WO2004083980A3 - Method of mitigating effects of component deflection in a probe card analyzer - Google Patents

Method of mitigating effects of component deflection in a probe card analyzer Download PDF

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Publication number
WO2004083980A3
WO2004083980A3 PCT/US2004/007818 US2004007818W WO2004083980A3 WO 2004083980 A3 WO2004083980 A3 WO 2004083980A3 US 2004007818 W US2004007818 W US 2004007818W WO 2004083980 A3 WO2004083980 A3 WO 2004083980A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe card
card analyzer
mitigating effects
component deflection
mitigating
Prior art date
Application number
PCT/US2004/007818
Other languages
French (fr)
Other versions
WO2004083980A2 (en
Inventor
John T Strom
Raymond H Kraft
Original Assignee
Applied Precision Llc
John T Strom
Raymond H Kraft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Precision Llc, John T Strom, Raymond H Kraft filed Critical Applied Precision Llc
Priority to JP2006507186A priority Critical patent/JP5089166B2/en
Priority to EP04720500A priority patent/EP1604218A2/en
Publication of WO2004083980A2 publication Critical patent/WO2004083980A2/en
Publication of WO2004083980A3 publication Critical patent/WO2004083980A3/en
Priority to KR1020057017162A priority patent/KR101074901B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass

Abstract

A system and method of mitigating the effects of component deflections in a probe card analyzer system may implement three-dimensional comparative optical metrology techniques to model deflection characteristics. An exemplary system and method combine non-bussed electrical planarity measurements with fast optical planarity measurements to produce “effectively loaded” planarity measurements.
PCT/US2004/007818 2003-03-14 2004-03-12 Method of mitigating effects of component deflection in a probe card analyzer WO2004083980A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006507186A JP5089166B2 (en) 2003-03-14 2004-03-12 How to reduce the effects of component deflection in a probe card analyzer
EP04720500A EP1604218A2 (en) 2003-03-14 2004-03-12 Method of mitigating effects of component deflection in a probe card analyzer
KR1020057017162A KR101074901B1 (en) 2003-03-14 2005-09-13 Method of mitigating effects of component deflection in a probe card analyzer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45457403P 2003-03-14 2003-03-14
US60/454,574 2003-03-14

Publications (2)

Publication Number Publication Date
WO2004083980A2 WO2004083980A2 (en) 2004-09-30
WO2004083980A3 true WO2004083980A3 (en) 2004-11-04

Family

ID=33029894

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/007818 WO2004083980A2 (en) 2003-03-14 2004-03-12 Method of mitigating effects of component deflection in a probe card analyzer

Country Status (5)

Country Link
US (5) US7170307B2 (en)
EP (1) EP1604218A2 (en)
JP (1) JP5089166B2 (en)
KR (1) KR101074901B1 (en)
WO (1) WO2004083980A2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7170307B2 (en) * 2003-03-14 2007-01-30 Applied Precision, Llc System and method of mitigating effects of component deflection in a probe card analyzer
US8466703B2 (en) 2003-03-14 2013-06-18 Rudolph Technologies, Inc. Probe card analysis system and method
JP4996119B2 (en) * 2006-03-30 2012-08-08 東京エレクトロン株式会社 Probe tip position detection method, storage medium recording this method, and probe apparatus
KR101516828B1 (en) * 2006-12-19 2015-05-07 루돌프 테크놀로지스 인코퍼레이티드 probe card analysis system and method
WO2009048618A1 (en) * 2007-10-11 2009-04-16 Veraconnex, Llc Probe card test apparatus and method
DE202008013982U1 (en) * 2008-10-20 2009-01-08 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Measuring system for determining scattering parameters
US8436631B2 (en) * 2009-06-12 2013-05-07 Semicaps Pte Ltd Wafer stage
US8365611B1 (en) * 2009-11-30 2013-02-05 Amkor Technology, Inc. Bend test method and apparatus for flip chip devices
KR20130136794A (en) * 2012-06-05 2013-12-13 삼성전자주식회사 Equipment for testing semiconductor and method for testing semiconductor device using the same
WO2015001417A1 (en) * 2013-07-03 2015-01-08 Stichting Continuïteit Beijert Engineering Apparatus and method for inspecting pins on a probe card
US10281518B2 (en) * 2014-02-25 2019-05-07 Formfactor Beaverton, Inc. Systems and methods for on-wafer dynamic testing of electronic devices
JP6680695B2 (en) * 2014-06-06 2020-04-15 ルドルフ・テクノロジーズ，インコーポレーテッド Method of measuring and evaluating a probe card using an inspection device
US9885671B2 (en) 2014-06-09 2018-02-06 Kla-Tencor Corporation Miniaturized imaging apparatus for wafer edge
US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
US9997336B2 (en) 2016-04-26 2018-06-12 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-zone gas distribution plate (GDP) and a method for designing the multi-zone GDP
CN113495178A (en) * 2020-04-07 2021-10-12 迪科特测试科技(苏州)有限公司 Shielding for a detection system

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05157790A (en) * 1991-12-04 1993-06-25 Tokyo Kasoode Kenkyusho:Kk Device for inspecting probe card
US5657394A (en) * 1993-06-04 1997-08-12 Integrated Technology Corporation Integrated circuit probe card inspection system
US6002426A (en) * 1997-07-02 1999-12-14 Cerprobe Corporation Inverted alignment station and method for calibrating needles of probe card for probe testing of integrated circuits
US6040700A (en) * 1997-09-15 2000-03-21 Credence Systems Corporation Semiconductor tester system including test head supported by wafer prober frame
US6043668A (en) * 1997-12-12 2000-03-28 Sony Corporation Planarity verification system for integrated circuit test probes
DE20004439U1 (en) * 1999-03-09 2000-10-05 Applied Precision Inc Probe card examination system for determining the relative positions of probe tips

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4195259A (en) * 1978-04-04 1980-03-25 Texas Instruments Incorporated Multiprobe test system and method of using same
US4201939A (en) * 1978-06-26 1980-05-06 Texas Instruments Incorporated Multiprobe contact monitor and control system
EP0129062A3 (en) * 1983-05-18 1986-04-30 Gerd Prof. Dipl.-Ing. Selbach Laser measuring system for the measurement of clamping and aligning processes of machine tools and for vibration measurement
US5180977A (en) * 1991-12-02 1993-01-19 Hoya Corporation Usa Membrane probe contact bump compliancy system
US5974662A (en) * 1993-11-16 1999-11-02 Formfactor, Inc. Method of planarizing tips of probe elements of a probe card assembly
US5831443A (en) * 1996-06-05 1998-11-03 Applied Precision, Inc. Probe card array check plate with transition zones
US5861759A (en) * 1997-01-29 1999-01-19 Tokyo Electron Limited Automatic probe card planarization system
US5920068A (en) * 1998-03-05 1999-07-06 Micron Technology, Inc. Analysis of semiconductor surfaces by secondary ion mass spectrometry
US6239590B1 (en) * 1998-05-26 2001-05-29 Micron Technology, Inc. Calibration target for calibrating semiconductor wafer test systems
US6100709A (en) * 1998-05-29 2000-08-08 Intel Corporation Silicon wafer testing rig and a method for testing a silicon wafer wherein the silicon wafer is bent into a dome shape
US6414477B1 (en) * 1999-06-07 2002-07-02 Applied Precision, Inc. Method for optimizing probe card analysis and scrub mark analysis data
JP2001110857A (en) * 1999-10-06 2001-04-20 Tokyo Electron Ltd Probing method and device
DE10000845B4 (en) * 2000-01-12 2006-07-27 Bwg Bergwerk- Und Walzwerk-Maschinenbau Gmbh Method and device for non-contact flatness measurement of metal strips made of ferromagnetic materials
US6774621B2 (en) * 2000-06-15 2004-08-10 Tokyo Electron Limited Inspection stage having a plurality of Z axes
JP4782953B2 (en) * 2001-08-06 2011-09-28 東京エレクトロン株式会社 Probe card characteristic measuring device, probe device, and probe method
AU2002357335A1 (en) * 2001-12-28 2003-07-24 Applied Precision, Llc Stereoscopic three-dimensional metrology system and method
DE10205132A1 (en) * 2002-02-07 2003-08-28 Bfi Vdeh Inst Angewandte Forschung Gmbh Method and device for the optical measurement of the surface shape and for the optical surface inspection of moving strips in rolling and further processing plants
US6794889B2 (en) * 2002-04-26 2004-09-21 Agilent Technologies, Inc. Unified apparatus and method to assure probe card-to-wafer parallelism in semiconductor automatic wafer test, probe card measurement systems, and probe card manufacturing
US6870382B2 (en) * 2002-05-03 2005-03-22 Texas Instruments Incorporated System and method for evaluating the planarity and parallelism of an array of probe tips
US6841991B2 (en) * 2002-08-29 2005-01-11 Micron Technology, Inc. Planarity diagnostic system, E.G., for microelectronic component test systems
JP4659328B2 (en) * 2002-10-21 2011-03-30 東京エレクトロン株式会社 Probe device for controlling the temperature of an object to be inspected
US6720789B1 (en) * 2003-02-13 2004-04-13 International Business Machines Corporation Method for wafer test and wafer test system for implementing the method
US7170307B2 (en) * 2003-03-14 2007-01-30 Applied Precision, Llc System and method of mitigating effects of component deflection in a probe card analyzer
WO2004083873A2 (en) * 2003-03-14 2004-09-30 Applied Precision, Llc Adjusting device for the planarization of probe sets of a probe card

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05157790A (en) * 1991-12-04 1993-06-25 Tokyo Kasoode Kenkyusho:Kk Device for inspecting probe card
US5657394A (en) * 1993-06-04 1997-08-12 Integrated Technology Corporation Integrated circuit probe card inspection system
US6002426A (en) * 1997-07-02 1999-12-14 Cerprobe Corporation Inverted alignment station and method for calibrating needles of probe card for probe testing of integrated circuits
US6040700A (en) * 1997-09-15 2000-03-21 Credence Systems Corporation Semiconductor tester system including test head supported by wafer prober frame
US6043668A (en) * 1997-12-12 2000-03-28 Sony Corporation Planarity verification system for integrated circuit test probes
DE20004439U1 (en) * 1999-03-09 2000-10-05 Applied Precision Inc Probe card examination system for determining the relative positions of probe tips
US6710798B1 (en) * 1999-03-09 2004-03-23 Applied Precision Llc Methods and apparatus for determining the relative positions of probe tips on a printed circuit board probe card

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 553 (P - 1625) 5 October 1993 (1993-10-05) *

Also Published As

Publication number Publication date
US20120150475A1 (en) 2012-06-14
KR20050114235A (en) 2005-12-05
US7960981B2 (en) 2011-06-14
JP5089166B2 (en) 2012-12-05
US20070103181A1 (en) 2007-05-10
JP2006520474A (en) 2006-09-07
US20080238464A1 (en) 2008-10-02
KR101074901B1 (en) 2011-10-18
US20100073019A1 (en) 2010-03-25
US20040227533A1 (en) 2004-11-18
US7385409B2 (en) 2008-06-10
US7579853B2 (en) 2009-08-25
EP1604218A2 (en) 2005-12-14
US7170307B2 (en) 2007-01-30
WO2004083980A2 (en) 2004-09-30

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