WO2004072585A3 - Wafer bond strength evaluation apparatus - Google Patents

Wafer bond strength evaluation apparatus Download PDF

Info

Publication number
WO2004072585A3
WO2004072585A3 PCT/US2004/003602 US2004003602W WO2004072585A3 WO 2004072585 A3 WO2004072585 A3 WO 2004072585A3 US 2004003602 W US2004003602 W US 2004003602W WO 2004072585 A3 WO2004072585 A3 WO 2004072585A3
Authority
WO
WIPO (PCT)
Prior art keywords
bond strength
bond
axis adjustment
bonded wafer
wafer
Prior art date
Application number
PCT/US2004/003602
Other languages
French (fr)
Other versions
WO2004072585A2 (en
Inventor
Terry L Alford
Martin Mitan
Original Assignee
Univ Arizona
Terry L Alford
Martin Mitan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Arizona, Terry L Alford, Martin Mitan filed Critical Univ Arizona
Publication of WO2004072585A2 publication Critical patent/WO2004072585A2/en
Publication of WO2004072585A3 publication Critical patent/WO2004072585A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02—Details
    • G01N3/04—Chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/006—Crack, flaws, fracture or rupture
    • G01N2203/0062—Crack or flaws
    • G01N2203/0066—Propagation of crack
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/04—Chucks, fixtures, jaws, holders or anvils
    • G01N2203/0482—Chucks, fixtures, jaws, holders or anvils comprising sensing means
    • G01N2203/0494—Clamping ring, "whole periphery" clamping

Abstract

An apparatus and method for measuring bond strength of a bonded wafer that allows for more reliable and reproducible measurements, thereby allowing a better comparison of bond strengths of various wafers. A wafer receptacle (2) holds the bonded wafer (28) to be measured securely in place. A Z-axis adjustment device (10) with precision actuator is adjusted to align a blade with bond interface of the bonded wafer. An X-axis adjustment device (8) with precision actuator (18) connected to a spring is adjusted to introduce the blade into bond interface creating a crack, the length of which can be measured and used to determine bond strength. The stability and precision introduced by the Z-axis and X-axis adjustment devices also increase the reliability and reproducibility of the bond strength measurement.
PCT/US2004/003602 2003-02-05 2004-02-05 Wafer bond strength evaluation apparatus WO2004072585A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US44534303P 2003-02-05 2003-02-05
US60/445,343 2003-02-05

Publications (2)

Publication Number Publication Date
WO2004072585A2 WO2004072585A2 (en) 2004-08-26
WO2004072585A3 true WO2004072585A3 (en) 2004-12-02

Family

ID=32869350

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/003602 WO2004072585A2 (en) 2003-02-05 2004-02-05 Wafer bond strength evaluation apparatus

Country Status (1)

Country Link
WO (1) WO2004072585A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2112496A3 (en) * 2008-04-23 2013-04-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for repeated calculation of the bond strength of substrates bonded to each other
CN105334159B (en) * 2014-06-27 2018-06-29 中芯国际集成电路制造(上海)有限公司 A kind of accurate shearing test method
CN105333992B (en) * 2014-06-27 2018-03-30 中芯国际集成电路制造(上海)有限公司 A kind of method for measuring the vacuum in bonding chamber
CN107219123B (en) * 2017-06-06 2019-05-24 哈尔滨工业大学 A kind of method and clamping device of cross bonding method measurement bonding chip intensity
CN109524321B (en) * 2018-11-16 2021-12-07 上海华力微电子有限公司 Method for measuring bonding strength and bonded wafer adopting same
JP7194025B2 (en) * 2019-01-08 2022-12-21 三星電子株式会社 Wafer inspection equipment
CN109781517B (en) * 2019-01-11 2021-07-20 东南大学 Test fixture and test method for acquiring fracture mechanical parameters of asphalt cement and aggregate interface under microscopic scale
CN112701058B (en) * 2020-12-30 2022-09-02 长春长光圆辰微电子技术有限公司 Method for testing wafer bonding force
CN114252017A (en) * 2021-12-24 2022-03-29 上海芯物科技有限公司 Silicon wafer bonding force measuring device and measuring method
CN117433669B (en) * 2023-12-20 2024-03-19 北京青禾晶元半导体科技有限责任公司 Wafer bonding force testing device and testing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5275489A (en) * 1992-10-19 1994-01-04 General Electric Company Apparatus and method for inspecting an open-face cell structure bonded to a substrate
US6062461A (en) * 1998-06-03 2000-05-16 Delphi Technologies, Inc. Process for bonding micromachined wafers using solder
US6689245B2 (en) * 2001-06-07 2004-02-10 Lintec Corporation Die bonding sheet sticking apparatus and method of sticking die bonding sheet

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5275489A (en) * 1992-10-19 1994-01-04 General Electric Company Apparatus and method for inspecting an open-face cell structure bonded to a substrate
US6062461A (en) * 1998-06-03 2000-05-16 Delphi Technologies, Inc. Process for bonding micromachined wafers using solder
US6689245B2 (en) * 2001-06-07 2004-02-10 Lintec Corporation Die bonding sheet sticking apparatus and method of sticking die bonding sheet

Also Published As

Publication number Publication date
WO2004072585A2 (en) 2004-08-26

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