WO2004048982A3 - Probe array and method of its manufacture - Google Patents
Probe array and method of its manufacture Download PDFInfo
- Publication number
- WO2004048982A3 WO2004048982A3 PCT/US2003/037611 US0337611W WO2004048982A3 WO 2004048982 A3 WO2004048982 A3 WO 2004048982A3 US 0337611 W US0337611 W US 0337611W WO 2004048982 A3 WO2004048982 A3 WO 2004048982A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probes
- probe
- substrate
- layer
- probe array
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03790017A EP1565757A2 (en) | 2002-11-25 | 2003-11-24 | Probe array and method of its manufacture |
AU2003293027A AU2003293027A1 (en) | 2002-11-25 | 2003-11-24 | Probe array and method of its manufacture |
JP2004555708A JP2006507506A (en) | 2002-11-25 | 2003-11-24 | Probe array and manufacturing method thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/302,969 | 2002-11-25 | ||
US10/302,969 US7122760B2 (en) | 2002-11-25 | 2002-11-25 | Using electric discharge machining to manufacture probes |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004048982A2 WO2004048982A2 (en) | 2004-06-10 |
WO2004048982A3 true WO2004048982A3 (en) | 2004-11-04 |
Family
ID=32324899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/037611 WO2004048982A2 (en) | 2002-11-25 | 2003-11-24 | Probe array and method of its manufacture |
Country Status (7)
Country | Link |
---|---|
US (3) | US7122760B2 (en) |
EP (1) | EP1565757A2 (en) |
JP (2) | JP2006507506A (en) |
KR (1) | KR20050086803A (en) |
CN (2) | CN100406898C (en) |
AU (1) | AU2003293027A1 (en) |
WO (1) | WO2004048982A2 (en) |
Families Citing this family (29)
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US7122760B2 (en) * | 2002-11-25 | 2006-10-17 | Formfactor, Inc. | Using electric discharge machining to manufacture probes |
DE102004051374A1 (en) * | 2003-10-30 | 2005-06-02 | Sumitomo Electric Industries, Ltd. | Electroformed ion implantation structural material and method of making the structural material |
US7271602B2 (en) * | 2005-02-16 | 2007-09-18 | Sv Probe Pte. Ltd. | Probe card assembly and method of attaching probes to the probe card assembly |
EP1737075B1 (en) * | 2005-06-23 | 2017-03-08 | Feinmetall GmbH | Contacting device |
US20070152685A1 (en) * | 2006-01-03 | 2007-07-05 | Formfactor, Inc. | A probe array structure and a method of making a probe array structure |
US7528618B2 (en) * | 2006-05-02 | 2009-05-05 | Formfactor, Inc. | Extended probe tips |
US8179153B2 (en) * | 2008-07-17 | 2012-05-15 | Spansion Llc | Probe apparatus, a process of forming a probe head, and a process of forming an electronic device |
US8089294B2 (en) * | 2008-08-05 | 2012-01-03 | WinMENS Technologies Co., Ltd. | MEMS probe fabrication on a reusable substrate for probe card application |
WO2011122068A1 (en) * | 2010-03-30 | 2011-10-06 | 住友電気工業株式会社 | Contact probe, contact probe connecting body and methods for manufacturing same |
JP2012145489A (en) * | 2011-01-13 | 2012-08-02 | Sankei Engineering:Kk | Manufacturing method of inspection probe |
KR102071841B1 (en) | 2011-12-21 | 2020-01-31 | 더 리전트 오브 더 유니버시티 오브 캘리포니아 | Interconnected corrugated carbon-based network |
CA2866250C (en) | 2012-03-05 | 2021-05-04 | Maher F. El-Kady | Capacitor with electrodes made of an interconnected corrugated carbon-based network |
CN103869109B (en) * | 2012-12-12 | 2017-10-10 | 华邦电子股份有限公司 | Probe card and its welding method |
WO2014113508A2 (en) | 2013-01-15 | 2014-07-24 | Microfabrica Inc. | Methods of forming parts using laser machining |
US10211495B2 (en) | 2014-06-16 | 2019-02-19 | The Regents Of The University Of California | Hybrid electrochemical cell |
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WO2016081638A1 (en) | 2014-11-18 | 2016-05-26 | The Regents Of The University Of California | Porous interconnected corrugated carbon-based network (iccn) composite |
CA3006997A1 (en) | 2015-12-22 | 2017-06-29 | The Regents Of The University Of California | Cellular graphene films |
AU2017209117B2 (en) | 2016-01-22 | 2021-10-21 | The Regents Of The University Of California | High-voltage devices |
CA3018568A1 (en) | 2016-03-23 | 2017-09-28 | The Regents Of The University Of California | Devices and methods for high voltage and solar applications |
US11097951B2 (en) | 2016-06-24 | 2021-08-24 | The Regents Of The University Of California | Production of carbon-based oxide and reduced carbon-based oxide on a large scale |
KR102535218B1 (en) | 2016-08-31 | 2023-05-22 | 더 리전트 오브 더 유니버시티 오브 캘리포니아 | Devices Including Carbon-Based Materials and Their Preparation |
CN107243679B (en) * | 2017-05-16 | 2019-04-26 | 深圳大学 | Thin slice queue microelectrode micro EDM method and device |
JP7277965B2 (en) | 2017-07-14 | 2023-05-19 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | A Simple Route from Carbon Nanodots to Highly Conductive Porous Graphene for Supercapacitor Applications |
CN107838509B (en) * | 2017-09-19 | 2019-06-18 | 南京航空航天大学 | Array tube electrode preparation method for Electrolyzed Processing |
US11828775B1 (en) | 2020-05-13 | 2023-11-28 | Microfabrica Inc. | Vertical probe arrays and improved methods for making using temporary or permanent alignment structures for setting or maintaining probe-to-probe relationships |
US11821918B1 (en) | 2020-04-24 | 2023-11-21 | Microfabrica Inc. | Buckling beam probe arrays and methods for making such arrays including forming probes with lateral positions matching guide plate hole positions |
US10938032B1 (en) | 2019-09-27 | 2021-03-02 | The Regents Of The University Of California | Composite graphene energy storage methods, devices, and systems |
US11921131B2 (en) * | 2021-03-18 | 2024-03-05 | Rohde & Schwarz Gmbh & Co. Kg | Method for manufacturing a measurement probe, and measurement probe |
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US20010052180A1 (en) * | 1998-05-19 | 2001-12-20 | Clayton Gary A. | Socket test probe and method of making |
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-
2002
- 2002-11-25 US US10/302,969 patent/US7122760B2/en not_active Expired - Fee Related
-
2003
- 2003-11-24 KR KR1020057009400A patent/KR20050086803A/en not_active Application Discontinuation
- 2003-11-24 WO PCT/US2003/037611 patent/WO2004048982A2/en active Application Filing
- 2003-11-24 AU AU2003293027A patent/AU2003293027A1/en not_active Abandoned
- 2003-11-24 JP JP2004555708A patent/JP2006507506A/en active Pending
- 2003-11-24 EP EP03790017A patent/EP1565757A2/en not_active Withdrawn
- 2003-11-24 CN CN2003801083603A patent/CN100406898C/en not_active Expired - Fee Related
- 2003-11-24 CN CNA2008101287412A patent/CN101308165A/en active Pending
-
2006
- 2006-10-17 US US11/550,340 patent/US7488917B2/en not_active Expired - Lifetime
-
2009
- 2009-02-10 US US12/368,531 patent/US20090139965A1/en not_active Abandoned
- 2009-12-21 JP JP2009289863A patent/JP2010107517A/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5286944A (en) * | 1992-03-25 | 1994-02-15 | Panasonic Technologies, Inc. | Method of manufacturing a multiple microelectrode assembly |
WO1996015458A1 (en) * | 1994-11-15 | 1996-05-23 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US20010052180A1 (en) * | 1998-05-19 | 2001-12-20 | Clayton Gary A. | Socket test probe and method of making |
Non-Patent Citations (1)
Title |
---|
TAKAHATA K ET AL: "A novel micro electro-discharge machining method using electrodes fabricated by the LIGA process", MICRO ELECTRO MECHANICAL SYSTEMS, 1999. MEMS '99. TWELFTH IEEE INTERNATIONAL CONFERENCE ON ORLANDO, FL, USA 17-21 JAN. 1999, PISCATAWAY, NJ, USA,IEEE, US, 17 January 1999 (1999-01-17), pages 238 - 243, XP010321753, ISBN: 0-7803-5194-0 * |
Also Published As
Publication number | Publication date |
---|---|
JP2006507506A (en) | 2006-03-02 |
KR20050086803A (en) | 2005-08-30 |
US20070062913A1 (en) | 2007-03-22 |
CN101308165A (en) | 2008-11-19 |
CN1735810A (en) | 2006-02-15 |
AU2003293027A1 (en) | 2004-06-18 |
CN100406898C (en) | 2008-07-30 |
EP1565757A2 (en) | 2005-08-24 |
US20090139965A1 (en) | 2009-06-04 |
JP2010107517A (en) | 2010-05-13 |
US7488917B2 (en) | 2009-02-10 |
US20040099641A1 (en) | 2004-05-27 |
US7122760B2 (en) | 2006-10-17 |
WO2004048982A2 (en) | 2004-06-10 |
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