WO2004071144A1 - A shield can for shielding electronic components on a pwb - Google Patents
A shield can for shielding electronic components on a pwb Download PDFInfo
- Publication number
- WO2004071144A1 WO2004071144A1 PCT/EP2003/014798 EP0314798W WO2004071144A1 WO 2004071144 A1 WO2004071144 A1 WO 2004071144A1 EP 0314798 W EP0314798 W EP 0314798W WO 2004071144 A1 WO2004071144 A1 WO 2004071144A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- shield
- pwb
- sections
- solder paste
- upper cover
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BR0318090-5A BR0318090A (en) | 2003-02-07 | 2003-12-19 | Shield cage |
AU2003298234A AU2003298234A1 (en) | 2003-02-07 | 2003-12-19 | A shield can for shielding electronic components on a pwb |
JP2005515704A JP4657927B2 (en) | 2003-02-07 | 2003-12-19 | Shield can |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03388007 | 2003-02-07 | ||
EP03388007.1 | 2003-02-07 | ||
EP03388024A EP1445998B1 (en) | 2003-02-07 | 2003-04-25 | A shield can for shielding electronic components on a PWB |
EP03388024.6 | 2003-04-25 | ||
US46775403P | 2003-05-02 | 2003-05-02 | |
US60/467,754 | 2003-05-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004071144A1 true WO2004071144A1 (en) | 2004-08-19 |
Family
ID=32853969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2003/014798 WO2004071144A1 (en) | 2003-02-07 | 2003-12-19 | A shield can for shielding electronic components on a pwb |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4657927B2 (en) |
KR (1) | KR20060037236A (en) |
AU (1) | AU2003298234A1 (en) |
BR (1) | BR0318090A (en) |
WO (1) | WO2004071144A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10104763B2 (en) | 2014-10-17 | 2018-10-16 | 3M Innovative Properties Company | Electronic circuit board assembly including EMI shielding structure and thermal pad |
US10186350B2 (en) | 2016-07-26 | 2019-01-22 | General Cable Technologies Corporation | Cable having shielding tape with conductive shielding segments |
US10517198B1 (en) | 2018-06-14 | 2019-12-24 | General Cable Technologies Corporation | Cable having shielding tape with conductive shielding segments |
CN113766822A (en) * | 2021-10-28 | 2021-12-07 | 维沃移动通信有限公司 | Circuit board assembly and electronic equipment |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014220397A (en) * | 2013-05-09 | 2014-11-20 | 富士通株式会社 | Shield component and electronic apparatus |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5566055A (en) * | 1995-03-03 | 1996-10-15 | Parker-Hannifin Corporation | Shieled enclosure for electronics |
US5608188A (en) * | 1994-09-02 | 1997-03-04 | Motorola, Inc. | Multi compartment electromagnetic energy shield |
US5811050A (en) * | 1994-06-06 | 1998-09-22 | Gabower; John F. | Electromagnetic interference shield for electronic devices |
US6051780A (en) * | 1996-07-19 | 2000-04-18 | Nokia Mobiles Phones Ltd. | Screening device against electromagnetic radiation |
WO2002052916A1 (en) * | 2000-12-21 | 2002-07-04 | Shielding For Electronics, Inc. | Emi and rfi containment enclosure for electronic devices |
-
2003
- 2003-12-19 JP JP2005515704A patent/JP4657927B2/en not_active Expired - Fee Related
- 2003-12-19 BR BR0318090-5A patent/BR0318090A/en not_active IP Right Cessation
- 2003-12-19 WO PCT/EP2003/014798 patent/WO2004071144A1/en active Application Filing
- 2003-12-19 AU AU2003298234A patent/AU2003298234A1/en not_active Abandoned
- 2003-12-19 KR KR1020057014374A patent/KR20060037236A/en active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5811050A (en) * | 1994-06-06 | 1998-09-22 | Gabower; John F. | Electromagnetic interference shield for electronic devices |
US5608188A (en) * | 1994-09-02 | 1997-03-04 | Motorola, Inc. | Multi compartment electromagnetic energy shield |
US5566055A (en) * | 1995-03-03 | 1996-10-15 | Parker-Hannifin Corporation | Shieled enclosure for electronics |
US6051780A (en) * | 1996-07-19 | 2000-04-18 | Nokia Mobiles Phones Ltd. | Screening device against electromagnetic radiation |
WO2002052916A1 (en) * | 2000-12-21 | 2002-07-04 | Shielding For Electronics, Inc. | Emi and rfi containment enclosure for electronic devices |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10104763B2 (en) | 2014-10-17 | 2018-10-16 | 3M Innovative Properties Company | Electronic circuit board assembly including EMI shielding structure and thermal pad |
US10186350B2 (en) | 2016-07-26 | 2019-01-22 | General Cable Technologies Corporation | Cable having shielding tape with conductive shielding segments |
US10517198B1 (en) | 2018-06-14 | 2019-12-24 | General Cable Technologies Corporation | Cable having shielding tape with conductive shielding segments |
CN113766822A (en) * | 2021-10-28 | 2021-12-07 | 维沃移动通信有限公司 | Circuit board assembly and electronic equipment |
Also Published As
Publication number | Publication date |
---|---|
JP4657927B2 (en) | 2011-03-23 |
KR20060037236A (en) | 2006-05-03 |
BR0318090A (en) | 2005-12-20 |
AU2003298234A1 (en) | 2004-08-30 |
JP2006514442A (en) | 2006-04-27 |
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