WO2004079797A3 - High speed electronics interconnect and method of manufacture - Google Patents
High speed electronics interconnect and method of manufacture Download PDFInfo
- Publication number
- WO2004079797A3 WO2004079797A3 PCT/US2004/006694 US2004006694W WO2004079797A3 WO 2004079797 A3 WO2004079797 A3 WO 2004079797A3 US 2004006694 W US2004006694 W US 2004006694W WO 2004079797 A3 WO2004079797 A3 WO 2004079797A3
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- WO
- WIPO (PCT)
- Prior art keywords
- manufacture
- high speed
- speed electronics
- electronics interconnect
- interconnect
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
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- H—ELECTRICITY
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2005—Electromagnetic photonic bandgaps [EPB], or photonic bandgaps [PBG]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0236—Electromagnetic band-gap structures
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- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
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- H05K1/00—Printed circuits
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- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
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- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/05573—Single external layer
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H05K1/0313—Organic insulating material
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
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Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45195003P | 2003-03-05 | 2003-03-05 | |
US60/451,950 | 2003-03-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004079797A2 WO2004079797A2 (en) | 2004-09-16 |
WO2004079797A3 true WO2004079797A3 (en) | 2006-06-15 |
Family
ID=32962666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/006694 WO2004079797A2 (en) | 2003-03-05 | 2004-03-04 | High speed electronics interconnect and method of manufacture |
Country Status (2)
Country | Link |
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US (4) | US7453143B2 (en) |
WO (1) | WO2004079797A2 (en) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6730540B2 (en) * | 2002-04-18 | 2004-05-04 | Tru-Si Technologies, Inc. | Clock distribution networks and conductive lines in semiconductor integrated circuits |
US7453143B2 (en) * | 2003-03-05 | 2008-11-18 | Banpil Photonics, Inc. | High speed electronics interconnect and method of manufacture |
US7880555B2 (en) * | 2004-03-04 | 2011-02-01 | Banpil Photonics, Inc. | Interconnection system with a dielectric system having holes therein that run uninterrupted through the dielectric system |
TWI286916B (en) * | 2004-10-18 | 2007-09-11 | Via Tech Inc | Circuit structure |
US7207807B2 (en) * | 2004-12-02 | 2007-04-24 | Tyco Electronics Corporation | Noise canceling differential connector and footprint |
US7349196B2 (en) | 2005-06-17 | 2008-03-25 | Industrial Technology Research Institute | Composite distributed dielectric structure |
JP4819639B2 (en) * | 2005-10-12 | 2011-11-24 | キヤノン株式会社 | Printed circuit board |
CN100490605C (en) * | 2005-11-11 | 2009-05-20 | 鸿富锦精密工业(深圳)有限公司 | Pcb |
JP2007166115A (en) * | 2005-12-12 | 2007-06-28 | Matsushita Electric Ind Co Ltd | Antenna device |
US20070145595A1 (en) * | 2005-12-27 | 2007-06-28 | Hall Stephen H | High speed interconnect |
CA2643163C (en) | 2006-02-27 | 2020-01-28 | Bayer Healthcare Llc | Temperature-adjusted analyte determination for biosensor systems |
US7427719B2 (en) * | 2006-03-21 | 2008-09-23 | Intel Corporation | Shifted segment layout for differential signal traces to mitigate bundle weave effect |
JP2007272984A (en) * | 2006-03-31 | 2007-10-18 | Hitachi Global Storage Technologies Netherlands Bv | Disk drive device, and head assembly used for the device |
US9504156B1 (en) * | 2006-04-07 | 2016-11-22 | Altera Corporation | Distribution of return paths for improved impedance control and reduced crosstalk |
US7727806B2 (en) * | 2006-05-01 | 2010-06-01 | Charles Stark Draper Laboratory, Inc. | Systems and methods for high density multi-component modules |
WO2008023506A1 (en) | 2006-08-02 | 2008-02-28 | Murata Manufacturing Co., Ltd. | Chip device |
US7561006B2 (en) * | 2006-08-25 | 2009-07-14 | Banpil Photonics, Inc. | Low loss electrical delay line |
US20080265377A1 (en) * | 2007-04-30 | 2008-10-30 | International Business Machines Corporation | Air gap with selective pinchoff using an anti-nucleation layer |
US20080284545A1 (en) * | 2007-05-15 | 2008-11-20 | George Andrew Keefe | Fixed impedance low pass metal powder filter with a planar buried stripline geometry |
US7999638B2 (en) * | 2007-06-28 | 2011-08-16 | Bae Systems Plc | Microwave circuit assembly comprising a microwave component suspended in a gas or vacuum region |
US8269344B2 (en) * | 2008-03-28 | 2012-09-18 | Broadcom Corporation | Method and system for inter-chip communication via integrated circuit package waveguides |
JP2009246157A (en) * | 2008-03-31 | 2009-10-22 | Toshiba Corp | High frequency band semiconductor device |
US8273603B2 (en) | 2008-04-04 | 2012-09-25 | The Charles Stark Draper Laboratory, Inc. | Interposers, electronic modules, and methods for forming the same |
US8017451B2 (en) * | 2008-04-04 | 2011-09-13 | The Charles Stark Draper Laboratory, Inc. | Electronic modules and methods for forming the same |
US7896698B2 (en) * | 2008-10-13 | 2011-03-01 | Tyco Electronics Corporation | Connector assembly having multiple contact arrangements |
US7736183B2 (en) * | 2008-10-13 | 2010-06-15 | Tyco Electronics Corporation | Connector assembly with variable stack heights having power and signal contacts |
US7740489B2 (en) * | 2008-10-13 | 2010-06-22 | Tyco Electronics Corporation | Connector assembly having a compressive coupling member |
US7867032B2 (en) * | 2008-10-13 | 2011-01-11 | Tyco Electronics Corporation | Connector assembly having signal and coaxial contacts |
US7637777B1 (en) | 2008-10-13 | 2009-12-29 | Tyco Electronics Corporation | Connector assembly having a noise-reducing contact pattern |
US8113851B2 (en) * | 2009-04-23 | 2012-02-14 | Tyco Electronics Corporation | Connector assemblies and systems including flexible circuits |
US7975378B1 (en) * | 2010-01-06 | 2011-07-12 | Banpil Photonics, Inc. | Method of manufacturing high speed printed circuit board interconnects |
US8274340B2 (en) * | 2010-01-26 | 2012-09-25 | Agilent Technologies, Inc. | Parallel transmission lines having different path lengths and including different properties for equalizing the path lengths there between |
US7918683B1 (en) | 2010-03-24 | 2011-04-05 | Tyco Electronics Corporation | Connector assemblies and daughter card assemblies configured to engage each other along a side interface |
KR101128546B1 (en) * | 2010-09-06 | 2012-03-27 | 삼성전기주식회사 | Solar cell module and method for manufacturing the same, and mobile apparatus with the solar cell module |
US8754338B2 (en) * | 2011-05-28 | 2014-06-17 | Banpil Photonics, Inc. | On-chip interconnects with reduced capacitance and method of afbrication |
JP5938223B2 (en) * | 2012-02-10 | 2016-06-22 | 日東電工株式会社 | Wiring circuit board and manufacturing method thereof |
US9405064B2 (en) * | 2012-04-04 | 2016-08-02 | Texas Instruments Incorporated | Microstrip line of different widths, ground planes of different distances |
KR20140024593A (en) * | 2012-08-20 | 2014-03-03 | 에스케이하이닉스 주식회사 | System package |
US9136236B2 (en) | 2012-09-28 | 2015-09-15 | Intel Corporation | Localized high density substrate routing |
US9190380B2 (en) | 2012-12-06 | 2015-11-17 | Intel Corporation | High density substrate routing in BBUL package |
JP6281868B2 (en) * | 2013-03-08 | 2018-02-21 | 国立大学法人大阪大学 | Photonic crystal slab electromagnetic wave absorber and high-frequency metal wiring circuit, electronic component, transmitter, receiver and proximity wireless communication system |
JP6215577B2 (en) * | 2013-05-31 | 2017-10-18 | 株式会社ヨコオ | Semiconductor package container, semiconductor device, electronic equipment |
US9159690B2 (en) | 2013-09-25 | 2015-10-13 | Intel Corporation | Tall solders for through-mold interconnect |
US9349703B2 (en) * | 2013-09-25 | 2016-05-24 | Intel Corporation | Method for making high density substrate interconnect using inkjet printing |
TWI477209B (en) * | 2014-04-08 | 2015-03-11 | Azotek Co Ltd | Composite substrate |
US9698700B2 (en) | 2015-03-11 | 2017-07-04 | DRS Consolidated Controls, Inc. | Predictive current control in bidirectional power converter |
US9621063B2 (en) | 2015-03-11 | 2017-04-11 | DRS Consolidated Controls, Inc. | Reference current generation in bidirectional power converter |
US10854761B1 (en) * | 2015-03-30 | 2020-12-01 | Southern Methodist University | Electronic switch and active artificial dielectric |
US10375823B2 (en) | 2015-06-03 | 2019-08-06 | Fci Usa Llc | Differential signal traces including a solder mask disposed thereon |
KR102549402B1 (en) | 2016-08-04 | 2023-06-28 | 삼성전자주식회사 | Semiconductor package and method for fabricating the same |
CN106507580B (en) * | 2016-12-12 | 2018-11-27 | 郑州云海信息技术有限公司 | A kind of PCB and signal transmission system |
CN108990258B (en) * | 2018-08-24 | 2021-06-29 | 郑州云海信息技术有限公司 | PCB and electronic equipment |
CN109583094B (en) * | 2018-12-03 | 2022-03-08 | 郑州云海信息技术有限公司 | Method for compensating length of high-speed line on PCB and related device |
US10986730B2 (en) * | 2019-03-08 | 2021-04-20 | Microsemi Semiconductor Ulc | Techniques for routing electrical signals through electrical components and related methods |
WO2021146517A1 (en) | 2020-01-17 | 2021-07-22 | Amphenol Corporation | Bend compensation for conductive traces on printed circuit boards |
US11658411B2 (en) | 2020-07-09 | 2023-05-23 | Dr. Alan Evans Business and Scientific Consulting, LLC | Electrically-controlled RF, microwave, and millimeter wave devices using tunable material-filled vias |
CN112436242A (en) * | 2020-10-26 | 2021-03-02 | 中国电子科技集团公司第十三研究所 | High integrated microwave assembly |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5724012A (en) * | 1994-02-03 | 1998-03-03 | Hollandse Signaalapparaten B.V. | Transmission-line network |
US5729047A (en) * | 1996-03-25 | 1998-03-17 | Micron Technology, Inc. | Method and structure for providing signal isolation and decoupling in an integrated circuit device |
US6518864B1 (en) * | 1999-03-15 | 2003-02-11 | Nec Corporation | Coplanar transmission line |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5227742A (en) * | 1982-07-02 | 1993-07-13 | Junkosha Co., Ltd. | Stripline cable having a porous dielectric tape with openings disposed therethrough |
GB2232822A (en) * | 1989-06-05 | 1990-12-19 | Marconi Co Ltd | Signal carrier support |
DE69020319T2 (en) * | 1989-12-11 | 1996-03-14 | Toyoda Chuo Kenkyusho Kk | Mobile antenna system. |
US5066928A (en) * | 1990-05-02 | 1991-11-19 | General Atomics | Soliton pulse compressor |
US5065122A (en) * | 1990-09-04 | 1991-11-12 | Motorola, Inc. | Transmission line using fluroplastic as a dielectric |
US5105055A (en) * | 1990-10-17 | 1992-04-14 | Digital Equipment Corporation | Tunnelled multiconductor system and method |
JP3241139B2 (en) * | 1993-02-04 | 2001-12-25 | 三菱電機株式会社 | Film carrier signal transmission line |
US5686764A (en) * | 1996-03-20 | 1997-11-11 | Lsi Logic Corporation | Flip chip package with reduced number of package layers |
JP4482949B2 (en) * | 1999-01-29 | 2010-06-16 | ソニー株式会社 | Flat display element and wiring method thereof |
US6525695B2 (en) * | 2001-04-30 | 2003-02-25 | E-Tenna Corporation | Reconfigurable artificial magnetic conductor using voltage controlled capacitors with coplanar resistive biasing network |
US20020183013A1 (en) * | 2001-05-25 | 2002-12-05 | Auckland David T. | Programmable radio frequency sub-system with integrated antennas and filters and wireless communication device using same |
US20030043071A1 (en) * | 2001-08-27 | 2003-03-06 | E-Tenna Corporation | Electro-mechanical scanned array system and method |
US6768476B2 (en) * | 2001-12-05 | 2004-07-27 | Etenna Corporation | Capacitively-loaded bent-wire monopole on an artificial magnetic conductor |
US6819373B2 (en) * | 2002-10-03 | 2004-11-16 | International Business Machines Corporation | Lamination of liquid crystal polymer dielectric films |
US7453143B2 (en) * | 2003-03-05 | 2008-11-18 | Banpil Photonics, Inc. | High speed electronics interconnect and method of manufacture |
US20050110138A1 (en) * | 2003-11-25 | 2005-05-26 | Banpil Photonics, Inc. | High Speed Electrical On-Chip Interconnects and Method of Manufacturing |
US7298234B2 (en) * | 2003-11-25 | 2007-11-20 | Banpil Photonics, Inc. | High speed electrical interconnects and method of manufacturing |
US7468645B2 (en) * | 2004-01-29 | 2008-12-23 | Sanyo Electric Co., Ltd. | Signal line circuit device |
US7755445B2 (en) * | 2004-08-03 | 2010-07-13 | Banpil Photonics, Inc. | Multi-layered high-speed printed circuit boards comprised of stacked dielectric systems |
-
2004
- 2004-03-04 US US10/793,363 patent/US7453143B2/en not_active Expired - Lifetime
- 2004-03-04 WO PCT/US2004/006694 patent/WO2004079797A2/en active Application Filing
- 2004-03-04 US US10/793,362 patent/US7432775B2/en not_active Expired - Lifetime
- 2004-03-04 US US10/793,576 patent/US7372144B2/en active Active
-
2008
- 2008-10-13 US US12/250,510 patent/US7719105B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5724012A (en) * | 1994-02-03 | 1998-03-03 | Hollandse Signaalapparaten B.V. | Transmission-line network |
US5729047A (en) * | 1996-03-25 | 1998-03-17 | Micron Technology, Inc. | Method and structure for providing signal isolation and decoupling in an integrated circuit device |
US6518864B1 (en) * | 1999-03-15 | 2003-02-11 | Nec Corporation | Coplanar transmission line |
Also Published As
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US20090096082A1 (en) | 2009-04-16 |
US7453143B2 (en) | 2008-11-18 |
US7432775B2 (en) | 2008-10-07 |
US7719105B2 (en) | 2010-05-18 |
US7372144B2 (en) | 2008-05-13 |
US20040173822A1 (en) | 2004-09-09 |
WO2004079797A2 (en) | 2004-09-16 |
US20040174223A1 (en) | 2004-09-09 |
US20040173880A1 (en) | 2004-09-09 |
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