WO2004082363A3 - Sensor assembly and methods of making and using same - Google Patents

Sensor assembly and methods of making and using same Download PDF

Info

Publication number
WO2004082363A3
WO2004082363A3 PCT/US2004/008291 US2004008291W WO2004082363A3 WO 2004082363 A3 WO2004082363 A3 WO 2004082363A3 US 2004008291 W US2004008291 W US 2004008291W WO 2004082363 A3 WO2004082363 A3 WO 2004082363A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensors
sensor
assembly
substrate
electronic component
Prior art date
Application number
PCT/US2004/008291
Other languages
French (fr)
Other versions
WO2004082363A2 (en
Inventor
Michael Nerenberg
James S Richey
Dragan Nebrigic
Jason Lee
Tim Leclair
Colby Bellew
Boyce E Collins
Kelvin Liu
Original Assignee
Michael Nerenberg
James S Richey
Dragan Nebrigic
Jason Lee
Tim Leclair
Colby Bellew
Boyce E Collins
Kelvin Liu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/392,448 external-priority patent/US20040038195A1/en
Application filed by Michael Nerenberg, James S Richey, Dragan Nebrigic, Jason Lee, Tim Leclair, Colby Bellew, Boyce E Collins, Kelvin Liu filed Critical Michael Nerenberg
Publication of WO2004082363A2 publication Critical patent/WO2004082363A2/en
Publication of WO2004082363A3 publication Critical patent/WO2004082363A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance

Abstract

A sensor assembly for sensors such as microfabricated resonant sensors is disclosed. The disclosed assembly provides improved performance of the sensors by providing a thermally insensitive environment and short pathways for signals to travel to processing components. Further, the assembly provide modular construction for the sensors and housing modules, thereby allowing replacement of the sensors at a lower cost. The assembly includes a sensor module including a sensor formed on a conductive substrate with a cavity formed on one surface. The substrate has conductive vias extending from the cavity to a second surface of the substrate. A housing assembly accommodates the sensor and includes a rigid housing, preferably made from a ceramic. An electronic component, such as an amplifier, is mounted on the rigid housing. The electronic component electrically engages the vias substantially at the second surface of the substrate. The electronic component receive signals from the sensor through the vias. The signals are then processed through an amplifier and a digital signal processor using a modified periodogram.
PCT/US2004/008291 2003-03-17 2004-03-17 Sensor assembly and methods of making and using same WO2004082363A2 (en)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US39244403A 2003-03-17 2003-03-17
US39244703A 2003-03-17 2003-03-17
US10/392,443 2003-03-17
US10/392,447 2003-03-17
US10/392,448 US20040038195A1 (en) 2000-09-20 2003-03-17 Microresonant sensors and methods of use thereof
US10/392,448 2003-03-17
US10/392,444 2003-03-17
US10/392,443 US20050040907A1 (en) 2000-09-20 2003-03-17 System and method for processing capacitive signals
US10/392,446 US20040043423A1 (en) 2000-09-20 2003-03-19 Substrates having through-hole vias and method of making same
US10/392,446 2003-03-19

Publications (2)

Publication Number Publication Date
WO2004082363A2 WO2004082363A2 (en) 2004-09-30
WO2004082363A3 true WO2004082363A3 (en) 2005-04-14

Family

ID=33033339

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/008291 WO2004082363A2 (en) 2003-03-17 2004-03-17 Sensor assembly and methods of making and using same

Country Status (1)

Country Link
WO (1) WO2004082363A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006015512B4 (en) * 2006-03-31 2010-01-21 Andreas Hettich Gmbh & Co. Kg Device comprising a measuring chamber and a resonator for the liquid sensor system which can be integrated into the measuring chamber via a quick-action closure
EP3332091A2 (en) 2015-08-07 2018-06-13 Saudi Arabian Oil Company Method and device for measuring fluid properties using an electromechanical resonator
US11333015B2 (en) 2016-08-04 2022-05-17 Saudi Arabian Oil Company Method for capacitive cancellation of tuning fork for fluid property measurements
US20220155247A1 (en) * 2019-03-26 2022-05-19 Cellmobility, Inc. Gas Sensor Device Based on Metal Oxide Foam

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001933A (en) * 1989-12-26 1991-03-26 The United States Of America As Represented By The Secretary Of The Army Micromechanical vibration sensor
US5254504A (en) * 1989-04-13 1993-10-19 Trustees Of The University Of Pennsylvania Method of manufacturing ferroelectric MOSFET sensors
US5852229A (en) * 1996-05-29 1998-12-22 Kimberly-Clark Worldwide, Inc. Piezoelectric resonator chemical sensing device
US5955932A (en) * 1992-12-11 1999-09-21 The Regents Of The University Of California Q-controlled microresonators and tunable electric filters using such resonators
US6087187A (en) * 1995-12-27 2000-07-11 Dade Behring Marburg Gmbh Mass-sensitive biosensors
US6429458B1 (en) * 1998-06-04 2002-08-06 The Regents Of The University Of Michigan Method of making a micromechanical device from a single crystal semiconductor substrate and monolithic sensor formed thereby

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5254504A (en) * 1989-04-13 1993-10-19 Trustees Of The University Of Pennsylvania Method of manufacturing ferroelectric MOSFET sensors
US5001933A (en) * 1989-12-26 1991-03-26 The United States Of America As Represented By The Secretary Of The Army Micromechanical vibration sensor
US5955932A (en) * 1992-12-11 1999-09-21 The Regents Of The University Of California Q-controlled microresonators and tunable electric filters using such resonators
US6087187A (en) * 1995-12-27 2000-07-11 Dade Behring Marburg Gmbh Mass-sensitive biosensors
US5852229A (en) * 1996-05-29 1998-12-22 Kimberly-Clark Worldwide, Inc. Piezoelectric resonator chemical sensing device
US6429458B1 (en) * 1998-06-04 2002-08-06 The Regents Of The University Of Michigan Method of making a micromechanical device from a single crystal semiconductor substrate and monolithic sensor formed thereby

Also Published As

Publication number Publication date
WO2004082363A2 (en) 2004-09-30

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