WO2004083901A3 - Detection of macro-defects using micro-inspection inputs - Google Patents

Detection of macro-defects using micro-inspection inputs Download PDF

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Publication number
WO2004083901A3
WO2004083901A3 PCT/IL2004/000253 IL2004000253W WO2004083901A3 WO 2004083901 A3 WO2004083901 A3 WO 2004083901A3 IL 2004000253 W IL2004000253 W IL 2004000253W WO 2004083901 A3 WO2004083901 A3 WO 2004083901A3
Authority
WO
WIPO (PCT)
Prior art keywords
repeating cells
macro
defects
micro
detection
Prior art date
Application number
PCT/IL2004/000253
Other languages
French (fr)
Other versions
WO2004083901A2 (en
Inventor
Yamamoto Shigeru
Ofer Saphier
Raanan Adin
Original Assignee
Orbotech Ltd
Yamamoto Shigeru
Ofer Saphier
Raanan Adin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orbotech Ltd, Yamamoto Shigeru, Ofer Saphier, Raanan Adin filed Critical Orbotech Ltd
Priority to CN2004800123171A priority Critical patent/CN1839306B/en
Priority to KR1020057017277A priority patent/KR101146081B1/en
Publication of WO2004083901A2 publication Critical patent/WO2004083901A2/en
Publication of WO2004083901A3 publication Critical patent/WO2004083901A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Abstract

Apparatus for inspection includes optical inspection functionality (28) for providing at least one optical inspection output representative of a pattern of repeating cells on a substrate. Analysis functionality (32) is operative to receive the at least one optical inspection output and to isolate pre-selected features of the repeating cells. Analysis reporting functionality is operative on the isolated pre-selected features of the repeating cells for providing an output (34) indication of variations in at least one of the isolated pre-selected features, which variations occur over plural ones of the repeating cells.
PCT/IL2004/000253 2003-03-17 2004-03-17 Detection of macro-defects using micro-inspection inputs WO2004083901A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2004800123171A CN1839306B (en) 2003-03-17 2004-03-17 Detection of macro-defects using micro-inspection inputs
KR1020057017277A KR101146081B1 (en) 2003-03-17 2004-03-17 Detection of macro-defects using micro-inspection inputs

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003071791A JP3948728B2 (en) 2003-03-17 2003-03-17 Pattern inspection device
JP2003-071791 2003-03-17

Publications (2)

Publication Number Publication Date
WO2004083901A2 WO2004083901A2 (en) 2004-09-30
WO2004083901A3 true WO2004083901A3 (en) 2006-04-06

Family

ID=33027706

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2004/000253 WO2004083901A2 (en) 2003-03-17 2004-03-17 Detection of macro-defects using micro-inspection inputs

Country Status (5)

Country Link
JP (1) JP3948728B2 (en)
KR (1) KR101146081B1 (en)
CN (1) CN1839306B (en)
TW (1) TWI318680B (en)
WO (1) WO2004083901A2 (en)

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* Cited by examiner, † Cited by third party
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JP5069904B2 (en) * 2006-03-28 2012-11-07 株式会社日立ハイテクノロジーズ Designated position specifying method and designated position measuring device
JP4740825B2 (en) * 2006-11-13 2011-08-03 オリンパス株式会社 Small cleaning device
JP2010117185A (en) * 2008-11-11 2010-05-27 Olympus Corp Device and method for inspecting flaw
JP5534715B2 (en) 2009-05-27 2014-07-02 株式会社ジャパンディスプレイ Defect correction method and apparatus for electronic circuit pattern
CN103021899B (en) * 2012-12-21 2015-07-15 日月光半导体（昆山）有限公司 Semiconductor product detection machine and detection method thereof
CN103558229B (en) * 2013-11-25 2016-03-30 苏州富鑫林光电科技有限公司 A kind of MURA vision automatic testing method of TFT-LCD processing procedure and device
TWI521476B (en) * 2015-04-17 2016-02-11 銘傳大學 Automatic optical inspection method of periodic patterns
CN105489539B (en) * 2015-12-14 2018-11-20 重庆远创光电科技有限公司 A kind of chip carrier mechanism with light source
CN105428279B (en) * 2015-12-14 2018-06-26 重庆远创光电科技有限公司 Suitable for obtaining the control method of chip image
CN105448782B (en) * 2015-12-14 2018-11-20 重庆远创光电科技有限公司 A kind of chip vision detection system
DE102016107900B4 (en) * 2016-04-28 2020-10-08 Carl Zeiss Industrielle Messtechnik Gmbh Method and device for determining the edge of a measurement object in optical measurement technology
CN106097376B (en) * 2016-06-27 2020-06-23 昆山国显光电有限公司 Panel repairing method and device
WO2018006180A1 (en) * 2016-07-08 2018-01-11 Ats Automation Tooling Systems Inc. System and method for combined automatic and manual inspection
JP6984130B2 (en) * 2017-01-17 2021-12-17 オムロン株式会社 Image processing equipment, control systems, image processing equipment control methods, control programs, and recording media
CN109470713A (en) * 2017-09-07 2019-03-15 鸿骐新技股份有限公司 Infrared ray wafer detects board and chip deep layer position finding and detection method
US11557042B2 (en) * 2018-06-12 2023-01-17 King Abdullah University Of Science And Technology Single-camera particle tracking system and method
CN110346381B (en) * 2019-08-12 2022-03-08 衡阳师范学院 Optical element damage testing method and device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692943A (en) * 1983-12-30 1987-09-08 Dr. Ludwig Pietzsch Gmbh Method of and system for opto-electronic inspection of a two-dimensional pattern on an object
US6539106B1 (en) * 1999-01-08 2003-03-25 Applied Materials, Inc. Feature-based defect detection
US6654115B2 (en) * 2001-01-18 2003-11-25 Orbotech Ltd. System and method for multi-dimensional optical inspection

Family Cites Families (7)

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Publication number Priority date Publication date Assignee Title
JPH10260139A (en) 1997-03-17 1998-09-29 Olympus Optical Co Ltd Automatic inspection apparatus for substrate
JPH11201863A (en) 1998-01-07 1999-07-30 Alps Electric Co Ltd Pattern-inspecting apparatus
JP2000121570A (en) * 1998-10-20 2000-04-28 Hitachi Electronics Eng Co Ltd Defect inspection apparatus
IL126866A (en) * 1998-11-02 2003-02-12 Orbotech Ltd Apparatus and method for fabricating flat workpieces
JP2001319223A (en) * 2000-05-12 2001-11-16 Matsushita Electric Ind Co Ltd Method and device for measuring patten cycle
KR20040061590A (en) * 2002-12-31 2004-07-07 엘지.필립스 엘시디 주식회사 method for testing pattern of liquid crystal display device
KR100503530B1 (en) * 2003-01-02 2005-07-22 삼성전자주식회사 Method and apparatus for detecting defects on a wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692943A (en) * 1983-12-30 1987-09-08 Dr. Ludwig Pietzsch Gmbh Method of and system for opto-electronic inspection of a two-dimensional pattern on an object
US6539106B1 (en) * 1999-01-08 2003-03-25 Applied Materials, Inc. Feature-based defect detection
US6654115B2 (en) * 2001-01-18 2003-11-25 Orbotech Ltd. System and method for multi-dimensional optical inspection

Also Published As

Publication number Publication date
KR101146081B1 (en) 2012-05-15
TW200504328A (en) 2005-02-01
CN1839306A (en) 2006-09-27
WO2004083901A2 (en) 2004-09-30
JP2004279244A (en) 2004-10-07
CN1839306B (en) 2012-06-20
KR20050110005A (en) 2005-11-22
TWI318680B (en) 2009-12-21
JP3948728B2 (en) 2007-07-25

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