WO2004030015A3 - Method and apparatus for an improved baffle plate in a plasma processing system - Google Patents

Method and apparatus for an improved baffle plate in a plasma processing system Download PDF

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Publication number
WO2004030015A3
WO2004030015A3 PCT/IB2003/005249 IB0305249W WO2004030015A3 WO 2004030015 A3 WO2004030015 A3 WO 2004030015A3 IB 0305249 W IB0305249 W IB 0305249W WO 2004030015 A3 WO2004030015 A3 WO 2004030015A3
Authority
WO
WIPO (PCT)
Prior art keywords
baffle plate
processing system
plasma processing
improved baffle
improved
Prior art date
Application number
PCT/IB2003/005249
Other languages
French (fr)
Other versions
WO2004030015A2 (en
Inventor
Hidehito Saigusa
Taira Takase
Kouji Mitsuhashi
Hiroyuki Nakayama
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2004539391A priority Critical patent/JP2006501610A/en
Priority to AU2003276601A priority patent/AU2003276601A1/en
Priority to CN038220792A priority patent/CN1682339B/en
Publication of WO2004030015A2 publication Critical patent/WO2004030015A2/en
Publication of WO2004030015A3 publication Critical patent/WO2004030015A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor

Abstract

The present invention presents an improved baffle plate for a plasma processing system, wherein the design and fabrication of the baffle plate advantageously provides for a uniform processing plasma in the process space with substantially minimal erosion of the baffle plate.
PCT/IB2003/005249 2002-09-30 2003-09-29 Method and apparatus for an improved baffle plate in a plasma processing system WO2004030015A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004539391A JP2006501610A (en) 2002-09-30 2003-09-29 Method and apparatus for improved baffle plates in a plasma processing system
AU2003276601A AU2003276601A1 (en) 2002-09-30 2003-09-29 Method and apparatus for an improved baffle plate in a plasma processing system
CN038220792A CN1682339B (en) 2002-09-30 2003-09-29 Method and apparatus for an improved baffle plate in a plasma processing system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/259,380 US7166166B2 (en) 2002-09-30 2002-09-30 Method and apparatus for an improved baffle plate in a plasma processing system
US10/259,380 2002-09-30

Publications (2)

Publication Number Publication Date
WO2004030015A2 WO2004030015A2 (en) 2004-04-08
WO2004030015A3 true WO2004030015A3 (en) 2004-06-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2003/005249 WO2004030015A2 (en) 2002-09-30 2003-09-29 Method and apparatus for an improved baffle plate in a plasma processing system

Country Status (6)

Country Link
US (2) US7166166B2 (en)
JP (1) JP2006501610A (en)
KR (1) KR100702296B1 (en)
CN (1) CN1682339B (en)
AU (1) AU2003276601A1 (en)
WO (1) WO2004030015A2 (en)

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US7678226B2 (en) 2002-09-30 2010-03-16 Tokyo Electron Limited Method and apparatus for an improved bellows shield in a plasma processing system
US7780786B2 (en) 2002-11-28 2010-08-24 Tokyo Electron Limited Internal member of a plasma processing vessel
US8057600B2 (en) 2002-09-30 2011-11-15 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
US8118936B2 (en) 2002-09-30 2012-02-21 Tokyo Electron Limited Method and apparatus for an improved baffle plate in a plasma processing system
US8117986B2 (en) 2002-09-30 2012-02-21 Tokyo Electron Limited Apparatus for an improved deposition shield in a plasma processing system

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US20040063333A1 (en) 2004-04-01
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US20070107846A1 (en) 2007-05-17
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KR20050054974A (en) 2005-06-10
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