WO2004044953A2 - High pressure compatible vacuum check for semiconductor wafer including lift mechanism - Google Patents
High pressure compatible vacuum check for semiconductor wafer including lift mechanism Download PDFInfo
- Publication number
- WO2004044953A2 WO2004044953A2 PCT/US2003/035017 US0335017W WO2004044953A2 WO 2004044953 A2 WO2004044953 A2 WO 2004044953A2 US 0335017 W US0335017 W US 0335017W WO 2004044953 A2 WO2004044953 A2 WO 2004044953A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- platen
- lift pin
- wafer
- vacuum
- lift
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003291698A AU2003291698A1 (en) | 2002-11-06 | 2003-11-03 | High pressure compatible vacuum check for semiconductor wafer including lift mechanism |
JP2004551690A JP2006505952A (en) | 2002-11-06 | 2003-11-03 | Vacuum chuck including lift mechanism adaptable to high pressure for semiconductor wafers |
EP03768590A EP1560680A2 (en) | 2002-11-06 | 2003-11-03 | High pressure compatible vacuum check for semiconductor wafer including lift mechanism |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/289,830 US6722642B1 (en) | 2002-11-06 | 2002-11-06 | High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism |
US10/289,830 | 2002-11-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004044953A2 true WO2004044953A2 (en) | 2004-05-27 |
WO2004044953A3 WO2004044953A3 (en) | 2005-04-21 |
Family
ID=32069426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/035017 WO2004044953A2 (en) | 2002-11-06 | 2003-11-03 | High pressure compatible vacuum check for semiconductor wafer including lift mechanism |
Country Status (7)
Country | Link |
---|---|
US (1) | US6722642B1 (en) |
EP (1) | EP1560680A2 (en) |
JP (1) | JP2006505952A (en) |
CN (1) | CN100396440C (en) |
AU (1) | AU2003291698A1 (en) |
TW (1) | TWI317675B (en) |
WO (1) | WO2004044953A2 (en) |
Cited By (1)
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US8999231B2 (en) * | 2006-05-24 | 2015-04-07 | United Technologies Corporation | Nickel alloy for repairs |
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US7392815B2 (en) * | 2003-03-31 | 2008-07-01 | Lam Research Corporation | Chamber for wafer cleaning and method for making the same |
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US7250374B2 (en) * | 2004-06-30 | 2007-07-31 | Tokyo Electron Limited | System and method for processing a substrate using supercritical carbon dioxide processing |
US7307019B2 (en) * | 2004-09-29 | 2007-12-11 | Tokyo Electron Limited | Method for supercritical carbon dioxide processing of fluoro-carbon films |
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US7244311B2 (en) | 2004-10-13 | 2007-07-17 | Lam Research Corporation | Heat transfer system for improved semiconductor processing uniformity |
US7434590B2 (en) * | 2004-12-22 | 2008-10-14 | Tokyo Electron Limited | Method and apparatus for clamping a substrate in a high pressure processing system |
US7767145B2 (en) | 2005-03-28 | 2010-08-03 | Toyko Electron Limited | High pressure fourier transform infrared cell |
US7789971B2 (en) | 2005-05-13 | 2010-09-07 | Tokyo Electron Limited | Treatment of substrate using functionalizing agent in supercritical carbon dioxide |
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KR100955730B1 (en) | 2008-05-30 | 2010-05-04 | 한국기계연구원 | vacuum chuk of Lloyd-type interference lithography system |
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AT11604U1 (en) * | 2009-08-20 | 2011-01-15 | Aichholzer Johann Ing | CARRIER FOR WAFER |
CN102110634B (en) * | 2010-11-22 | 2012-04-11 | 沈阳芯源微电子设备有限公司 | Rotary heating adsorption device |
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US9267605B2 (en) | 2011-11-07 | 2016-02-23 | Lam Research Corporation | Pressure control valve assembly of plasma processing chamber and rapid alternating process |
CN102610543B (en) * | 2012-01-18 | 2014-07-23 | 清华大学 | Variable-structure vacuum chamber for interior rarefied gas flow simulation verification and pressure detection |
CN103219259B (en) * | 2012-01-19 | 2017-09-12 | 昆山思拓机器有限公司 | A kind of wafer processing jig |
CN103325722B (en) * | 2013-05-24 | 2016-04-20 | 沈阳拓荆科技有限公司 | Wafer conveying mechanism and using method |
DE102014118830A1 (en) * | 2014-12-17 | 2016-06-23 | Mechatronic Systemtechnik Gmbh | Vacuum clamping device for clamping workpieces |
CN104924234B (en) * | 2015-04-30 | 2016-11-23 | 东南大学 | Adjustable fixture for hemisphere test specimen wet etching anisotropy rate test |
JP6510461B2 (en) * | 2016-05-25 | 2019-05-08 | 日本特殊陶業株式会社 | Substrate holding device |
US10468290B2 (en) | 2016-11-02 | 2019-11-05 | Ultratech, Inc. | Wafer chuck apparatus with micro-channel regions |
KR102358561B1 (en) * | 2017-06-08 | 2022-02-04 | 삼성전자주식회사 | Substrate processing apparatus and apparatus for manufacturing integrated circuit device |
KR102617972B1 (en) * | 2017-11-21 | 2023-12-22 | 램 리써치 코포레이션 | Bottom and middle edge rings |
CN110823922A (en) * | 2018-08-10 | 2020-02-21 | 鸿富锦精密电子(天津)有限公司 | Appearance detection device |
JP7308688B2 (en) | 2019-08-05 | 2023-07-14 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE DRYING METHOD |
US20210247178A1 (en) * | 2019-12-26 | 2021-08-12 | Nanjing LiAn Semiconductor Limited | Tool architecture for wafer geometry measurement in semiconductor industry |
WO2023022742A1 (en) * | 2021-08-14 | 2023-02-23 | Lam Research Corporation | Clockable substrate processing pedestal for use in semiconductor fabrication tools |
Citations (1)
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US6722642B1 (en) * | 2002-11-06 | 2004-04-20 | Tokyo Electron Limited | High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism |
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2002
- 2002-11-06 US US10/289,830 patent/US6722642B1/en not_active Expired - Fee Related
-
2003
- 2003-11-03 JP JP2004551690A patent/JP2006505952A/en active Pending
- 2003-11-03 EP EP03768590A patent/EP1560680A2/en not_active Withdrawn
- 2003-11-03 WO PCT/US2003/035017 patent/WO2004044953A2/en not_active Application Discontinuation
- 2003-11-03 CN CNB2003801028396A patent/CN100396440C/en not_active Expired - Fee Related
- 2003-11-03 AU AU2003291698A patent/AU2003291698A1/en not_active Abandoned
- 2003-11-05 TW TW092130960A patent/TWI317675B/en not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US6722642B1 (en) * | 2002-11-06 | 2004-04-20 | Tokyo Electron Limited | High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8999231B2 (en) * | 2006-05-24 | 2015-04-07 | United Technologies Corporation | Nickel alloy for repairs |
Also Published As
Publication number | Publication date |
---|---|
EP1560680A2 (en) | 2005-08-10 |
WO2004044953A3 (en) | 2005-04-21 |
JP2006505952A (en) | 2006-02-16 |
US6722642B1 (en) | 2004-04-20 |
CN100396440C (en) | 2008-06-25 |
CN1711154A (en) | 2005-12-21 |
AU2003291698A1 (en) | 2004-06-03 |
AU2003291698A8 (en) | 2004-06-03 |
TWI317675B (en) | 2009-12-01 |
TW200416111A (en) | 2004-09-01 |
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