WO2004033158A3 - Substrate handling system for aligning and orienting substrates during a transfer operation - Google Patents

Substrate handling system for aligning and orienting substrates during a transfer operation Download PDF

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Publication number
WO2004033158A3
WO2004033158A3 PCT/US2003/031865 US0331865W WO2004033158A3 WO 2004033158 A3 WO2004033158 A3 WO 2004033158A3 US 0331865 W US0331865 W US 0331865W WO 2004033158 A3 WO2004033158 A3 WO 2004033158A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
effector
robotic arm
aligning
handling system
Prior art date
Application number
PCT/US2003/031865
Other languages
French (fr)
Other versions
WO2004033158A2 (en
Inventor
Martin Aalund
Steve Remis
Alexandra Lita
Guokun Cui
Brian Loiler
Ray Rhodes
Matthew W Cody
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Priority to AU2003282480A priority Critical patent/AU2003282480A1/en
Publication of WO2004033158A2 publication Critical patent/WO2004033158A2/en
Publication of WO2004033158A3 publication Critical patent/WO2004033158A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm
    • Y10T74/20317—Robotic arm including electric motor

Abstract

A system is provided for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm (20) for moving a wafer from one station to a destination station (30, 32 and 34), and an end-effector (40) connected to an end of the robotic arm (20) for receiving the wafer. The end-effector (40) includes a mechanism form gripping the wafer (42), a direct drive motor for rotating the wafer gripping mechanism (42), and at least one sensor (44) for sensing the location and orientation of the wafer. A control processor (10) is provided for calculating the location of the center and the notch of the wafer based on generates an alignment signal for rotation the wafer gripping mechanism (42) so that the wafer is oriented at the predetermined position of the end-effector (40) while the robotic arm (20) is moving to another station (30, 32 and 34).
PCT/US2003/031865 2002-10-08 2003-10-08 Substrate handling system for aligning and orienting substrates during a transfer operation WO2004033158A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003282480A AU2003282480A1 (en) 2002-10-08 2003-10-08 Substrate handling system for aligning and orienting substrates during a transfer operation

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/267,008 2002-10-08
US10/267,008 US6813543B2 (en) 2002-10-08 2002-10-08 Substrate handling system for aligning and orienting substrates during a transfer operation

Publications (2)

Publication Number Publication Date
WO2004033158A2 WO2004033158A2 (en) 2004-04-22
WO2004033158A3 true WO2004033158A3 (en) 2004-05-27

Family

ID=32042774

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/031865 WO2004033158A2 (en) 2002-10-08 2003-10-08 Substrate handling system for aligning and orienting substrates during a transfer operation

Country Status (4)

Country Link
US (1) US6813543B2 (en)
AU (1) AU2003282480A1 (en)
TW (1) TW200418701A (en)
WO (1) WO2004033158A2 (en)

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US8016541B2 (en) * 2003-09-10 2011-09-13 Brooks Automation, Inc. Substrate handling system for aligning and orienting substrates during a transfer operation
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US7307695B2 (en) * 2003-10-10 2007-12-11 Asml Netherlands B.V. Method and device for alignment of a substrate
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
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JP4961895B2 (en) * 2006-08-25 2012-06-27 東京エレクトロン株式会社 Wafer transfer device, wafer transfer method, and storage medium
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US8823294B2 (en) 2007-06-27 2014-09-02 Brooks Automation, Inc. Commutation of an electromagnetic propulsion and guidance system
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KR101825595B1 (en) 2007-07-17 2018-02-05 브룩스 오토메이션 인코퍼레이티드 Substrate processing apparatus with motors integral to chamber walls
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US9245786B2 (en) * 2011-06-02 2016-01-26 Applied Materials, Inc. Apparatus and methods for positioning a substrate using capacitive sensors
US9442482B2 (en) * 2013-04-29 2016-09-13 GlobalFoundries, Inc. System and method for monitoring wafer handling and a wafer handling machine
JP5750472B2 (en) * 2013-05-22 2015-07-22 株式会社安川電機 Substrate transport robot, substrate transport system, and method for detecting substrate arrangement state
US10780586B2 (en) 2013-08-09 2020-09-22 Nidec Sankyo Corporation Horizontal articulated robot with bevel gears
JP6235881B2 (en) * 2013-08-09 2017-11-22 日本電産サンキョー株式会社 Industrial robot
KR20160055010A (en) * 2014-11-07 2016-05-17 삼성전자주식회사 wafer transfer robot and control method thereof
JP2016143787A (en) * 2015-02-03 2016-08-08 川崎重工業株式会社 Substrate transfer robot and substrate transfer method
JP6586394B2 (en) * 2016-03-28 2019-10-02 東京エレクトロン株式会社 How to get data representing capacitance
KR102181121B1 (en) 2016-09-20 2020-11-20 주식회사 원익아이피에스 Substrate transfer apparatus and control method of substrate transfer apparatus
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Also Published As

Publication number Publication date
AU2003282480A1 (en) 2004-05-04
WO2004033158A2 (en) 2004-04-22
US6813543B2 (en) 2004-11-02
US20040068347A1 (en) 2004-04-08
AU2003282480A8 (en) 2004-05-04
TW200418701A (en) 2004-10-01

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