WO2004027358A1 - Device for detecting heat and corresponding method - Google Patents
Device for detecting heat and corresponding method Download PDFInfo
- Publication number
- WO2004027358A1 WO2004027358A1 PCT/DE2003/002791 DE0302791W WO2004027358A1 WO 2004027358 A1 WO2004027358 A1 WO 2004027358A1 DE 0302791 W DE0302791 W DE 0302791W WO 2004027358 A1 WO2004027358 A1 WO 2004027358A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- absorber layer
- heat
- sensing element
- self
- test
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 10
- 239000006096 absorbing agent Substances 0.000 claims description 41
- 238000012360 testing method Methods 0.000 claims description 13
- 239000012528 membrane Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 230000002745 absorbent Effects 0.000 abstract 1
- 239000002250 absorbent Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 12
- 230000005855 radiation Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/52—Radiation pyrometry, e.g. infrared or optical thermometry using comparison with reference sources, e.g. disappearing-filament pyrometer
- G01J5/53—Reference sources, e.g. standard lamps; Black bodies
- G01J5/532—Reference sources, e.g. standard lamps; Black bodies using a reference heater of the emissive surface type, e.g. for selectively absorbing materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention is based on a device for heat detection and a method according to the type of the independent claims.
- Devices for heat detection in particular infrared sensors, are already known, in which a heat-sensing element and an absorber layer are provided on a substrate.
- a heating resistor can be arranged on the membrane in addition to the heat-sensing element, the temperature increase being measured when the heating resistor is heated with the heat-sensing element.
- the device according to the invention and the method with the features of the independent claims have the advantage that a self-test function can be provided without additional layers.
- an electrically conductive resistance material is used as the absorber layer or as the absorber.
- the absorber layer is thus also used as a heating resistor. Additional layers such as, for example, an intermediate insulator and a resistance layer with, if appropriate, further passivation layers are not required.
- the absorber layer itself is included in the self-test.
- the Absorber layer is provided electrically contactable by means of a contacting means. This makes it possible with simple means to use the absorber layer as a heating resistor for self-test functionality. It is also advantageous that the heat-sensing element is provided on a membrane. This makes it possible according to the invention to produce a good thermal decoupling of the heat-sensing element from the substrate. It is also advantageous that an electrical voltage can be applied to the absorber layer at least temporarily. This makes it possible to carry out the self-test with simple means.
- FIG. 1 shows a device according to the invention in plan view
- FIG. 2 shows a device according to the invention in side view.
- FIG. 1 shows a device according to the invention, the device for heat detection being provided according to the invention on a substrate 10.
- the substrate 10 is configured or processed such that a membrane 2 is provided in a specific substrate area.
- a heat-sensing element 1 on the membrane which is provided in particular as a thermopile.
- the various wires of a plurality of such thermopile elements are shown in FIG.
- the electrical signal can then be further processed in an evaluation circuit and serve as a signal for the incident heat radiation.
- the evaluation circuit and the electrical connection of the heat-sensing element 1 are not shown in FIG. 1.
- the prior art provides for a heating resistor to be provided on the thermopile or in the region of the absorber layer 3.
- the heating resistor simulates the heating of the absorber layer 3 by normal heat radiation.
- heating is carried out by the heating resistor.
- additional layers must generally be provided in the area of the absorber layer 3. According to the invention, this is not necessary.
- the absorber layer 3 is provided in an electrically conductive manner.
- the absorber layer can be built up from the following materials or comprise these: graphite-containing pastes, graphite-containing lacquers, so-called “black” metal layers (Au, Ag, Pt), which get rough surfaces under special deposition conditions
- a resistance material can also be used as the absorber layer 3, as is known from hybrid technology, for example ruthenium-containing resistance paste.
- the absorber layer 3 can also be used as a heating resistor. Additional layers such as an intermediate insulator, a resistance layer and possibly a passivation layer can be omitted and are not required.
- the absorber layer 3 can thus be included in the self-test. To operate the absorber layer 3 in the event of a self-test of the device according to the invention, it is provided according to the invention to provide first and second contacting means 4, 6 in the region of the absorber layer 3, ie in particular on the absorber layer 3.
- the first contacting means 4 and the second contacting means 6 make the absorber layer 3 electrically contactable.
- the contacting means 4, 6 are provided in particular as metal interconnects, which can be located above the absorber layer 3 or below the absorber layer 3.
- the contacting means 4, 6 are each connected to a connection pad, the first contacting means 4 being connected to a connection pad 5 and the second contacting means 6 being connected to a connection pad 7. Via the connection pads or by applying a voltage to the connection pads 5, 7, it is possible to apply an electrical voltage to the absorber layer 3, so that in the absorber layer 3 an electrical current, which in FIG. 1 is indicated by an arrow with the reference symbol 45 is shown, can flow.
- the heat-sensing element 1 is provided in a thermally insulated manner from the surroundings due to its arrangement on the membrane 2.
- FIG. A membrane 2 is provided on the substrate 10, which carries the heat-sensing element 1 and the absorber layer 3.
- the first contacting means 4 and the first connection pad 5 are shown in FIG.
- the thin membrane 2 makes it possible for the heat-sensing element 1 to be thermally well insulated from its surroundings.
- the absorber layer 3 is applied, for example, to the heat-sensing element 1 or to the membrane 2 by means of a screen printing method.
- the connection pads 5, 7 are used to connect bonding wires.
- a voltage is applied to the contacting means 4, 6, which drives the current 45 through the absorber layer 3.
- the current 45 is thus impressed in the absorber layer 3, so that the resistance of the absorber layer 3 results in a temperature increase in the absorber layer 3 which is of the same order of magnitude as the temperature increase which is to be detected by the heat radiation by means of the device according to the invention.
- a signal which is of the order of magnitude of the measurement signal is registered by means of the self-test at the output of the heat-sensing element 1.
- the self-test takes a few milliseconds.
- the resistances are of the order of a few ohms (metals) to kiloohms (graphite-filled pastes / lacquers, resistance pastes).
- the layer thickness of the absorber is between a few hundred nanometers and a few micrometers.
Abstract
The invention relates to a device and a method involving a heat sensing element (1), provided with an absorbent layer (3) that is electrically conductive.
Description
Vorrichtung zur Wär edetektion und VerfahrenHeat detection device and method
Stand der TechnikState of the art
Die Erfindung geht aus von einer Vorrichtung zur Wärmedetektion und einem Verfahren nach der Gattung der nebengeordneten Ansprüche. Es sind bereits Vorrichtungen zur Wärmedetektion, insbesondere Infrarotsensoren, bekannt, bei denen auf einem Substrat ein wärmesensierendes Element und eine Absorberschicht vorgesehen ist. Für eine Selbsttestfunktion kann zusätzlich zum wärmesensierenden Element ein Heizwiderstand auf der Membran angeordnet sein, wobei die Temperaturerhöhung bei einer Beheizung des Heizwiderstandes mit dem wärmesensierenden Element gemessen wird.The invention is based on a device for heat detection and a method according to the type of the independent claims. Devices for heat detection, in particular infrared sensors, are already known, in which a heat-sensing element and an absorber layer are provided on a substrate. For a self-test function, a heating resistor can be arranged on the membrane in addition to the heat-sensing element, the temperature increase being measured when the heating resistor is heated with the heat-sensing element.
Vorteile der ErfindungAdvantages of the invention
Die erfindungsgemäße Vorrichtung und das Verfahren mit den Merkmalen der nebengeordneten Ansprüche haben demgegenüber den Vorteil, dass eine Selbsttestfunktion ohne zusätzliche Schichten zur Verfügung gestellt werden kann. Erfindungsgemäß wird als Absorberschicht bzw. als Absorber ein elektrisch leitfähiges Widerstandsmaterial eingesetzt. Die Absorberschicht wird damit gleichzeitig auch als Heizwiderstand genutzt. Zusätzliche Schichten wie beispielsweise einen Zwischenisolator und eine Widerstandsschicht mit gegebenenfalls weiteren Passivierungsschichten werden nicht benötigt. Die Absorberschicht selbst ist in den Selbsttest miteinbezogen.The device according to the invention and the method with the features of the independent claims have the advantage that a self-test function can be provided without additional layers. According to the invention, an electrically conductive resistance material is used as the absorber layer or as the absorber. The absorber layer is thus also used as a heating resistor. Additional layers such as, for example, an intermediate insulator and a resistance layer with, if appropriate, further passivation layers are not required. The absorber layer itself is included in the self-test.
Durch die in den Unteransprüchen aufgeführten Maßnahmen sind vorteilhafte Weiterbildungen und Verbesserungen des in den nebengeordneten Ansprüchen angegebenen Verfahrens und der Vorrichtung möglich. Besonders vorteilhaft ist, dass die
Absorberschicht mittels eines Kontaktierungsmittels elektrisch kontaktierbar vorgesehen ist. Dadurch ist es mit einfachen Mitteln möglich, die Absorberschicht als Heizwiderstand zur Selbsttestfunktionalität einzusetzen. Weiterhin ist es von Vorteil, dass das wärmesensierende Element auf einer Membran vorgesehen ist. Dadurch ist es erfindungsgemäß möglich, eine gute thermische Entkopplung des wärmesensierenden Elementes von dem Substrat herzustellen. Weiterhin ist es von Vorteil, dass an die Absorberschicht wenigstens zeitweise eine elektrische Spannung anlegbar ist. Damit ist es mit einfachen Mitteln möglich, den Selbsttest durchzuführen.The measures listed in the subclaims allow advantageous developments and improvements of the method and the device specified in the independent claims. It is particularly advantageous that the Absorber layer is provided electrically contactable by means of a contacting means. This makes it possible with simple means to use the absorber layer as a heating resistor for self-test functionality. It is also advantageous that the heat-sensing element is provided on a membrane. This makes it possible according to the invention to produce a good thermal decoupling of the heat-sensing element from the substrate. It is also advantageous that an electrical voltage can be applied to the absorber layer at least temporarily. This makes it possible to carry out the self-test with simple means.
Zeichnungdrawing
Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und in der nachfolgenden Beschreibung näher erläutert. Es zeigen Figur 1 eine erfindungsgemäße Vorrichtung in Draufsicht und Figur 2 eine erfindungsgemäße Vorrichtung in Seitenansicht.An embodiment of the invention is shown in the drawing and explained in more detail in the following description. 1 shows a device according to the invention in plan view and FIG. 2 shows a device according to the invention in side view.
Beschreibung des AusführungsbeispielsDescription of the embodiment
In Figur 1 ist eine erfϊndungsgemäße Vorrichtung dargestellt, wobei die Vorrichtung zur Wärmedetektion erfindungsgemäß auf einem Substrat 10 vorgesehen ist. Das Substrat 10 ist derart konfiguriert bzw. bearbeitet, dass eine Membran 2 in einem bestimmten Substratbereich vorgesehen ist. Auf der Membran befindet sich ein wärmesensierendes Element 1, welches insbesondere als Thermopile vorgesehen ist. In Figur 1 dargestellt sind die verschiedenen Drähte einer Mehrzahl von solchen Thermopile-Elementen. Auf dem wärmesensierenden Element 1 bzw. auf dem Thermopile 1 befindet sich eine Absorberschicht 3, welche Wärmestrahlung, die insbesondere als Infrarotstrahlung vorgesehen ist, absorbiert. Bei der Absorption von Infrarotstrahlung durch die Absorberschicht 3 kommt es zu einer Erwärmung der Absorberschicht 3. Diese Erwärmung der Absorberschicht 3 wird über das wärmesensierende Element 1 detektiert und in ein elektrisches Signal umgewandelt. Das elektrische Signal kann dann in einer Auswerteschaltung weiterverarbeitet werden und als Signal für die einfallende Wärmestrahlung dienen. Die Auswerteschaltung und die elektrische Anbindung des wärmesensierenden Elementes 1 ist jedoch in Figur 1 nicht dargestellt.
Um bei einer solchen Vorrichtung das korrekte Funktionieren testen zu können, ist es gemäß dem Stand der Technik vorgesehen, auf dem Thermopile bzw. im Bereich der Absorberschicht 3 einen Heizwiderstand vorzusehen. Der Heizwiderstand simuliert die Erwärmung der Absorberschicht 3 durch eine im Normalfall einfallende Wärmestrahlung. Für den Selbsttestfall wird die Erwärmung durch den Heizwiderstand vorgenommen. Zur Erzeugung des Heizwiderstandes für die Selbsttestfunktion müssen in der Regel zusätzliche Schichten im Bereich der Absorberschicht 3 vorgesehen sein. Erfindungsgemäß ist dies nicht notwendig. Erfindungsgemäß ist die Absorberschicht 3 elektrisch leitend vorgesehen. Hierzu kann die Absorberschicht aus folgenden Materialien aufgebaut sein bzw. diese umfassen: Graphithaltige Pasten, Graphithaltige Lacke, sogenannte „schwarze" Metallschichten (Au, Ag, Pt), die unter speziellen Abscheidebedingungen, rauhe Oberflächen bekommenFIG. 1 shows a device according to the invention, the device for heat detection being provided according to the invention on a substrate 10. The substrate 10 is configured or processed such that a membrane 2 is provided in a specific substrate area. There is a heat-sensing element 1 on the membrane, which is provided in particular as a thermopile. The various wires of a plurality of such thermopile elements are shown in FIG. On the heat-sensing element 1 or on the thermopile 1 there is an absorber layer 3, which absorbs heat radiation, which is provided in particular as infrared radiation. When infrared radiation is absorbed by the absorber layer 3, the absorber layer 3 is heated. This heating of the absorber layer 3 is detected via the heat-sensing element 1 and converted into an electrical signal. The electrical signal can then be further processed in an evaluation circuit and serve as a signal for the incident heat radiation. However, the evaluation circuit and the electrical connection of the heat-sensing element 1 are not shown in FIG. 1. In order to be able to test the correct functioning of such a device, the prior art provides for a heating resistor to be provided on the thermopile or in the region of the absorber layer 3. The heating resistor simulates the heating of the absorber layer 3 by normal heat radiation. For the self-test case, heating is carried out by the heating resistor. To generate the heating resistor for the self-test function, additional layers must generally be provided in the area of the absorber layer 3. According to the invention, this is not necessary. According to the invention, the absorber layer 3 is provided in an electrically conductive manner. For this purpose, the absorber layer can be built up from the following materials or comprise these: graphite-containing pastes, graphite-containing lacquers, so-called “black” metal layers (Au, Ag, Pt), which get rough surfaces under special deposition conditions
Es kann als Absorberschicht 3 auch ein Widerstandsmaterial eingesetzt werden, wie es aus der Hybridtechnik bekannt ist, beispielsweise Rutheniumhaltige Widerstandspaste Durch das Vorsehen der Absorberschicht 3 mit einem Material, welches elektrisch leitend ist, kann die Absorberschicht 3 gleichzeitig auch als Heizwiderstand genutzt werden. Zusätzliche Schichten wie beispielsweise einen Zwischenisolator, eine Widerstandsschicht und eventuell eine Passivierungsschicht können entfallen und werden nicht benötigt. Damit kann die Absorberschicht 3 in den Selbsttest miteinbezogen werden. Zum Betrieb der Absorberschicht 3 für den Fall eines Selbsttestes der erfindungsgemäßen Vorrichtung ist es erfindungsgemäß vorgesehen, im Bereich der Absorberschicht 3, d.h. insbesondere auf der Absorberschicht 3, erste und zweite Kontaktierungsmittel 4, 6 vorzusehen. Durch das erste Kontaktierungsmittel 4 und das zweite Kontaktierungsmittel 6 ist die Absorberschicht 3 elektrisch kontaktierbar vorgesehen. Die Kontaktierungsmittel 4, 6 sind insbesondere als Metallleitbahnen vorgesehen, die sich oberhalb der Absorberschicht 3 oder unterhalb der Absorberschicht 3 befinden können. Die Kontaktierungsmittel 4, 6 sind jeweils mit einem Anschlusspad verbunden, wobei das erste Kontaktierungsmittel 4 mit einem Anschlusspad 5 und das zweite Kontaktierungsmittel 6 mit einem Anschlusspad 7 verbunden ist. Über die Anschlusspads bzw. über die Beaufschlagung der Anschlusspads 5, 7 mit einer Spannung ist es möglich, eine elektrische Spannung an die Absorberschicht 3 anzulegen, sodass in der Absorberschicht 3 ein elektrischer Strom, der in Figur 1 mittels eines mit dem Bezugszeichen 45 versehenen Pfeils dargestellt ist, fließen kann.
Erfindungsgemäß ist es insbesondere vorgesehen, dass das wärmesensierende Element 1 durch seine Anordnung auf der Membran 2 thermisch von der Umgebung isoliert vorgesehen ist. Hierzu ist in Figur 2 eine Seitenansicht der erfindungsgemäßen Vorrichtung dargestellt. Auf dem Substrat 10 ist eine Membran 2 vorgesehen, welche das wärmesensierende Element 1 und die Absorberschicht 3 trägt. Weiterhin sind in Figur 2 das erste Kontaktierungsmittel 4 und der erste Anschlusspad 5 dargestellt. Durch die dünne Membran 2 ist es möglich, dass das wärmesensierende Element 1 thermisch von seiner Umgebung gut isoliert ist. Die Absorberschicht 3 wird beispielsweise mittels eines Siebdruckverfahrens auf das wärmesensierende Element 1 aufgebracht bzw. auf die Membran 2. Die Anschlusspads 5, 7 dienen dem Anschluss von Bonddrähten. Zur Durchführung des erfindungsgemäßen Verfahrens wird an die Kontaktierungsmittel 4, 6 eine Spannung angelegt, welche den Strom 45 durch die Absorberschicht 3 treibt. Hierdurch wird also der Strom 45 in der Absorberschicht 3 eingeprägt, sodass sich durch den Widerstand der Absorberschicht 3 eine Temperaturerhöhung in der Absorberschicht 3 einstellt, die in der Größenordnung der Temperaturerhöhung ist, die durch die Wärmestrahlung mittels der erfindungsgemäßen Vorrichtung detektiert werden soll. Dadurch wird also mittels des Selbsttestes am Ausgang des wärmesensierenden Elements 1 ein Signal registriert, welches in der Größenordnung des Messsignals ist. Die Zeitdauer des Selbsttests liegt bei einigen Millisekunden. Die Widerstände haben abhängig vom Material Größenordnungen von einigen Ohm (Metalle) bis Kiloohm (graphitgefüllte Pasten/Lacke, Widerstandspasten). Die Schichtdicke des Absorbers liegt zwischen einigen hundert Nanometern und einigen Mikrometern.
A resistance material can also be used as the absorber layer 3, as is known from hybrid technology, for example ruthenium-containing resistance paste. By providing the absorber layer 3 with a material that is electrically conductive, the absorber layer 3 can also be used as a heating resistor. Additional layers such as an intermediate insulator, a resistance layer and possibly a passivation layer can be omitted and are not required. The absorber layer 3 can thus be included in the self-test. To operate the absorber layer 3 in the event of a self-test of the device according to the invention, it is provided according to the invention to provide first and second contacting means 4, 6 in the region of the absorber layer 3, ie in particular on the absorber layer 3. The first contacting means 4 and the second contacting means 6 make the absorber layer 3 electrically contactable. The contacting means 4, 6 are provided in particular as metal interconnects, which can be located above the absorber layer 3 or below the absorber layer 3. The contacting means 4, 6 are each connected to a connection pad, the first contacting means 4 being connected to a connection pad 5 and the second contacting means 6 being connected to a connection pad 7. Via the connection pads or by applying a voltage to the connection pads 5, 7, it is possible to apply an electrical voltage to the absorber layer 3, so that in the absorber layer 3 an electrical current, which in FIG. 1 is indicated by an arrow with the reference symbol 45 is shown, can flow. According to the invention, it is provided in particular that the heat-sensing element 1 is provided in a thermally insulated manner from the surroundings due to its arrangement on the membrane 2. For this purpose, a side view of the device according to the invention is shown in FIG. A membrane 2 is provided on the substrate 10, which carries the heat-sensing element 1 and the absorber layer 3. Furthermore, the first contacting means 4 and the first connection pad 5 are shown in FIG. The thin membrane 2 makes it possible for the heat-sensing element 1 to be thermally well insulated from its surroundings. The absorber layer 3 is applied, for example, to the heat-sensing element 1 or to the membrane 2 by means of a screen printing method. The connection pads 5, 7 are used to connect bonding wires. To carry out the method according to the invention, a voltage is applied to the contacting means 4, 6, which drives the current 45 through the absorber layer 3. The current 45 is thus impressed in the absorber layer 3, so that the resistance of the absorber layer 3 results in a temperature increase in the absorber layer 3 which is of the same order of magnitude as the temperature increase which is to be detected by the heat radiation by means of the device according to the invention. As a result, a signal which is of the order of magnitude of the measurement signal is registered by means of the self-test at the output of the heat-sensing element 1. The self-test takes a few milliseconds. Depending on the material, the resistances are of the order of a few ohms (metals) to kiloohms (graphite-filled pastes / lacquers, resistance pastes). The layer thickness of the absorber is between a few hundred nanometers and a few micrometers.
Claims
1. Vorrichtung zur Wärmedetektion mit einem Substrat (10), einem wärmesensierenden Element (1) und einer Absorberschicht (3), dadurch gekennzeichnet, dass die Absorberschicht (3) elektrisch leitend vorgesehen ist.1. Device for heat detection with a substrate (10), a heat-sensing element (1) and an absorber layer (3), characterized in that the absorber layer (3) is provided in an electrically conductive manner.
2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass die Absorberschicht (3) mittels eines Kontaktierungsmittels (4, 6) elektrisch kontaktierbar vorgesehen ist.2. Device according to claim 1, characterized in that the absorber layer (3) by means of a contacting means (4, 6) is provided electrically contactable.
3. Vorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass das wärmesensierende Element (1) auf einer Membran (2) vorgesehen ist.3. Device according to claim 1 or 2, characterized in that the heat-sensing element (1) is provided on a membrane (2).
4. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass an die Absorberschicht (3) wenigstens zeitweise eine elektrische Spannung anlegbar ist.4. Device according to one of the preceding claims, characterized in that an electrical voltage can be applied to the absorber layer (3) at least temporarily.
5. Verfahren zum Betrieb einer Vorrichtung zur Wärmedetektion nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass wenigstens kurzzeitig die Absorberschicht (1) von einem elektrischen Strom (45) durchflössen wird.5. Method for operating a device for heat detection according to one of the preceding claims, characterized in that at least briefly an electrical current (45) flows through the absorber layer (1).
6. Verfahren nach Anspruch 5, dadurch gekennzeichnet, dass während des Stromflusses des Stromes (45) ein Selbsttest durchführbar ist. 6. The method according to claim 5, characterized in that a self-test can be carried out during the current flow of the current (45).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10243012A DE10243012B4 (en) | 2002-09-17 | 2002-09-17 | Device for heat detection and method |
DE10243012.8 | 2002-09-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004027358A1 true WO2004027358A1 (en) | 2004-04-01 |
Family
ID=31896065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2003/002791 WO2004027358A1 (en) | 2002-09-17 | 2003-08-21 | Device for detecting heat and corresponding method |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10243012B4 (en) |
WO (1) | WO2004027358A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9117258B2 (en) | 2008-06-03 | 2015-08-25 | Covidien Lp | Feature-based registration method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3599474A (en) * | 1969-07-25 | 1971-08-17 | Whittaker Corp | Self-calibrating heat flux transducer |
US6372656B1 (en) * | 1998-09-25 | 2002-04-16 | Robert Bosch Gmbh | Method of producing a radiation sensor |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19735379B4 (en) * | 1997-08-14 | 2008-06-05 | Perkinelmer Optoelectronics Gmbh | Sensor system and manufacturing process |
US6133572A (en) * | 1998-06-05 | 2000-10-17 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Infrared detector system with controlled thermal conductance |
-
2002
- 2002-09-17 DE DE10243012A patent/DE10243012B4/en not_active Expired - Fee Related
-
2003
- 2003-08-21 WO PCT/DE2003/002791 patent/WO2004027358A1/en not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3599474A (en) * | 1969-07-25 | 1971-08-17 | Whittaker Corp | Self-calibrating heat flux transducer |
US6372656B1 (en) * | 1998-09-25 | 2002-04-16 | Robert Bosch Gmbh | Method of producing a radiation sensor |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9117258B2 (en) | 2008-06-03 | 2015-08-25 | Covidien Lp | Feature-based registration method |
US9659374B2 (en) | 2008-06-03 | 2017-05-23 | Covidien Lp | Feature-based registration method |
US10096126B2 (en) | 2008-06-03 | 2018-10-09 | Covidien Lp | Feature-based registration method |
US11074702B2 (en) | 2008-06-03 | 2021-07-27 | Covidien Lp | Feature-based registration method |
US11783498B2 (en) | 2008-06-03 | 2023-10-10 | Covidien Lp | Feature-based registration method |
Also Published As
Publication number | Publication date |
---|---|
DE10243012B4 (en) | 2006-01-05 |
DE10243012A1 (en) | 2004-03-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69925878T2 (en) | Method and device for "flip-chip" mounting of an electronic component | |
DE102006055520A1 (en) | Device and method for checking the functionality or plausibility of a sensor based on an interdigital electrode system sensor and a sensor for detecting particles in a gas stream and its use | |
EP1990612B1 (en) | Device for two-dimensional measuring of the velocity field in flows | |
EP3615903B1 (en) | Sensor for measuring a spatial temperature profile and method for producing a sensor unit | |
WO2015162267A1 (en) | Shunt current measurement featuring temperature compensation | |
WO2014161521A1 (en) | Device for measuring the thermal conductivity of gas components of a gas mixture | |
EP2435797A2 (en) | Sensor element | |
DE19600541C2 (en) | Semiconductor acceleration detection device | |
WO2004027358A1 (en) | Device for detecting heat and corresponding method | |
DE3902096A1 (en) | METHOD AND DEVICE FOR DETERMINING THE THICKNESS OF A COATING ON A METAL SUBSTRATE | |
DE19708053B4 (en) | Method and sensor arrangement for the detection of condensation on surfaces | |
EP2534466B1 (en) | Sensing system for determining the fatigue on metal components | |
WO1999018429A1 (en) | Method for operating a gas sensor | |
DE102016200270A1 (en) | Apparatus and method for detecting a fluid | |
Mavinkurve et al. | Copper wire interconnect reliability evaluation using in-situ High Temperature Storage Life (HTSL) tests | |
WO2003026932A1 (en) | Method and device for recognition of a side impact on a motor vehicle | |
WO2006079488A2 (en) | Thermopile | |
EP1680771A1 (en) | Method for identifying analog measuring sensors and associated assembly | |
WO2020052860A1 (en) | Method for testing the integrity of a printed conductive track | |
DE102013216227A1 (en) | Capacitive self-diagnosis of the electrode system of a particle sensor | |
DE102019122701A1 (en) | Level detection using heating structures | |
WO2019120789A1 (en) | Sensor assembly for detecting particles of a measurement gas in a measurement gas chamber, and method for detecting particles of a measurement gas in a measurement gas chamber | |
DE102014214620A1 (en) | Device for gas analysis with thermally activated conversion element | |
EP1962070B1 (en) | High temperature sensor and test method therefor | |
Huff et al. | 1 mil gold bond wire study. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): JP US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase |
Ref country code: JP |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: JP |