WO2004083760A3 - Multi-level microchannel heat exchangers - Google Patents

Multi-level microchannel heat exchangers Download PDF

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Publication number
WO2004083760A3
WO2004083760A3 PCT/US2004/006790 US2004006790W WO2004083760A3 WO 2004083760 A3 WO2004083760 A3 WO 2004083760A3 US 2004006790 W US2004006790 W US 2004006790W WO 2004083760 A3 WO2004083760 A3 WO 2004083760A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
channels
manifold
plane
heat exchangers
Prior art date
Application number
PCT/US2004/006790
Other languages
French (fr)
Other versions
WO2004083760A2 (en
Inventor
James Lovette
Peng Zhou
James Gill Shook
Original Assignee
Cooligy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc filed Critical Cooligy Inc
Publication of WO2004083760A2 publication Critical patent/WO2004083760A2/en
Publication of WO2004083760A3 publication Critical patent/WO2004083760A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2270/00—Thermal insulation; Thermal decoupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An apparatus and method of circulating a heat-absorbing material within a heat exchanger (100) is disclosed. The apparatus comprises a manifold layer (101) coupled to an interface layer (150). The manifold layer (101) comprises an inlet manifold (105, 115) and an outlet manifold 110. The interface layer (150) comprises a plurality of channels (105) that extend from the inlet manifold, toward a heat­exchanging plane (105A), and turn away from the heat-exchanging plane (150A), terminating at the outlet manifold (110). The plurality of channels (105) are stacked in a plane non-parallel to the heat-exchanging plane (150). Each of the channels (105) is adjacent to another, thus allowing heat radiated from a heat­ generating device (180) to be conducted to a cooling material circulating within the channels (105), away from the heat-generating device (180). Preferably, each of the channels (105) has a U-shape or an elongated U-shape.
PCT/US2004/006790 2003-03-17 2004-03-05 Multi-level microchannel heat exchangers WO2004083760A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US45572903P 2003-03-17 2003-03-17
US60/455,729 2003-03-17
US10/612,241 2003-07-01
US10/612,241 US7156159B2 (en) 2003-03-17 2003-07-01 Multi-level microchannel heat exchangers

Publications (2)

Publication Number Publication Date
WO2004083760A2 WO2004083760A2 (en) 2004-09-30
WO2004083760A3 true WO2004083760A3 (en) 2005-08-25

Family

ID=32994651

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/006790 WO2004083760A2 (en) 2003-03-17 2004-03-05 Multi-level microchannel heat exchangers

Country Status (3)

Country Link
US (1) US7156159B2 (en)
TW (1) TWI318290B (en)
WO (1) WO2004083760A2 (en)

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US20040182548A1 (en) 2004-09-23
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TWI318290B (en) 2009-12-11

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