WO2004044953A3 - High pressure compatible vacuum check for semiconductor wafer including lift mechanism - Google Patents

High pressure compatible vacuum check for semiconductor wafer including lift mechanism Download PDF

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Publication number
WO2004044953A3
WO2004044953A3 PCT/US2003/035017 US0335017W WO2004044953A3 WO 2004044953 A3 WO2004044953 A3 WO 2004044953A3 US 0335017 W US0335017 W US 0335017W WO 2004044953 A3 WO2004044953 A3 WO 2004044953A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor wafer
wafer
actuator mechanism
high pressure
wafer platen
Prior art date
Application number
PCT/US2003/035017
Other languages
French (fr)
Other versions
WO2004044953A2 (en
Inventor
Thomas R Sutton
Maximilian A Biberger
Original Assignee
Supercritical Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Supercritical Systems Inc filed Critical Supercritical Systems Inc
Priority to JP2004551690A priority Critical patent/JP2006505952A/en
Priority to AU2003291698A priority patent/AU2003291698A1/en
Priority to EP03768590A priority patent/EP1560680A2/en
Publication of WO2004044953A2 publication Critical patent/WO2004044953A2/en
Publication of WO2004044953A3 publication Critical patent/WO2004044953A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

A vacuum chuck fir holding a semiconductor wafer during high pressure processing comprises a wafer platen, first through third lift pins, and an actuator mechanism. The wafer platen comprises a smooth surface, first through third lift pin holes, and a vacuum opening. In use, the vacuum opening applies vacuum to a surface of a semiconductor wafer, which chucks the semiconductor wafer to the wafer platen. The first through third lift pins mount within the first of third lift pin holes, respectively. The actuator mechanism couples the first through third lifting pins to the wafer platen. The actuator mechanism couples the first through third lifting pins to the wafer platen. The actuator mechanism operates to extend the first through third lift pins in unison above the smooth surface of the wafer platen. The actuator mechanism operates to retract the first through third lift pins in unison to at least flush with the smooth surface of the wafer platen.
PCT/US2003/035017 2002-11-06 2003-11-03 High pressure compatible vacuum check for semiconductor wafer including lift mechanism WO2004044953A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004551690A JP2006505952A (en) 2002-11-06 2003-11-03 Vacuum chuck including lift mechanism adaptable to high pressure for semiconductor wafers
AU2003291698A AU2003291698A1 (en) 2002-11-06 2003-11-03 High pressure compatible vacuum check for semiconductor wafer including lift mechanism
EP03768590A EP1560680A2 (en) 2002-11-06 2003-11-03 High pressure compatible vacuum check for semiconductor wafer including lift mechanism

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/289,830 US6722642B1 (en) 2002-11-06 2002-11-06 High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism
US10/289,830 2002-11-06

Publications (2)

Publication Number Publication Date
WO2004044953A2 WO2004044953A2 (en) 2004-05-27
WO2004044953A3 true WO2004044953A3 (en) 2005-04-21

Family

ID=32069426

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/035017 WO2004044953A2 (en) 2002-11-06 2003-11-03 High pressure compatible vacuum check for semiconductor wafer including lift mechanism

Country Status (7)

Country Link
US (1) US6722642B1 (en)
EP (1) EP1560680A2 (en)
JP (1) JP2006505952A (en)
CN (1) CN100396440C (en)
AU (1) AU2003291698A1 (en)
TW (1) TWI317675B (en)
WO (1) WO2004044953A2 (en)

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Also Published As

Publication number Publication date
AU2003291698A8 (en) 2004-06-03
WO2004044953A2 (en) 2004-05-27
CN1711154A (en) 2005-12-21
TWI317675B (en) 2009-12-01
JP2006505952A (en) 2006-02-16
AU2003291698A1 (en) 2004-06-03
CN100396440C (en) 2008-06-25
US6722642B1 (en) 2004-04-20
EP1560680A2 (en) 2005-08-10
TW200416111A (en) 2004-09-01

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