WO2004056573A1 - Process for protectively coating hydraulic microcircuits against aggressive liquids, particularly for an ink jet printhead - Google Patents
Process for protectively coating hydraulic microcircuits against aggressive liquids, particularly for an ink jet printhead Download PDFInfo
- Publication number
- WO2004056573A1 WO2004056573A1 PCT/IT2003/000843 IT0300843W WO2004056573A1 WO 2004056573 A1 WO2004056573 A1 WO 2004056573A1 IT 0300843 W IT0300843 W IT 0300843W WO 2004056573 A1 WO2004056573 A1 WO 2004056573A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- metallic
- printhead
- resin
- protective
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 34
- 239000011248 coating agent Substances 0.000 title claims abstract description 11
- 238000000576 coating method Methods 0.000 title claims abstract description 11
- 239000007788 liquid Substances 0.000 title claims abstract description 9
- 239000010410 layer Substances 0.000 claims abstract description 81
- 238000000151 deposition Methods 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 16
- 239000011247 coating layer Substances 0.000 claims abstract description 13
- 239000011241 protective layer Substances 0.000 claims abstract description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 10
- 239000010703 silicon Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 239000004593 Epoxy Substances 0.000 claims abstract description 5
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 5
- 239000002253 acid Substances 0.000 claims abstract description 4
- 238000003486 chemical etching Methods 0.000 claims abstract description 4
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 4
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 4
- 230000001681 protective effect Effects 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims abstract description 4
- 230000008646 thermal stress Effects 0.000 claims abstract description 4
- 238000007738 vacuum evaporation Methods 0.000 claims abstract description 4
- 239000000976 ink Substances 0.000 claims description 46
- 239000011651 chromium Substances 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 230000000254 damaging effect Effects 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 4
- 229910001635 magnesium fluoride Inorganic materials 0.000 claims description 4
- 239000011253 protective coating Substances 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims 4
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 16
- 229910000510 noble metal Inorganic materials 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- NTWSIWWJPQHFTO-AATRIKPKSA-N (2E)-3-methylhex-2-enoic acid Chemical compound CCC\C(C)=C\C(O)=O NTWSIWWJPQHFTO-AATRIKPKSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-NJFSPNSNSA-N silicon-30 atom Chemical compound [30Si] XUIMIQQOPSSXEZ-NJFSPNSNSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1606—Coating the nozzle area or the ink chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14032—Structure of the pressure chamber
- B41J2/1404—Geometrical characteristics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1637—Manufacturing processes molding
- B41J2/1639—Manufacturing processes molding sacrificial molding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
Definitions
- This invention relates to a process for protectively coating hydraulic microcircuits
- this invention is intended for a process for producing a protective
- the invention relates to the
- the metallic structural layer is soldered to the layers underneath.
- the object of this invention is to present a process of coating hydraulic microcircuits
- Another object of the invention is to present a manufacturing process for an ink jet
- structural layer of dielectric material such as non-photosensitive epoxy or polyamide resin
- Another object of the invention is to treat the inner walls of the hydraulic microcircuits
- microcircuits of an ink jet printhead particularly resistant to aggressive inks and the printhead thus obtained are presented, being characterized as defined in the respective main claims.
- Figure 1 represents a perspective view of a silicon wafer, on which a plurality of "die"
- figure 2 represents a plan view of a portion of a die of fig. 1 for an ink jet printhead
- figure 3 represents a section, taken according to the line Ill-Ill in figure 2;
- figure 4 shows a flow diagram of the manufacturing process of the chambers, feeding
- FIGS 5 to 8 illustrate the successive steps in manufacture of the chambers, feeding
- this description refers to a process relating to an ink jet printhead for treating the inner walls of the chambers, feeding ducts and nozzles of said head, in such a
- feeding ducts and injection nozzles may be considered as
- FIG. 1 Depicted in figure 1 by way of an example is a wafer 10 of crystalline silicon, on which
- die 12 are indicated, constituting a like number of conventional type ink jet printheads, not yet
- figure 2 represented by way of non-restrictive example is the section of a
- fig. 2 shows this printhead, in which a die 20 can be seen which is made up of a
- the thermal elements 22 are covered by a protective layer 24, consisting of a deposit
- sacrificial metallic layer 26 provided with a protuberance 27, constituting the cast of at least
- noble metals such as for example nickel-gold, palladium-gold,
- a wafer 10 (fig. 1) is made available, comprising a plurality of partially
- step 41 illustrated in fig. 5, a coating layer 30 of noble metals, such as for example
- nickel-gold is deposited on the sacrificial layer 26 and on the cast 27 of the nozzle.
- the coating layer 30 may be of palladium-gold, or of rutenium, etc.;
- deposition is performed through an electrochemical process, of a type known to those skilled in the art.
- step 42 an adhesion layer 31 is applied on the layer 30 of noble metals to promote
- a structural layer 32 (fig. 6), made of a film of non-photosensitive epoxy or
- polyamide resin is deposited through' lamination on the coating layer 30, covered by the
- adhesion layer 31 this type of material is used to advantage to offer greater resistance to the
- step 44 polymerization is performed of the structural layer 32 to increase its resistance to
- step 45 illustrated in fig. 7, lapping is performed of the outer surface 33 of the
- step 46 anisotropic etching of the slot 29 is performed in the bottom part of the
- thickness of the remaining layer 38 of silicon, in correspondence with the slot 48, is of
- step 47 the sacrificial layer 26, 27 is removed with a chemical etching, conducted
- a highly acid bath for example made of a mix of HCI and HNO3 in a solution.
- Composition of the bath is prepared in such a way as not to attack the metallic layer 30,
- chambers 35, ducts 36 and nozzles 37 are obtained with their inner walls
- a metallic layer 39 to protect the resin consisting of a
- noble metal preferably chromium, and having a thickness of approximately 1000A 0 , is
- step 49 the final operations, known to those acquainted with the sector art, are
- MgF 2 + O 2 magnesium fluoride and oxygen
- silicon dioxide and chromium SiO 2 + Cr.
- the protective layer 39 may be formed of two
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03786220A EP1578611B1 (en) | 2002-12-19 | 2003-12-19 | Process for protectively coating hydraulic microcircuits against aggressive liquids, particularly for an ink jet printhead |
US10/539,121 US7332100B2 (en) | 2002-12-19 | 2003-12-19 | Process for protectively coating hydraulic microcircuits against agressive liquids, particularly for an ink jet printhead |
AU2003295217A AU2003295217A1 (en) | 2002-12-19 | 2003-12-19 | Process for protectively coating hydraulic microcircuits against aggressive liquids, particularly for an ink jet printhead |
AT03786220T ATE514560T1 (en) | 2002-12-19 | 2003-12-19 | METHOD FOR THE PROTECTIVE COATING OF HYDRAULIC MICRO CIRCUITS AGAINST AGGRESSIVE LIQUIDS, IN PARTICULAR FOR AN INK JET PRINT HEAD |
JP2004561989A JP4549190B2 (en) | 2002-12-19 | 2003-12-19 | Process for protective coating of hydraulic microcircuits against aggressive liquids, especially for inkjet printheads |
US12/003,157 US8109614B2 (en) | 2002-12-19 | 2007-12-20 | Process for protectively coating hydraulic microcircuits against aggressive liquids, particulary for an ink jet printhead |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITTO2002A001099 | 2002-12-19 | ||
IT001099A ITTO20021099A1 (en) | 2002-12-19 | 2002-12-19 | PROTECTIVE COATING PROCESS OF HYDRAULIC MICRO CIRCUITS COMPARED TO AGGRESSIVE LIQUIDS. PARTICULARLY FOR AN INK-JET PRINT HEAD. |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10539121 A-371-Of-International | 2003-12-19 | ||
US12/003,157 Division US8109614B2 (en) | 2002-12-19 | 2007-12-20 | Process for protectively coating hydraulic microcircuits against aggressive liquids, particulary for an ink jet printhead |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004056573A1 true WO2004056573A1 (en) | 2004-07-08 |
Family
ID=32676892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IT2003/000843 WO2004056573A1 (en) | 2002-12-19 | 2003-12-19 | Process for protectively coating hydraulic microcircuits against aggressive liquids, particularly for an ink jet printhead |
Country Status (7)
Country | Link |
---|---|
US (2) | US7332100B2 (en) |
EP (1) | EP1578611B1 (en) |
JP (1) | JP4549190B2 (en) |
AT (1) | ATE514560T1 (en) |
AU (1) | AU2003295217A1 (en) |
IT (1) | ITTO20021099A1 (en) |
WO (1) | WO2004056573A1 (en) |
Cited By (3)
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WO2014042625A1 (en) * | 2012-09-12 | 2014-03-20 | Hewlett-Packard Development Company, L.P. | Printhead protective coating |
WO2015005154A1 (en) * | 2013-07-09 | 2015-01-15 | Canon Kabushiki Kaisha | Liquid ejection head and process for producing the same |
US9427953B2 (en) | 2012-07-25 | 2016-08-30 | Canon Kabushiki Kaisha | Method of manufacturing liquid ejection head |
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US7107129B2 (en) * | 2002-02-28 | 2006-09-12 | Oshkosh Truck Corporation | Turret positioning system and method for a fire fighting vehicle |
JP2008023715A (en) * | 2006-07-18 | 2008-02-07 | Canon Inc | Liquid ejecting head and its manufacturing method |
US7699441B2 (en) * | 2006-12-12 | 2010-04-20 | Eastman Kodak Company | Liquid drop ejector having improved liquid chamber |
US7600856B2 (en) * | 2006-12-12 | 2009-10-13 | Eastman Kodak Company | Liquid ejector having improved chamber walls |
US7938974B2 (en) * | 2007-03-12 | 2011-05-10 | Silverbrook Research Pty Ltd | Method of fabricating printhead using metal film for protecting hydrophobic ink ejection face |
US7669967B2 (en) | 2007-03-12 | 2010-03-02 | Silverbrook Research Pty Ltd | Printhead having hydrophobic polymer coated on ink ejection face |
US7605009B2 (en) * | 2007-03-12 | 2009-10-20 | Silverbrook Research Pty Ltd | Method of fabrication MEMS integrated circuits |
US7735225B2 (en) | 2007-03-30 | 2010-06-15 | Xerox Corporation | Method of manufacturing a cast-in place ink feed structure using encapsulant |
JP5854693B2 (en) * | 2010-09-01 | 2016-02-09 | キヤノン株式会社 | Method for manufacturing liquid discharge head |
US9308726B2 (en) * | 2012-02-16 | 2016-04-12 | Xerox Corporation | Printhead fluid paths formed with sacrificial material patterned using additive manufacturing processes |
JP5980020B2 (en) * | 2012-07-10 | 2016-08-31 | キヤノン株式会社 | Manufacturing method of substrate for liquid discharge head |
JP5972139B2 (en) * | 2012-10-10 | 2016-08-17 | キヤノン株式会社 | Method for manufacturing liquid discharge head and liquid discharge head |
WO2014116207A1 (en) * | 2013-01-23 | 2014-07-31 | Hewlett-Packard Development Company, L.P. | Printhead die with multiple termination rings |
US9227418B1 (en) | 2013-03-13 | 2016-01-05 | Videojet Technologies Inc. | Inkjet cartridge with barrier layer |
US10556376B2 (en) * | 2013-09-19 | 2020-02-11 | Tredegar Film Products Corporation | Method of making forming screens |
WO2015116073A1 (en) * | 2014-01-30 | 2015-08-06 | Hewlett-Packard Development Company, L.P. | Printhead dies molded with nozzle health sensor |
EP3322591A4 (en) * | 2015-07-15 | 2019-03-13 | Hewlett-Packard Development Company, L.P. | Adhesion and insulating layer |
WO2017057063A1 (en) * | 2015-09-28 | 2017-04-06 | 京セラ株式会社 | Nozzle plate, liquid ejection head using same, and recording device |
EP3368874A4 (en) * | 2015-10-28 | 2019-06-05 | Hewlett-Packard Development Company, L.P. | Relative pressure sensor |
US10753815B2 (en) | 2015-10-28 | 2020-08-25 | Hewlett-Packard Development Company, L.P. | Relative pressure sensor |
WO2017074446A1 (en) * | 2015-10-30 | 2017-05-04 | Hewlett-Packard Development Company, L.P. | Fluid ejection device |
US11325125B2 (en) | 2017-04-23 | 2022-05-10 | Hewlett-Packard Development Company, L.P. | Particle separation |
US11787180B2 (en) | 2019-04-29 | 2023-10-17 | Hewlett-Packard Development Company, L.P. | Corrosion tolerant micro-electromechanical fluid ejection device |
WO2020263234A1 (en) | 2019-06-25 | 2020-12-30 | Hewlett-Packard Development Company, L.P. | Molded structures with channels |
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2002
- 2002-12-19 IT IT001099A patent/ITTO20021099A1/en unknown
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2003
- 2003-12-19 AT AT03786220T patent/ATE514560T1/en not_active IP Right Cessation
- 2003-12-19 EP EP03786220A patent/EP1578611B1/en not_active Expired - Lifetime
- 2003-12-19 US US10/539,121 patent/US7332100B2/en active Active
- 2003-12-19 WO PCT/IT2003/000843 patent/WO2004056573A1/en active Application Filing
- 2003-12-19 JP JP2004561989A patent/JP4549190B2/en not_active Expired - Fee Related
- 2003-12-19 AU AU2003295217A patent/AU2003295217A1/en not_active Abandoned
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2007
- 2007-12-20 US US12/003,157 patent/US8109614B2/en active Active
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US6045215A (en) | 1997-08-28 | 2000-04-04 | Hewlett-Packard Company | High durability ink cartridge printhead and method for making the same |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9427953B2 (en) | 2012-07-25 | 2016-08-30 | Canon Kabushiki Kaisha | Method of manufacturing liquid ejection head |
WO2014042625A1 (en) * | 2012-09-12 | 2014-03-20 | Hewlett-Packard Development Company, L.P. | Printhead protective coating |
US9597873B2 (en) | 2012-09-12 | 2017-03-21 | Hewlett-Packard Development Company, L.P. | Printhead protective coating |
WO2015005154A1 (en) * | 2013-07-09 | 2015-01-15 | Canon Kabushiki Kaisha | Liquid ejection head and process for producing the same |
CN105358324A (en) * | 2013-07-09 | 2016-02-24 | 佳能株式会社 | Liquid ejection head and process for producing the same |
US9895887B2 (en) | 2013-07-09 | 2018-02-20 | Canon Kabushiki Kaisha | Liquid ejection head and process for producing the same |
Also Published As
Publication number | Publication date |
---|---|
US20080099341A1 (en) | 2008-05-01 |
US7332100B2 (en) | 2008-02-19 |
US8109614B2 (en) | 2012-02-07 |
EP1578611A1 (en) | 2005-09-28 |
US20060066659A1 (en) | 2006-03-30 |
AU2003295217A1 (en) | 2004-07-14 |
ITTO20021099A1 (en) | 2004-06-20 |
JP4549190B2 (en) | 2010-09-22 |
EP1578611B1 (en) | 2011-06-29 |
ATE514560T1 (en) | 2011-07-15 |
JP2006510508A (en) | 2006-03-30 |
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