than approximately 1000 nm, for example, approximately 50-500 nm. If the anode layer or the cathode layer needs to transmit at least some light, the thickness of such layer may not exceed approximately 100 nm.
In organic light emitting diodes (OLEDs), electrons and holes, injected from the cathode and anode layers, respectively, into the EL layer, form negative and positively charged polarons in the polymer. These polarons migrate under the influence of the applied electric field, forming a polaron exciton with an oppositely charged species and subsequently undergoing radiative recombination. A sufficient potential difference between the anode and cathode, usually less than approximately 15 volts, and in many instances no greater than approximately 5 volts, may be applied to the device. The actual potential difference may depend on the use of the device in a larger electronic component. In many embodiments, the anode layer is biased to a positive voltage and the cathode layer is at substantially ground potential or zero volts during the operation of the electronic device. A battery or other power source(s) may be electrically connected to the electronic device as part of a circuit.
The invention will now be described in greater detail by reference to the following non-limiting examples. EXAMPLES
The following specific examples are meant to illustrate and not limit the scope of the invention.
EXAMPLE 1 OLEDs according to the invention were fabricated in the following order:
ITO/buffer polymer/EL polymer/cathode The substrates were 30 x 30 mm ITO coated glass. The buffer layer was a PEDOT material (BAYTRON-P, Bayer AG, Germany). The EL polymers were polyfluorene derivative blue and green materials (Blue-1 , Blue-2, Blue-3, Green-1 ), or bis-cyclometallated iridium complexes (lr-R1 ) for red emission. The EL polymer layer was spin-coated to a thickness of 77-100 nm. Toluene was used for the solution casting of the blue and green EL materials and dichloromethane was used for the solution casting of red Ir complex EL materials. The cathode used was 3.5 nm Ba with 500 nm Al. Green and blue reference devices with a single coating of EL polymer were also fabricated for comparison. The reference devices were made by spin-coating the EL polymer in a 1-1.5 % solution of polymer in toluene followed by immediate cathode deposition.
For the "bilayer" devices, a thin layer (30-40 nm) of the blue EL polymer was spin-coated, and the layer was annealed for 10 minutes at 60°C followed by spinning of the second layer (40-50 nm). For the red device, the second layer was applied as a toluene solution of a polymer containing up to 5 % (50 mg in 1 ml of solution) of an Ir complex red emitter in the same blue polymer host as the blue layer. Device performance is summarized in Table 1. The data demonstrate that one can use a double layer configuration without sacrificing efficiency or operation voltage. In fact, the structures depicted in Figs. 1-3 provide a unified relationship between emission intensity and operation voltage. Fig. 4 illustrates the intensity-voltage dependence of a blue pixel (single layer) and a red pixel (bilayer) processed by coating blue and red polymers. This unique intensity-voltage dependence allows a simple circuit for color balance and generalized gamma-curve correction.
Figure imgf000017_0001
In addition, EL spectra for single layer and bilayer devices are shown in Figs. 5 and 6, respectively. Red, green and blue emissions, which form the fundamental color subpixels in full-color displays, were demonstrated.
EXAMPLE 2
In this Example, devices were fabricated as in Example 1 , but with a spin-coated cyano-poly(p-phenylene) (CN-PPP) blue layer (-70 nm). The green devices were produced by vapor deposition of a green dopant molecule (Coumarin 545T, Eastman Kodak Co., Rochester, New York) over the blue EL polymer layer. One of the devices was treated under toluene solvent vapor to let the green dopant diffuse into the blue EL polymer host. Another device was heated to allow the dopant to diffuse into the host. The cathode was prepared as in Example 1. Red devices were prepared in the same manner as the green devices, using a red dopant (DCJTB, Eastman Kodak Co.). The results are summarized in Table 2.
Figure imgf000018_0001
EL emission spectra produced by single layer EL polymers doped with fluorescent dopants are shown in Fig. 7. This example demonstrated that green and red pixels can be prepared by depositing dopant molecules 5 on top of a blue EL polymer layer. Diffusing a layer into a single organic layer with a desired density profile can be achieved by post heating or solvent vapor treatment.
EXAMPLE 3 Example 1 was repeated using a soluble poly(aryl- 0 oxadiazole) conjugated polymer to form a continuous, un-patterned electron transport layer before the cathode was deposited. Its thickness was 20-30 nm. The cathode materials used in this experiment were calcium and aluminum.
Red, green, and blue color emissions were observed in the 5 corresponding devices. The emission spectra were the same as those shown in Fig. 6. The operating voltages and EL efficiencies from Ca devices can be better than those in the Ba devices used in Example 1.
This example demonstrated that high efficiency RGB OLEDs can be fabricated with cathode materials with higher work functions than those 0 most commonly used. Air stable cathodes (such as Al) can be used for full-color PLED displays.
EXAMPLE 4 In this example, devices were fabricated as in example 1 , but with a CN-PPP spin-coated blue layer (-70 nm). Green emitters were obtained 5 by spin-coating a green Ir complex dopant (lr-G1 ) (see, Y. Wang et al. , Appl. Phys. Lett. 79, 449 (2001)) over the blue polymer layer. Red devices were also made according to the same procedure but the green dopant was replaced with a red Ir complex dopant (lr-R2) (similar to that in Example 1 ). The emission spectra of these devices are shown in Fig. 8. 0 The corresponding EL efficiencies are shown in Table 3.
Figure imgf000019_0001
This example demonstrates that the green and red emitters can be made by coating a phosphorescent dopant molecule onto a blue EL polymer layer using a solution process (such as drop coating, jetting, etc.). Single green and red EL blend layers with desired density profiles can be achieved by proper selection of solvent and process conditions.
EXAMPLE 5 Column and row addressable, passive matrix OLED displays were fabricated following the procedure described in Example 2. After
10 spin-coating the buffer layer and a polyspiro blue EL polymer layer (Blue- 4), green and red molecular dopants were deposited into defined areas by means of a pair of shadow masks. In this experiment, Alq was used as an optional electron transport layer in the green and red zones. A Ca(5nm)/AI(200nm) double layer cathode was used in this Example. Fig. 9
15 shows the EL spectra of a full-color, passive matrix display made by this procedure. The testing results at 100 cd/m2 are listed in Table 4. This example demonstrated that red and green pixels and full-color passive matrix displays can be made with blue polymer/dopant in a multi-layer structure.
2C
Figure imgf000019_0002
EXAMPLE 6 In this Example, Example 5 was repeated with the following modifications. After spin-coating a buffer layer and a blue EL polymer 25 layer, green and red molecular dopants were vapor deposited into defined areas by means of a pair of shadow masks. The dopants were then diffused into the underlying blue EL polymer layer to form single green and red monolayers, by exposing the panel to organic solvent vapor. Exemplary solvent vapors that can be used for this purpose include xylene, toluene, chlorobenzene, etc., with a toluene vaporization temperature of 70° C. Fig. 10 shows PL emission spectra of the green and red subpixels. The spectral structure of the excitation source (saturated in 300-400 nm range) is also included. The corresponding photoluminescence images of the panel taken under UV illumination distinctly show the formation of red and green colors without residual blue emission spectra in the defined red and green zones, confirming the formation of both a red and a green polymer monolayers. EXAMPLE 7
In this Example, a device was fabricated as in Example 5, however, the dopant was diffused into the host layer by thermal treatment rather than diffusion from a wetting process. After spin-coating a buffer layer and a blue EL polymer layer, green and red molecular dopants were deposited into defined areas by means of a pair of shadow masks. The panel was then heated under vacuum, or under a N2 or Ar atmosphere at 200 °C for 10 minutes. The formation of a red and green polymer blend monolayers was confirmed by PL imaging and PL spectra as in the previous example.
EXAMPLE 8 Example 5 was repeated using an external biasing field for a diffusion process. After spin-coating the buffer layer and the blue EL polymer layer, green and red molecular dopants were deposited into defined areas by means of a pair of shadow masks, followed by cathode deposition. The diffusion of red and green dopants into the blue EL polymer layer was observed when the device was biased to a field of 1 x 05 V/cm. The formation of red and green polymer monolayers was confirmed by photoluminescence (PL) imaging and PL spectra after the biasing process.
Examples 6, 7 and 8 demonstrated that full-color displays can be made with dopant (fluorescent or phosphorescent) dispersed red and green molecules using various diffusion processes (thermal, solvent vapor and bias field) disclosed in this invention.
EXAMPLE 9 Experiments in Examples 5-8 were repeated with active matrix substrates. Similar color performance was observed. These results demonstrated that the dopant coating and dispersion processes disclosed in this invention can be used for different types of substrates. EXAMPLE 10 Blue, green and red color pixels were fabricated as in Example 1. The substrate size was 4"x 4". The active area was 3.2" x 2.4" with 4" diagonal direction. The color pixel size was 100 pixels-per-inch (ppi) (equivalent to 254 μm). Blue subpixels were formed by spin-coating a blue EL polymer over the entire substrate. Red and green subpixels were formed by applying the corresponding red and green polymer solution drops into defined areas with a commercial ink-jetter made by MicroFab Technologies, Inc., (Piano, Texas). Jetting green and red polymer solutions (1 :1 ratio of p-xylene:anisole) into the corresponding subpixels produced green and red polymer blend monolayers automatically. This was confirmed by photoluminescence image and PL spectra.
This example demonstrated that high resolution, full-color display pixels can be fabricated by coating an un-patterned blue layer and ink- jetting green and red polymer solutions into the corresponding zones, similar to the process described in Fig. 1.
EXAMPLE 11 Example 10 was repeated. The blue EL layer was formed by spin- coating a blue EL polymer over the entire panel. Red and green subpixels were formed by applying the corresponding EL dopant molecule solutions into defined areas. Ink-jetting green and red molecular dopant solutions into the corresponding zones forms green and red polymer monolayers automatically, as confirmed by photoluminescence imaging and PL spectra. This example demonstrated that high resolution, full-color display pixels can be fabricated by means of coating un-patterned blue layer and ink-jetting green and red EL dopant solutions into the corresponding zones.
EXAMPLE 12 Example 10 was repeated. The blue EL layer was formed by spin- coating a blue EL polymer over the entire panel. Red and green subpixels were formed by depositing drops of polymer/molecular blend solutions made with a blue host polymer and green or red dopants (either fluorescent or phosphorescent molecules or polymers). Ink-jetting green and red polymer/molecular blend solutions into their corresponding zones formed green and red polymer/molecular blend monolayers automatically, as confirmed by photoluminescence imaging and PL spectra in green and red zones. This example demonstrated that high resolution, full-color display pixels can be fabricated by means of coating an un-patterned blue layer and drop-coating green and red polymer/molecule blend solutions into their corresponding zones.
EXAMPLE 13 Example 10 was repeated with an active matrix substrate with pixel driver circuit embedded into each pixel. The physical dimensions of the color pixels and the corresponding subpixels were identical to that used in Example 10. A video rate, full-color, 320x240 QVGA (Quarter Video Graphics Array) active matrix PLED display was fabricated. This example demonstrated that high resolution, video rate (60 frames per second), full- color active matrix PLED displays can be fabricated using the method disclosed in this invention.
While the invention has been described in detail with reference to certain preferred embodiments thereof, it will be understood that modifications and variations are within the spirit and scope of that which is described and claimed.

Claims

WHAT IS CLAIMED IS:
1. A method for producing an organic electroluminescent (EL) device comprising: a) providing a substrate, b) depositing an anode layer onto said substrate, c) establishing a plurality of discreet wells on said substrate, wherein said discreet wells are formed by circumscribing walls to form said wells, d) depositing a buffer layer onto said anode layer in each of said wells, e) depositing an unpatterned EL host polymer layer into each of said wells, f) depositing at least one patterned dopant layer in at least one of said wells without prior surface treatment of said walls of said well, and g) depositing a cathode layer, thereby producing an organic electroluminescent (EL) device.
2. A method for producing a full-color, subpixellated organic electroluminescent (EL) device comprising: a) providing a substrate, b) depositing an anode layer onto said substrate, c) establishing a plurality of discreet wells in sets of three on said substrate, wherein said discreet wells are formed by circumscribing walls to form said wells, wherein each well defines a subpixel and each set of three wells defines a pixel, d) depositing a buffer layer onto said anode layer in each of said wells, e) depositing an unpatterned EL host polymer layer selected to produce blue light in each of said wells, f) depositing a first patterned dopant layer selected to produce red light in a first well in at least one of said set of three wells without prior surface treatment of said walls of said well, g) depositing a second patterned dopant layer selected to produce green light in a second well in at least one of said set of three wells without prior surface treatment of said walls of said well, h) depositing a cathode layer, thereby producing a full-color, subpixellated electroluminescent device.
3. A method according to claim 2, wherein said EL device is an active matrix full-color EL device.
4. A method according to claim , wherein said tL device is a passive matrix full-color EL device.
5. A method according to claim 2, wherein said walls circumscribe rectangular wells, circular wells, oval wells, or triangular wells.
6. A method according to claim 2, wherein said first and said second dopants are diffused into said EL host polymer layer to form monolayers in said wells.
7. A method according to claim 6, wherein said first and said second dopants are diffused into said EL host polymer layer by wetting of said host polymer layer by a polymer solution containing said first or said second dopant, by thermal diffusion, or by electric field biasing
8. A method according to claim 6, wherein said first and said second dopants are diffused into said EL host polymer layer by wetting of said host polymer layer by a polymer solution containing said first or said second dopant.
9. A method according to claim 8, wherein said wetting produces a gradient density profile in said host polymer.
10. A method according to claim 2, wherein an unpatterned EL host polymer layer that optionally emits blue light is deposited immediately prior to deposition of said cathode layer.
11. A method according to claim 2 wherein said anode layer is selected from mixed oxides of the Group 2 elements, the elements in Groups 4-6, and the elements in Groups 8-14.
12. A method according to claim 11 , wherein said anode layer is selected from mixed oxides of the elements in Groups 12-14.
13. A method according to claim 11 , wherein said anode layer is indium-tin oxide.
14. A method according to claim 2, wherein said deposition of said anode layer or said cathode layer is selected from a chemical vapor deposition process, a physical vapor deposition process, and a spin-cast process.
15. A method according to claim 14, wherein said chemical vapor deposition is selected from plasma-enhanced chemical vapor deposition ("PECVD") or metal organic chemical vapor deposition ("MOCVD").
16. A method according to claim 14, wherein said physical vapor deposition is selected from sputtering, e-beam evaporation, and resistance evaporation.
17. A method according to claim 14, wherein said physical vapor deposition is selected from rf magnetron sputtering and inductively- coupled plasma physical vapor deposition ("IMP-PVD").
18. A method according to claim 2, wherein said buffer layer is selected from polyaniline (PANl) or polyethylenedioxythiophene (PEDOT), wherein said buffer layer is optionally doped with a protonic acid.
19. A method according to claim 2, wherein said EL polymer layer is selected from polyparaphenylene vinylene (PPV), PPV copolymers, polyfluorenes, polyacetylenes, polyalkylthiophenes and derivatives thereof.
20. A method according to claim 2, wherein said dopants are functionalized polymers comprising functional groups coordinated to at least one metal.
21. A method according to claim 20, wherein said functionalized polymer comprises functional groups selected from carboxylic acids, carboxylic acid salts, sulfonic acid groups, sulfonic acid salts, groups having an OH moiety, amines, imines, diimines, N-oxides, phosphines, phosphine oxides, and β-dicarbonyl groups.
22. A method according to claim 20, wherein said at least one metal is selected from lanthanide metals, Group 7 metals, Group 8 metals,
Group 9 metals, Group 10 metals, Group 11 metals, Group 12 metals, and Group 13 metals.
23. A method according to claim 10, wherein said unpatterned El host polymer layer metal-chelated oxinoid compounds, phenanthroline- based compounds, and azole compounds.
24. A method according to claim 23, wherein said unpatterned polymer layer comprises Alq3, 2,9-dimethyl-4,7-diphenyl-1 ,10- phenanthroline ("DDPA"), 4,7-diphenyl-1 ,10-phenanthroline ("DPA"), 2-(4- biphenylyl)-5-(4-t-butylphenyl)^1 ,3,4-oxadiazole ("PBD"), 3-(4-biphenylyl)- 4-phenyl-5-(4-t-butylphenyl)-1 ,2,4-triazole ("TAZ"), or combinations of any one or more thereof.
25. A method according to claim 2, wherein said cathode layer comprises Group 1 metals, Group 2 metals, Group 12 metals, lanthanides, and actinides.
26. A method according to claim 2, wherein said deposition of said buffer layer, EL host polymer layer, and dopant is processed by means of solution casting, drop casting, curtain casting, spin-coating, screen printing, and inkjet printing.
27. An electroluminescent (EL) device produced by the method of claim 2.
28. An electroluminescent (EL) device comprising a substrate, an anode layer, at least one electroluminescent polymer layer, and a cathode layer, wherein said substrate comprises a plurality of discreet wells, each of said pluarality of discreet wells having at least on wall surface substantially free of fluorine.
29. The electroluminescent (EL) device of claim 28, further comprising a buffer layer.
30. The electroluminescent (EL) device of claim 28, wherein said
EL polymer layer is selected from polyparaphenylene vinylene (PPV), PPV copolymers, polyfluorenes, polyacetylenes, polyalkylthiophenes and derivatives thereof.
31. The electroluminescent (EL) device of claim 29, wherein said buffer layer is selected from polyaniline (PANl) or polyethylenedioxythiophene (PEDOT), wherein said buffer layer is optionally doped with a protonic acid.
32. An electroluminescent (EL) device having a pluarality of first subpixels and second subpixels, comprising an electroluminescent polymer layer, wherein the electroluminescent polymer layer in at least one of said first subpixels has diffused therein a first dopant and the electroluminescent polymer layer in at least one of said second subpixels has diffused therein a second dopant, wherein said at least one first subpixel exhibits a photoluminescence spectrum displaying emission only from said first dopant, and said at least one second subpixel exhibits a photoluminescence spectrum displaying emission only from said second dopant.
33. The full-color electroluminescent (EL) device of claim 32, further comprising a buffer layer.
34. The full-color electroluminescent (EL) device of claim 32, wherein the surface of said substrate is substantially free of fluorine.
PCT/US2003/027424 2002-09-06 2003-08-28 Methods for producing full-color organic electroluminescent devices WO2004023574A1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR1020057003747A KR101059008B1 (en) 2002-09-06 2003-08-28 Organic electroluminescent device, full color organic electroluminescent device and manufacturing method thereof
CA002497691A CA2497691A1 (en) 2002-09-06 2003-08-28 Methods for producing full-color organic electroluminescent devices
JP2004534430A JP2005538511A (en) 2002-09-06 2003-08-28 Manufacturing method of full-color organic electroluminescence device
EP03749326A EP1535352B1 (en) 2002-09-06 2003-08-28 Methods for producing full-color organic electroluminescent devices
AT03749326T ATE479202T1 (en) 2002-09-06 2003-08-28 METHOD FOR PRODUCING FULL-COLOR ORGANIC ELECTROLUMINESCENT DEVICES
AU2003268365A AU2003268365A1 (en) 2002-09-06 2003-08-28 Methods for producing full-color organic electroluminescent devices
DE60333926T DE60333926D1 (en) 2002-09-06 2003-08-28 Process for the preparation of full color organic electroluminescent devices
HK06104149.6A HK1084232A1 (en) 2002-09-06 2006-04-04 Methods for producing full-color organic electroluminescent devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40877702P 2002-09-06 2002-09-06
US60/408,777 2002-09-06

Publications (2)

Publication Number Publication Date
WO2004023574A1 true WO2004023574A1 (en) 2004-03-18
WO2004023574A8 WO2004023574A8 (en) 2004-04-29

Family

ID=31978677

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/027424 WO2004023574A1 (en) 2002-09-06 2003-08-28 Methods for producing full-color organic electroluminescent devices

Country Status (12)

Country Link
US (2) US7098060B2 (en)
EP (1) EP1535352B1 (en)
JP (1) JP2005538511A (en)
KR (1) KR101059008B1 (en)
CN (2) CN101552234A (en)
AT (1) ATE479202T1 (en)
AU (1) AU2003268365A1 (en)
CA (1) CA2497691A1 (en)
DE (1) DE60333926D1 (en)
HK (1) HK1084232A1 (en)
TW (1) TWI355862B (en)
WO (1) WO2004023574A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7098060B2 (en) * 2002-09-06 2006-08-29 E.I. Du Pont De Nemours And Company Methods for producing full-color organic electroluminescent devices
WO2006092964A1 (en) * 2005-03-03 2006-09-08 Konica Minolta Holdings, Inc. Organic electroluminescent display and organic electroluminescent illuminating device
US7268006B2 (en) 2004-12-30 2007-09-11 E.I. Du Pont De Nemours And Company Electronic device including a guest material within a layer and a process for forming the same
WO2007145979A2 (en) * 2006-06-05 2007-12-21 E. I. Du Pont De Nemours And Company Liquid composition for deposition of organic active materials in the field of oled printing
JP2008502128A (en) * 2004-06-02 2008-01-24 トムソン ライセンシング Organic light-emitting diode with doped organic layer
EP1895608A2 (en) * 2006-09-04 2008-03-05 Novaled AG Organic light-emitting component and method for its manufacture
GB2448730A (en) * 2007-04-25 2008-10-29 Innos Ltd Fabrication of Planar Electronic Circuit Devices
US8077152B2 (en) 2004-10-15 2011-12-13 University Of Iowa Research Foundation Magneto resistive elements and methods for manufacture and use of same

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050147534A1 (en) 1998-05-05 2005-07-07 Massachusetts Institute Of Technology Emissive sensors and devices incorporating these sensors
ATE261483T1 (en) 1998-05-05 2004-03-15 Massachusetts Inst Technology LIGHT EMITTING POLYMERS AND DEVICES CONTAINING SAME
TWI232695B (en) * 2002-09-17 2005-05-11 Ibm Organic light emitting diode device and method for manufacturing the organic light emitting diode device
US6982179B2 (en) * 2002-11-15 2006-01-03 University Display Corporation Structure and method of fabricating organic devices
US20040096570A1 (en) * 2002-11-15 2004-05-20 Michael Weaver Structure and method of fabricating organic devices
US7029765B2 (en) * 2003-04-22 2006-04-18 Universal Display Corporation Organic light emitting devices having reduced pixel shrinkage
US6998492B2 (en) * 2003-05-16 2006-02-14 Semiconductor Energy Laboratory Co., Ltd. Organometallic complex and light-emitting element containing the same
US8119254B2 (en) * 2003-09-05 2012-02-21 City University Of Hong Kong Organic electroluminescent devices formed with rare-earth metal containing cathode
US20050052118A1 (en) * 2003-09-05 2005-03-10 Shuit-Tong Lee Organic electroluminescent devices formed with rare-earth metal containing cathode
US9017766B2 (en) * 2003-09-17 2015-04-28 The Regents Of The University Of California Methods and devices comprising soluble conjugated polymers
JP4479381B2 (en) * 2003-09-24 2010-06-09 セイコーエプソン株式会社 Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
JP4285741B2 (en) * 2003-10-24 2009-06-24 独立行政法人産業技術総合研究所 Organic electroluminescent device and method for producing the same
US20050100657A1 (en) * 2003-11-10 2005-05-12 Macpherson Charles D. Organic material with a region including a guest material and organic electronic devices incorporating the same
KR100560790B1 (en) * 2003-11-25 2006-03-13 삼성에스디아이 주식회사 Electroluminescent display device having a good performance at high temperature
US20050136285A1 (en) * 2003-12-23 2005-06-23 General Electric Company Multi-layered device and method for making the same
US7011529B2 (en) * 2004-03-01 2006-03-14 Anritsu Company Hermetic glass bead assembly having high frequency compensation
US20050253917A1 (en) * 2004-05-13 2005-11-17 Quanyuan Shang Method for forming color filters in flat panel displays by inkjetting
US20050255253A1 (en) * 2004-05-13 2005-11-17 White John M Apparatus and methods for curing ink on a substrate using an electron beam
US7205718B2 (en) * 2004-06-24 2007-04-17 Eastman Kodak Company OLED display having thermally conductive adhesive
US7205717B2 (en) * 2004-06-24 2007-04-17 Eastman Kodak Company OLED display having thermally conductive material
US20050285518A1 (en) * 2004-06-24 2005-12-29 Eastman Kodak Company OLED display having thick cathode
US8795781B2 (en) * 2004-09-03 2014-08-05 The Regents Of The University Of California Methods and devices utilizing soluble conjugated polymers
WO2006029231A1 (en) * 2004-09-03 2006-03-16 The Regents Of The University Of California Soluble conjugated polymers
US8617819B2 (en) 2004-09-17 2013-12-31 Massachusetts Institute Of Technology Polymers for analyte detection
US20060109296A1 (en) * 2004-11-04 2006-05-25 Bassam Shamoun Methods and apparatus for inkjet printing color filters for displays
US20070042113A1 (en) * 2004-11-04 2007-02-22 Applied Materials, Inc. Methods and apparatus for inkjet printing color filters for displays using pattern data
US7413272B2 (en) * 2004-11-04 2008-08-19 Applied Materials, Inc. Methods and apparatus for precision control of print head assemblies
US20060093751A1 (en) * 2004-11-04 2006-05-04 Applied Materials, Inc. System and methods for inkjet printing for flat panel displays
US20060092218A1 (en) * 2004-11-04 2006-05-04 Applied Materials, Inc. Methods and apparatus for inkjet printing
US7625063B2 (en) * 2004-11-04 2009-12-01 Applied Materials, Inc. Apparatus and methods for an inkjet head support having an inkjet head capable of independent lateral movement
US8063551B1 (en) * 2004-12-29 2011-11-22 E.I. Du Pont De Nemours And Company Pixel intensity homogeneity in organic electronic devices
US20060159843A1 (en) * 2005-01-18 2006-07-20 Applied Materials, Inc. Method of substrate treatment for manufacturing of color filters by inkjet printing systems
US20060185587A1 (en) * 2005-02-18 2006-08-24 Applied Materials, Inc. Methods and apparatus for reducing ink conglomerates during inkjet printing for flat panel display manufacturing
JP2006286309A (en) * 2005-03-31 2006-10-19 Toppan Printing Co Ltd Organic electroluminescent display device and its manufacturing method
US7544723B2 (en) * 2005-07-15 2009-06-09 Applied Materials, Inc. Blue printing ink for color filter applications
KR20070014986A (en) * 2005-07-28 2007-02-01 어플라이드 머티어리얼스, 인코포레이티드 Methods and apparatus for concurrent inkjet printing and defect inspection
KR100729089B1 (en) * 2005-08-26 2007-06-14 삼성에스디아이 주식회사 Organic light emitting display and method for fabricating the same
US20070065571A1 (en) * 2005-09-19 2007-03-22 Applied Materials. Inc. Method and apparatus for manufacturing a pixel matrix of a color filter for a flat panel display
US20070070132A1 (en) * 2005-09-27 2007-03-29 Fan-Cheung Sze Inkjet delivery module
US20070076040A1 (en) * 2005-09-29 2007-04-05 Applied Materials, Inc. Methods and apparatus for inkjet nozzle calibration
US7611217B2 (en) * 2005-09-29 2009-11-03 Applied Materials, Inc. Methods and systems for inkjet drop positioning
US20080018677A1 (en) * 2005-09-29 2008-01-24 White John M Methods and apparatus for inkjet print head cleaning using an inflatable bladder
US20070070109A1 (en) * 2005-09-29 2007-03-29 White John M Methods and systems for calibration of inkjet drop positioning
US20070068560A1 (en) * 2005-09-29 2007-03-29 Quanyuan Shang Methods and apparatus for inkjet print head cleaning
GB0526185D0 (en) * 2005-12-22 2006-02-01 Cambridge Display Tech Ltd Electronic device
JP2007201361A (en) * 2006-01-30 2007-08-09 Shinko Electric Ind Co Ltd Semiconductor device, and method of manufacturing semiconductor device
GB2434915A (en) * 2006-02-03 2007-08-08 Cdt Oxford Ltd Phosphoescent OLED for full colour display
TWI328520B (en) * 2006-02-07 2010-08-11 Applied Materials Inc Methods and apparatus for reducing irregularities in color filters
US8124172B2 (en) * 2006-03-02 2012-02-28 E.I. Du Pont De Nemours And Company Process for making contained layers and devices made with same
US20070256709A1 (en) * 2006-04-29 2007-11-08 Quanyuan Shang Methods and apparatus for operating an inkjet printing system
US20070252863A1 (en) * 2006-04-29 2007-11-01 Lizhong Sun Methods and apparatus for maintaining inkjet print heads using parking structures with spray mechanisms
US20070263026A1 (en) * 2006-04-29 2007-11-15 Quanyuan Shang Methods and apparatus for maintaining inkjet print heads using parking structures
JP5292287B2 (en) * 2006-06-05 2013-09-18 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Method for manufacturing organic electronic device
US20080087882A1 (en) * 2006-06-05 2008-04-17 Lecloux Daniel D Process for making contained layers and devices made with same
US20080024532A1 (en) * 2006-07-26 2008-01-31 Si-Kyoung Kim Methods and apparatus for inkjet printing system maintenance
WO2008013902A2 (en) * 2006-07-28 2008-01-31 Applied Materials, Inc. Methods and apparatus for improved manufacturing of color filters
US8283423B2 (en) 2006-09-29 2012-10-09 Massachusetts Institute Of Technology Polymer synthetic technique
US8802447B2 (en) 2006-10-05 2014-08-12 Massachusetts Institute Of Technology Emissive compositions with internal standard and related techniques
US20090215189A1 (en) 2006-10-27 2009-08-27 Massachusetts Institute Of Technology Sensor of species including toxins and chemical warfare agents
US20080204501A1 (en) * 2006-12-01 2008-08-28 Shinichi Kurita Inkjet print head pressure regulator
US20080166566A1 (en) * 2006-12-29 2008-07-10 Shiva Prakash Process for forming an organic light-emitting diode and devices made by the process
US7857413B2 (en) 2007-03-01 2010-12-28 Applied Materials, Inc. Systems and methods for controlling and testing jetting stability in inkjet print heads
US20080286487A1 (en) * 2007-05-18 2008-11-20 Lang Charles D Process for making contained layers
US7637587B2 (en) * 2007-08-29 2009-12-29 Applied Materials, Inc. System and method for reliability testing and troubleshooting inkjet printers
JP2011501472A (en) * 2007-10-23 2011-01-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー Three-component light emitting layer for light emitting applications
US20090141218A1 (en) * 2007-10-26 2009-06-04 Applied Materials, Inc. Methods and apparatus for curing pixel matrix filter materials
KR20100094475A (en) * 2007-10-26 2010-08-26 이 아이 듀폰 디 네모아 앤드 캄파니 Process and materials for making contained layers and devices made with same
JP4675413B2 (en) * 2008-02-14 2011-04-20 財団法人山形県産業技術振興機構 Organic light emitting device
JP5727368B2 (en) * 2008-05-19 2015-06-03 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company Apparatus and method for vapor phase coating in electronic devices
US8759818B2 (en) * 2009-02-27 2014-06-24 E I Du Pont De Nemours And Company Deuterated compounds for electronic applications
WO2010114583A1 (en) * 2009-04-03 2010-10-07 E. I. Du Pont De Nemours And Company Electroactive materials
WO2011014216A1 (en) * 2009-07-27 2011-02-03 E. I. Du Pont De Nemours And Company Process and materials for making contained layers and devices made with same
KR101790854B1 (en) * 2009-09-29 2017-10-26 이 아이 듀폰 디 네모아 앤드 캄파니 Deuterated compounds for luminescent applications
TW201114771A (en) 2009-10-29 2011-05-01 Du Pont Deuterated compounds for electronic applications
US8288187B2 (en) * 2010-01-20 2012-10-16 Universal Display Corporation Electroluminescent devices for lighting applications
TW201200975A (en) 2010-06-17 2012-01-01 Du Pont Process and materials for making contained layers and devices made with same
US9105847B2 (en) * 2010-06-24 2015-08-11 Joled Inc. Organic EL display and method of manufacturing the same
KR101257734B1 (en) * 2010-09-08 2013-04-24 엘지디스플레이 주식회사 Organic Electroluminescent Display Device
US9293716B2 (en) 2010-12-20 2016-03-22 Ei Du Pont De Nemours And Company Compositions for electronic applications
JP5871949B2 (en) 2010-12-20 2016-03-01 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company Confinement layer and methods and materials for manufacturing devices manufactured using the same
US8574934B2 (en) * 2011-09-19 2013-11-05 The Regents Of The University Of Michigan OVJP patterning of electronic devices
TWI569491B (en) * 2012-10-11 2017-02-01 Joled Inc Organic EL display device and manufacturing method thereof, ink and electronic machine
US9312485B2 (en) 2012-12-13 2016-04-12 Ei Du Pont De Nemours And Company Process and materials for making contained layers and devices made with same
US20140203259A1 (en) * 2013-01-18 2014-07-24 Universal Display Corporation Host for organic light emitting devices
CN104157797B (en) * 2014-08-07 2016-08-24 京东方科技集团股份有限公司 A kind of method preparing organic luminescent device
US10283496B2 (en) * 2016-06-30 2019-05-07 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit filler and method thereof
CN112117318A (en) 2016-07-29 2020-12-22 京东方科技集团股份有限公司 OLED array substrate, manufacturing method thereof and OLED display panel
CN108428723B (en) 2018-03-27 2021-08-03 京东方科技集团股份有限公司 Pixel defining structure, preparation method thereof, display substrate and ink-jet printing method
KR20200020538A (en) * 2018-08-17 2020-02-26 엘지디스플레이 주식회사 Organic light emitting diode device
CN110492016B (en) * 2019-07-30 2020-10-27 武汉华星光电半导体显示技术有限公司 Array substrate and display panel

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0756932A2 (en) * 1995-07-31 1997-02-05 Canon Kabushiki Kaisha Color-filter manufacturing method and apparatus, color filter, display device, and apparatus having display device
EP0892028A2 (en) * 1997-07-16 1999-01-20 Seiko Epson Corporation Composition for an organic el element and method of manufacturing the organic el element
US6066357A (en) * 1998-12-21 2000-05-23 Eastman Kodak Company Methods of making a full-color organic light-emitting display

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US197394A (en) * 1877-11-20 -james nayloe
US1050A (en) * 1838-12-31 Machine for separating tbash ekom cotton in tee seed
US141810A (en) * 1873-08-12 Improvement in nails
WO1997029091A1 (en) 1996-02-09 1997-08-14 Phytera Symbion Aps Balanol analogues
EP0803890B1 (en) * 1996-04-26 2003-03-19 Canon Kabushiki Kaisha Method of manifacturing electron emitting device, electron source and image-forming apparatus using the same
JP3899566B2 (en) 1996-11-25 2007-03-28 セイコーエプソン株式会社 Manufacturing method of organic EL display device
US6087198A (en) * 1998-02-12 2000-07-11 Texas Instruments Incorporated Low cost packaging for thin-film resonators and thin-film resonator-based filters
JP3861400B2 (en) 1997-09-01 2006-12-20 セイコーエプソン株式会社 Electroluminescent device and manufacturing method thereof
CA2306948C (en) 1997-10-17 2004-09-07 The Regents Of The University Of California Process for fabricating organic semiconductor devices using ink-jet printing technology and device and system employing same
JP3206646B2 (en) * 1998-01-22 2001-09-10 日本電気株式会社 Multicolor light emitting organic EL panel and manufacturing method thereof
US6087196A (en) 1998-01-30 2000-07-11 The Trustees Of Princeton University Fabrication of organic semiconductor devices using ink jet printing
CN100530759C (en) 1998-03-17 2009-08-19 精工爱普生株式会社 Thin film pattering substrate and surface treatment
US6566153B1 (en) 1998-10-14 2003-05-20 The Regents Of The University Of California Process for fabricating organic semiconductor devices using ink-jet printing technology and device and system employing same
US6048573A (en) 1998-11-13 2000-04-11 Eastman Kodak Company Method of making an organic light-emitting device
US6086357A (en) * 1998-12-21 2000-07-11 D-M-E Company Actuator for an injection molding valve gate
TW468269B (en) * 1999-01-28 2001-12-11 Semiconductor Energy Lab Serial-to-parallel conversion circuit, and semiconductor display device employing the same
KR100298899B1 (en) * 1999-04-08 2001-09-22 이형도 An organic electroluminescent device and a method of fabricating thereof
TW512543B (en) 1999-06-28 2002-12-01 Semiconductor Energy Lab Method of manufacturing an electro-optical device
US6633121B2 (en) * 2000-01-31 2003-10-14 Idemitsu Kosan Co., Ltd. Organic electroluminescence display device and method of manufacturing same
US20020031602A1 (en) * 2000-06-20 2002-03-14 Chi Zhang Thermal treatment of solution-processed organic electroactive layer in organic electronic device
US7595501B2 (en) * 2000-06-30 2009-09-29 E. I. Du Pont De Nemours And Company Electroluminescent iridium compounds with fluorinated phenylpryidines, phenylpyrimidines, and phenylquinolines and devices made with such compounds
US20020121638A1 (en) * 2000-06-30 2002-09-05 Vladimir Grushin Electroluminescent iridium compounds with fluorinated phenylpyridines, phenylpyrimidines, and phenylquinolines and devices made with such compounds
US6891328B2 (en) * 2001-02-22 2005-05-10 Matsushita Electric Industrial Co., Ltd. Light source for image reading apparatus and image reading apparatus
KR100491144B1 (en) * 2001-12-26 2005-05-24 삼성에스디아이 주식회사 Flat Panel Display Device and Fabrication Method thereof
KR100437533B1 (en) * 2002-05-29 2004-06-30 엘지.필립스 엘시디 주식회사 Active Matrix Type Organic Electroluminescent Device and Method for Fabricating the same
US7098060B2 (en) * 2002-09-06 2006-08-29 E.I. Du Pont De Nemours And Company Methods for producing full-color organic electroluminescent devices
US6891326B2 (en) 2002-11-15 2005-05-10 Universal Display Corporation Structure and method of fabricating organic devices
US6737800B1 (en) * 2003-02-18 2004-05-18 Eastman Kodak Company White-emitting organic electroluminescent device with color filters and reflective layer for causing colored light constructive interference
US6844215B1 (en) * 2003-08-25 2005-01-18 Eastman Kodak Company Method of forming tapered drain-to-anode connectors in a back plane for an active matrix OLED device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0756932A2 (en) * 1995-07-31 1997-02-05 Canon Kabushiki Kaisha Color-filter manufacturing method and apparatus, color filter, display device, and apparatus having display device
EP0892028A2 (en) * 1997-07-16 1999-01-20 Seiko Epson Corporation Composition for an organic el element and method of manufacturing the organic el element
US6066357A (en) * 1998-12-21 2000-05-23 Eastman Kodak Company Methods of making a full-color organic light-emitting display

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7226799B2 (en) 2002-09-06 2007-06-05 E. I. Du Pont De Nemours And Company Methods for producing full-color organic electroluminescent devices
US7098060B2 (en) * 2002-09-06 2006-08-29 E.I. Du Pont De Nemours And Company Methods for producing full-color organic electroluminescent devices
KR101201926B1 (en) 2004-06-02 2012-11-16 톰슨 라이센싱 Organic light-emitting diode comprising a doped organic layer
JP2008502128A (en) * 2004-06-02 2008-01-24 トムソン ライセンシング Organic light-emitting diode with doped organic layer
EP1756886B1 (en) * 2004-06-02 2013-02-27 Thomson Licensing Organic light-emitting diode comprising a doped organic layer
JP4890447B2 (en) * 2004-06-02 2012-03-07 トムソン ライセンシング Organic light-emitting diode with doped organic layer
US8077152B2 (en) 2004-10-15 2011-12-13 University Of Iowa Research Foundation Magneto resistive elements and methods for manufacture and use of same
US7268006B2 (en) 2004-12-30 2007-09-11 E.I. Du Pont De Nemours And Company Electronic device including a guest material within a layer and a process for forming the same
WO2006092964A1 (en) * 2005-03-03 2006-09-08 Konica Minolta Holdings, Inc. Organic electroluminescent display and organic electroluminescent illuminating device
JPWO2006092964A1 (en) * 2005-03-03 2008-08-07 コニカミノルタホールディングス株式会社 Organic electroluminescence display device and organic electroluminescence illumination device
WO2007145979A2 (en) * 2006-06-05 2007-12-21 E. I. Du Pont De Nemours And Company Liquid composition for deposition of organic active materials in the field of oled printing
WO2007145979A3 (en) * 2006-06-05 2008-04-03 Du Pont Liquid composition for deposition of organic active materials in the field of oled printing
EP1895608A2 (en) * 2006-09-04 2008-03-05 Novaled AG Organic light-emitting component and method for its manufacture
GB2448730A (en) * 2007-04-25 2008-10-29 Innos Ltd Fabrication of Planar Electronic Circuit Devices

Also Published As

Publication number Publication date
WO2004023574A8 (en) 2004-04-29
CN1682387A (en) 2005-10-12
JP2005538511A (en) 2005-12-15
US7226799B2 (en) 2007-06-05
ATE479202T1 (en) 2010-09-15
US7098060B2 (en) 2006-08-29
US20040094768A1 (en) 2004-05-20
US20050285517A1 (en) 2005-12-29
KR20050043929A (en) 2005-05-11
KR101059008B1 (en) 2011-08-23
TWI355862B (en) 2012-01-01
AU2003268365A1 (en) 2004-03-29
EP1535352A1 (en) 2005-06-01
CN101552234A (en) 2009-10-07
TW200417273A (en) 2004-09-01
DE60333926D1 (en) 2010-10-07
EP1535352B1 (en) 2010-08-25
HK1084232A1 (en) 2006-07-21
CA2497691A1 (en) 2004-03-18
CN100508236C (en) 2009-07-01

Similar Documents

Publication Publication Date Title
US7226799B2 (en) Methods for producing full-color organic electroluminescent devices
US7056180B2 (en) Manufacturing method of organic electroluminescent device, organic electroluminescent device, and electronic apparatus
JP5667563B2 (en) Compositions and methods for manufacturing light emitting devices
US20110014389A1 (en) Lyophilic/lyophobic pattern-forming method and organic electroluminescent element manufacturing method
JP2009044103A (en) Organic electroluminescence element and manufacturing method thereof
US20110227100A1 (en) Light-emitting device and method for manufacturing thereof
JP2007317378A (en) Organic electroluminescent element, method of manufacturing the same, and display device
WO2010020784A1 (en) Method of manufacturing a display
US20070096640A1 (en) Methods for producing full color organic electroluminescent devices
WO2013168546A1 (en) Process for producing display device
WO2011007849A1 (en) Liquid column coating ink, organic el element production method, and organic el device provided with said organic el element
EP1628353A2 (en) Organic electroluminescent device, manufacturing method thereof, and electronic apparatus
JP2007250718A (en) Electroluminescent element and method of manufacturing same
US20110306157A1 (en) Opto-electrical Devices and Methods of Manufacturing the Same
WO2011118654A1 (en) Method for manufacturing light-emitting device
US20050032453A1 (en) Method for fabricating organic el element
JP2010129345A (en) Method of manufacturing organic electroluminescent device
JP2010147180A (en) Method of manufacturing organic electroluminescence element
JP5036680B2 (en) Method for manufacturing organic electroluminescence device
JP5155085B2 (en) Organic electroluminescence device and method for manufacturing the same
JP5314395B2 (en) Method for manufacturing organic electroluminescence element
JP2009044102A (en) Organic electroluminescence element and manufacturing method thereof
JP4775118B2 (en) Method for manufacturing organic electroluminescence device
JP2007250719A (en) Organic electroluminescent element and method of manufacturing same
JP2003197371A (en) Manufacturing method for electroluminescent element

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

WR Later publication of a revised version of an international search report
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2003749326

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2003268365

Country of ref document: AU

WWE Wipo information: entry into national phase

Ref document number: 2497691

Country of ref document: CA

Ref document number: 2004534430

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020057003747

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 20038212153

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 1020057003747

Country of ref document: KR

WWP Wipo information: published in national office

Ref document number: 2003749326

Country of ref document: EP