WO2004086289A3 - Rfid tags and processes for producing rfid tags - Google Patents

Rfid tags and processes for producing rfid tags Download PDF

Info

Publication number
WO2004086289A3
WO2004086289A3 PCT/US2004/009070 US2004009070W WO2004086289A3 WO 2004086289 A3 WO2004086289 A3 WO 2004086289A3 US 2004009070 W US2004009070 W US 2004009070W WO 2004086289 A3 WO2004086289 A3 WO 2004086289A3
Authority
WO
WIPO (PCT)
Prior art keywords
rfid tags
processes
flexible substrate
producing
integrated circuit
Prior art date
Application number
PCT/US2004/009070
Other languages
French (fr)
Other versions
WO2004086289A2 (en
Inventor
Glen W Gengel
Mark A Hadley
Tom Pounds
Kenneth D Schatz
Paul S Drzaic
Original Assignee
Alien Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alien Technology Corp filed Critical Alien Technology Corp
Priority to EP04758132A priority Critical patent/EP1606778A4/en
Priority to CN2004800078250A priority patent/CN1764932B/en
Publication of WO2004086289A2 publication Critical patent/WO2004086289A2/en
Publication of WO2004086289A3 publication Critical patent/WO2004086289A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/027—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • D—TEXTILES; PAPER
    • D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B2401/00—Physical properties
    • D10B2401/18—Physical properties including electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/76—Apparatus for connecting with build-up interconnects
    • H01L2224/7615—Means for depositing
    • H01L2224/76151—Means for direct writing
    • H01L2224/76155—Jetting means, e.g. ink jet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/82009—Pre-treatment of the connector or the bonding area
    • H01L2224/8203—Reshaping, e.g. forming vias
    • H01L2224/82035—Reshaping, e.g. forming vias by heating means
    • H01L2224/82039—Reshaping, e.g. forming vias by heating means using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H01L2224/821—Forming a build-up interconnect
    • H01L2224/82101—Forming a build-up interconnect by additive methods, e.g. direct writing
    • H01L2224/82102—Forming a build-up interconnect by additive methods, e.g. direct writing using jetting, e.g. ink jet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Abstract

A Radio Frequency Identification (RFID) tag (10, 20) comprises a flexible substrate (28, 75, 83, 90) and an integrated circuit (26, 71, 85. 94) embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element (22, 24, 79, 81, 92, 93) is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.
PCT/US2004/009070 2003-03-24 2004-03-24 Rfid tags and processes for producing rfid tags WO2004086289A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04758132A EP1606778A4 (en) 2003-03-24 2004-03-24 Rfid tags and processes for producing rfid tags
CN2004800078250A CN1764932B (en) 2003-03-24 2004-03-24 RFID tags and processes for producing RFID tags

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US45726303P 2003-03-24 2003-03-24
US60/457,263 2003-03-24
US10/807,775 2004-03-23
US10/807,775 US7253735B2 (en) 2003-03-24 2004-03-23 RFID tags and processes for producing RFID tags

Publications (2)

Publication Number Publication Date
WO2004086289A2 WO2004086289A2 (en) 2004-10-07
WO2004086289A3 true WO2004086289A3 (en) 2005-04-14

Family

ID=32994822

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/009070 WO2004086289A2 (en) 2003-03-24 2004-03-24 Rfid tags and processes for producing rfid tags

Country Status (4)

Country Link
US (6) US7253735B2 (en)
EP (1) EP1606778A4 (en)
CN (1) CN1764932B (en)
WO (1) WO2004086289A2 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
US8865489B2 (en) 2009-05-12 2014-10-21 The Board Of Trustees Of The University Of Illinois Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8905772B2 (en) 2008-03-05 2014-12-09 The Board Of Trustees Of The University Of Illinois Stretchable and foldable electronic devices
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
US8946683B2 (en) 2008-06-16 2015-02-03 The Board Of Trustees Of The University Of Illinois Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates
US9012784B2 (en) 2008-10-07 2015-04-21 Mc10, Inc. Extremely stretchable electronics
US9105555B2 (en) 2004-06-04 2015-08-11 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US9117940B2 (en) 2007-01-17 2015-08-25 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US9159635B2 (en) 2011-05-27 2015-10-13 Mc10, Inc. Flexible electronic structure
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9289132B2 (en) 2008-10-07 2016-03-22 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US9324733B2 (en) 2004-06-04 2016-04-26 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
US9450043B2 (en) 2004-06-04 2016-09-20 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
US9554484B2 (en) 2012-03-30 2017-01-24 The Board Of Trustees Of The University Of Illinois Appendage mountable electronic devices conformable to surfaces

Families Citing this family (183)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6623579B1 (en) * 1999-11-02 2003-09-23 Alien Technology Corporation Methods and apparatus for fluidic self assembly
US6479395B1 (en) * 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US20030130912A1 (en) 2002-01-04 2003-07-10 Davis Tommy Lee Equipment management system
US7224280B2 (en) * 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
JP2005111973A (en) * 2003-09-18 2005-04-28 Konica Minolta Medical & Graphic Inc Printing plate material, printing plate material roll, printing plate manufacturing method, printing method, and printing plate material manufacturing method
US7691009B2 (en) * 2003-09-26 2010-04-06 Radar Golf, Inc. Apparatuses and methods relating to findable balls
US20080272885A1 (en) * 2004-01-22 2008-11-06 Mikoh Corporation Modular Radio Frequency Identification Tagging Method
US7384496B2 (en) 2004-02-23 2008-06-10 Checkpoint Systems, Inc. Security tag system for fabricating a tag including an integrated surface processing system
US7019391B2 (en) * 2004-04-06 2006-03-28 Bao Tran NANO IC packaging
KR100603761B1 (en) * 2004-04-22 2006-07-24 삼성전자주식회사 Microwave transponder
JP2008507114A (en) 2004-04-27 2008-03-06 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ Composite patterning device for soft lithography
US7268063B1 (en) * 2004-06-01 2007-09-11 University Of Central Florida Process for fabricating semiconductor component
US20060020803A1 (en) * 2004-07-06 2006-01-26 Zih Corp. Systems and methods for authentication of items or documents
US6957777B1 (en) * 2004-09-21 2005-10-25 Sheng-Chang Huang Label to be attached on a plastic product formed in a mold and identifiable by a detecting device
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
AU2005322072A1 (en) 2004-12-27 2006-07-06 Quantum Paper, Inc. Addressable and printable emissive display
US7712674B1 (en) * 2005-02-22 2010-05-11 Eigent Technologies Llc RFID devices for verification of correctness, reliability, functionality and security
CA2600055A1 (en) * 2005-02-23 2006-08-31 Textilma Ag Transponder-thread and application thereof
US7691280B2 (en) * 2005-03-25 2010-04-06 E. I. Du Pont De Nemours And Company Ink jet printing of etchants and modifiers
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
WO2006120309A2 (en) * 2005-05-11 2006-11-16 Stmicroelectronics Sa Silicon chips provided with inclined contact pads and an electronic module comprising said silicon chip
JP4815891B2 (en) 2005-06-22 2011-11-16 株式会社日立製作所 Wireless IC tag and antenna manufacturing method
US20060290498A1 (en) * 2005-06-23 2006-12-28 Ncr Corporation Incorporation of RFID devices into labels
US7436305B2 (en) * 2005-07-19 2008-10-14 Checkpoint Systems, Inc. RFID tags for pallets and cartons and system for attaching same
US7528727B2 (en) * 2005-08-04 2009-05-05 Sonoco Development, Inc. Tracking device for polymeric packaging
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition
WO2007025060A2 (en) * 2005-08-25 2007-03-01 Bae Systems Information And Electronics Systems Integration Inc. Rfid tag and method and apparatus for manufacturing same
US7408463B2 (en) 2005-09-30 2008-08-05 Intel Corporation Radio frequency identification tag
JP4896141B2 (en) * 2005-10-06 2012-03-14 テクスティルマ・アクチェンゲゼルシャフト Narrow loom
US20070130754A1 (en) * 2005-12-14 2007-06-14 Michael Fein Laser ablation prototyping of RFID antennas
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US8317107B2 (en) * 2005-12-30 2012-11-27 Intel Corporation Chip-spacer integrated radio frequency ID tags, methods of making same, and systems containing same
US20070158804A1 (en) * 2006-01-10 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method of semiconductor device, and RFID tag
US20070159337A1 (en) * 2006-01-12 2007-07-12 Sdgi Holdings, Inc. Modular RFID tag
EP1821241A3 (en) * 2006-02-15 2008-07-23 Assa Abloy AB Hybrid frequency contactless transponder unit, module for and method of manufacturing
KR20090032046A (en) * 2006-07-24 2009-03-31 텍스틸마 악티엔게젤샤프트 Rfid tag
US7561107B2 (en) * 2006-09-07 2009-07-14 Intelleflex Corporation RFID device with microstrip antennas
US20080062046A1 (en) * 2006-09-08 2008-03-13 Intelleflex Corporation Mounting structure for matching an rf integrated circuit with an antenna and rfid device implementing same
US8264366B2 (en) 2009-03-31 2012-09-11 Corning Incorporated Components, systems, and methods for associating sensor data with component location
US9652709B2 (en) 2006-10-31 2017-05-16 Fiber Mountain, Inc. Communications between multiple radio frequency identification (RFID) connected tags and one or more devices, and related systems and methods
US7782202B2 (en) 2006-10-31 2010-08-24 Corning Cable Systems, Llc Radio frequency identification of component connections
US7772975B2 (en) * 2006-10-31 2010-08-10 Corning Cable Systems, Llc System for mapping connections using RFID function
US9652708B2 (en) 2006-10-31 2017-05-16 Fiber Mountain, Inc. Protocol for communications between a radio frequency identification (RFID) tag and a connected device, and related systems and methods
US8421626B2 (en) * 2006-10-31 2013-04-16 Corning Cable Systems, Llc Radio frequency identification transponder for communicating condition of a component
US9652707B2 (en) 2006-10-31 2017-05-16 Fiber Mountain, Inc. Radio frequency identification (RFID) connected tag communications protocol and related systems and methods
US10032102B2 (en) 2006-10-31 2018-07-24 Fiber Mountain, Inc. Excess radio-frequency (RF) power storage in RF identification (RFID) tags, and related systems and methods
US8283683B2 (en) 2006-11-07 2012-10-09 Opto Tech Corporation Chip-bonding light emitting diode chip
US20080106415A1 (en) * 2006-11-08 2008-05-08 Macsema, Inc. Information tag
US7701352B2 (en) * 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
US7667574B2 (en) * 2006-12-14 2010-02-23 Corning Cable Systems, Llc Signal-processing systems and methods for RFID-tag signals
US8264355B2 (en) 2006-12-14 2012-09-11 Corning Cable Systems Llc RFID systems and methods for optical fiber network deployment and maintenance
US7760094B1 (en) 2006-12-14 2010-07-20 Corning Cable Systems Llc RFID systems and methods for optical fiber network deployment and maintenance
US7893385B2 (en) * 2007-03-01 2011-02-22 James Neil Rodgers Method for enhancing gain and range of an RFID antenna
US7965186B2 (en) 2007-03-09 2011-06-21 Corning Cable Systems, Llc Passive RFID elements having visual indicators
HK1109708A2 (en) * 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
EP2000957A1 (en) * 2007-05-21 2008-12-10 Gemplus Method of manufacturing a device comprising a radiofrequency transponder antenna with two terminal portions made on a single medium and device obtained
US8674593B2 (en) 2007-05-31 2014-03-18 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US8415879B2 (en) 2007-05-31 2013-04-09 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8889216B2 (en) 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
US8456393B2 (en) 2007-05-31 2013-06-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US8133768B2 (en) 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8846457B2 (en) 2007-05-31 2014-09-30 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9425357B2 (en) 2007-05-31 2016-08-23 Nthdegree Technologies Worldwide Inc. Diode for a printable composition
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US7952261B2 (en) 2007-06-29 2011-05-31 Bayer Materialscience Ag Electroactive polymer transducers for sensory feedback applications
DE102007043920A1 (en) 2007-07-17 2009-01-22 Merck Patent Gmbh Functional material for printed electronic components
US20090033495A1 (en) * 2007-08-03 2009-02-05 Akash Abraham Moldable radio frequency identification device
US7855697B2 (en) * 2007-08-13 2010-12-21 Corning Cable Systems, Llc Antenna systems for passive RFID tags
TW200919327A (en) * 2007-10-29 2009-05-01 China Steel Corp Three-dimensional wireless identification label adhered onto metal
US10339436B2 (en) 2015-05-21 2019-07-02 Smartrac Technology Fletcher, Inc. Multi-frequency radio frequency identification tag
US10262167B2 (en) 2008-01-31 2019-04-16 Smartrac Technology Fletcher, Inc. Detachable radio frequency identification switch tag
US8188927B1 (en) * 2008-03-11 2012-05-29 Impinj, Inc. RFID tag assembly methods
US11288564B1 (en) 2008-03-11 2022-03-29 Impinj, Inc. High-speed RFID tag assembly using impulse heating
US9436902B1 (en) 2008-03-11 2016-09-06 Impinj, International Ltd. RFID integrated circuits with large contact pads
US8881373B1 (en) 2008-03-11 2014-11-11 Impinj, Inc. Assembling a radio frequency identification (RFID) tag precursor
US9059074B2 (en) * 2008-03-26 2015-06-16 Stats Chippac Ltd. Integrated circuit package system with planar interconnect
DE102008016274A1 (en) * 2008-03-28 2009-10-01 Smartrac Ip B.V. Chip carrier for a transponder module and transponder module
US20090266736A1 (en) * 2008-04-25 2009-10-29 Drug Plastics & Glass Company, Inc. Container having an identification device molded therein and method of making same
US7992332B2 (en) 2008-05-13 2011-08-09 Nthdegree Technologies Worldwide Inc. Apparatuses for providing power for illumination of a display object
US8127477B2 (en) 2008-05-13 2012-03-06 Nthdegree Technologies Worldwide Inc Illuminating display systems
US8695207B2 (en) * 2008-06-02 2014-04-15 Nxp B.V. Method for manufacturing an electronic device
JP2009294953A (en) * 2008-06-05 2009-12-17 Hitachi Ltd Rfid thread, sheet with rfid thread and printing machine for sheet with rfid thread
US8044861B2 (en) * 2008-06-30 2011-10-25 Harris Corporation Electronic device with edge surface antenna elements and related methods
US8248208B2 (en) 2008-07-15 2012-08-21 Corning Cable Systems, Llc. RFID-based active labeling system for telecommunication systems
US7884721B2 (en) * 2008-08-25 2011-02-08 James Edward Gibson Devices for identifying and tracking wireless microphones
US8731405B2 (en) 2008-08-28 2014-05-20 Corning Cable Systems Llc RFID-based systems and methods for collecting telecommunications network information
US20150227829A1 (en) * 2008-08-29 2015-08-13 David Finn Laminates for security documents
US8222799B2 (en) 2008-11-05 2012-07-17 Bayer Materialscience Ag Surface deformation electroactive polymer transducers
US20100139756A1 (en) * 2008-12-10 2010-06-10 Palo Alto Research Center Incorporated Simultaneously Writing Bus Bars And Gridlines For Solar Cell
DE102009004491A1 (en) 2009-01-09 2010-07-15 Merck Patent Gmbh Functional material for printed electronic components
KR20100087932A (en) * 2009-01-29 2010-08-06 삼성전기주식회사 A method for die attach using self-assemble monolayer and a package substrate attached die using the self-assemble monolayer
EP2239793A1 (en) 2009-04-11 2010-10-13 Bayer MaterialScience AG Electrically switchable polymer film structure and use thereof
JP5540077B2 (en) * 2009-04-20 2014-07-02 フレクストロニクス エイピー エルエルシー Small RFID tag
US20100301005A1 (en) * 2009-05-29 2010-12-02 Nilsson Peter L J Method of Manufacturing an Electrical Circuit on a Substrate
US20100301006A1 (en) * 2009-05-29 2010-12-02 Nilsson Peter L J Method of Manufacturing an Electrical Component on a Substrate
GB2472025A (en) * 2009-07-21 2011-01-26 Univ Manchester Identification device
GB2472026A (en) * 2009-07-21 2011-01-26 Univ Manchester Signalling device
FR2948796A1 (en) * 2009-07-28 2011-02-04 Ask Sa RADIOFREQUENCY IDENTIFICATION DEVICE MEDIUM FOR A HYBRID CARD AND METHOD FOR MANUFACTURING THE SAME
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
US8469280B2 (en) 2009-10-22 2013-06-25 Intellipaper, Llc Programming devices and programming methods
US8561910B2 (en) 2009-10-22 2013-10-22 Intellipaper, Llc Memory programming methods and memory programming devices
US8469271B2 (en) 2009-10-22 2013-06-25 Intellipaper, Llc Electronic storage devices, programming methods, and device manufacturing methods
JP5403353B2 (en) * 2009-11-11 2014-01-29 日立化成株式会社 RFID tag manufacturing method
EP2507746B1 (en) 2009-11-30 2015-10-14 Corning Incorporated Rfid condition latching
JP6046491B2 (en) 2009-12-16 2016-12-21 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ In vivo electrophysiology using conformal electronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US8666471B2 (en) 2010-03-17 2014-03-04 The Board Of Trustees Of The University Of Illinois Implantable biomedical devices on bioresorbable substrates
DE102010012603B4 (en) * 2010-03-24 2019-09-12 Snaptrack, Inc. Front end module and method for operation in different circuit environments
WO2011127328A2 (en) * 2010-04-07 2011-10-13 Intellipaper, Llc Electronic assemblies and methods of forming electronic assemblies
US8172468B2 (en) 2010-05-06 2012-05-08 Corning Incorporated Radio frequency identification (RFID) in communication connections, including fiber optic components
US8849412B2 (en) 2011-01-28 2014-09-30 Micron Devices Llc Microwave field stimulator
EP3821941A1 (en) 2011-01-28 2021-05-19 Stimwave Technologies Incorporated Neural stimulator system
WO2012115717A2 (en) * 2011-02-24 2012-08-30 Mcclung Guy L Iii Nanotag indentification systems and methods
KR20140008416A (en) 2011-03-01 2014-01-21 바이엘 인텔렉쳐 프로퍼티 게엠베하 Automated manufacturing processes for producing deformable polymer devices and films
WO2012129357A2 (en) 2011-03-22 2012-09-27 Bayer Materialscience Ag Electroactive polymer actuator lenticular system
US9220897B2 (en) 2011-04-04 2015-12-29 Micron Devices Llc Implantable lead
JP6671843B2 (en) 2011-04-04 2020-03-25 マイクロン デヴァイシーズ リミテッド ライアビリティ カンパニー Implantable lead
US10885418B2 (en) 2011-05-06 2021-01-05 Neology, Inc. Detachable radio frequency identification switch tag
US10102685B2 (en) 2011-05-06 2018-10-16 Neology, Inc. Self declaring device for a vehicle using restrict traffic lanes
EP2710524B1 (en) * 2011-05-06 2019-01-23 Neology, Inc. Rfid switch tag
US11948035B2 (en) 2011-05-06 2024-04-02 Neology, Inc. RFID switch tag
US9765934B2 (en) 2011-05-16 2017-09-19 The Board Of Trustees Of The University Of Illinois Thermally managed LED arrays assembled by printing
JP5397423B2 (en) * 2011-07-01 2014-01-22 コニカミノルタ株式会社 Method for manufacturing non-contact information recording medium
JP2014524279A (en) 2011-07-29 2014-09-22 スティムウェイブ テクノロジーズ インコーポレイテッド Remote control of power or polarity selection for neurostimulators
EP2562692B1 (en) * 2011-08-25 2013-10-09 Textilma Ag RFID chip module
US9242103B2 (en) 2011-09-15 2016-01-26 Micron Devices Llc Relay module for implant
JP5912398B2 (en) * 2011-10-18 2016-04-27 アピックヤマダ株式会社 RFID tag, RFID tag manufacturing method, and mold
KR101979354B1 (en) 2011-12-01 2019-08-29 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 Transient devices designed to undergo programmable transformations
EP2828901B1 (en) 2012-03-21 2017-01-04 Parker Hannifin Corporation Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices
DE102012205768B4 (en) * 2012-04-10 2019-02-21 Smartrac Ip B.V. Transponder layer and method for its production
US9165232B2 (en) 2012-05-14 2015-10-20 Corning Incorporated Radio-frequency identification (RFID) tag-to-tag autoconnect discovery, and related methods, circuits, and systems
WO2013177006A2 (en) 2012-05-21 2013-11-28 Stimwave Technologies, Incorporated Methods and devices for modulating excitable tissue of the exiting spinal nerves
KR20150031285A (en) 2012-06-18 2015-03-23 바이엘 인텔렉쳐 프로퍼티 게엠베하 Stretch frame for stretching process
US9563832B2 (en) 2012-10-08 2017-02-07 Corning Incorporated Excess radio-frequency (RF) power storage and power sharing RF identification (RFID) tags, and related connection systems and methods
US9590193B2 (en) 2012-10-24 2017-03-07 Parker-Hannifin Corporation Polymer diode
EP2938393A1 (en) 2012-12-26 2015-11-04 Micron Devices, LLC Wearable antenna assembly
WO2014129069A1 (en) * 2013-02-22 2014-08-28 株式会社村田製作所 Sensor tag and method for manufacturing sensor tag
US8998101B2 (en) 2013-02-27 2015-04-07 Tata Consultancy Services Limited RFID tag enabled article and a method therefor
US10169698B1 (en) 2013-10-30 2019-01-01 Automated Assembly Corporation RF transponder on adhesive transfer tape
US9897292B1 (en) 2013-10-30 2018-02-20 Automated Assembly Corporation Solid-state lighting elements on adhesive transfer tape
US10402713B1 (en) 2013-10-30 2019-09-03 Automated Assembly Corporation RF transponder on adhesive transfer tape
US9379289B1 (en) 2013-10-30 2016-06-28 Automated Assembly Corporation LEDs on adhesive transfer tape
USD770991S1 (en) * 2013-11-05 2016-11-08 Nok Corporation Integrated circuit tag
WO2015175572A1 (en) 2014-05-12 2015-11-19 Micron Devices Llc Remote rf power system with low profile transmitting antenna
USD763833S1 (en) 2014-10-01 2016-08-16 Ohio State Innovation Foundation RFID tag
US10204297B2 (en) * 2014-10-06 2019-02-12 Itire, Llc Smart tag assembly for mounting on an object to be tracked
US10700052B2 (en) 2015-01-12 2020-06-30 Dolby Laboratories Licensing Corporation Pixel tile structures and layouts
US11403506B2 (en) 2015-05-21 2022-08-02 Neology, Inc. Detachable radio frequency identification switch tag
KR20180033468A (en) 2015-06-01 2018-04-03 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 Miniaturized electronic systems with wireless power and local communication capabilities
WO2016196673A1 (en) 2015-06-01 2016-12-08 The Board Of Trustees Of The University Of Illinois Alternative approach to uv sensing
US9984962B2 (en) 2015-08-31 2018-05-29 Arizona Board Of Regents On Behalf Of Arizona State University Systems and methods for hybrid flexible electronics with rigid integrated circuits
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
GB201523093D0 (en) * 2015-12-30 2016-02-10 Univ Nottingham Trent Electronic strip yarn
US11296398B2 (en) 2016-10-06 2022-04-05 Avery Dennison Retail Information Services Llc Methods for creating RFID tags based on flexible antenna materials
US10685273B2 (en) 2016-10-07 2020-06-16 Avery Dennison Retail Information Services, Llc Vibratory feeder systems for RFID elements
US11017185B2 (en) * 2016-11-16 2021-05-25 Avery Dennison Retail Information Services Llc Programming and testing of wire RFID tags
BR112019017574B1 (en) * 2017-03-08 2023-02-14 Agco Corporation BALE IDENTIFICATION ASSEMBLY FOR ATTACHING AN IDENTIFICATION LABEL TO A BALE OF AGRICULTURAL HARVEST MATERIAL
US10578495B2 (en) * 2017-05-23 2020-03-03 Barry Nicholson, JR. Temperature measuring and logging slide
MA51218A (en) * 2017-12-01 2021-05-19 Avery Dennison Retail Information Services Llc FLEXIBLE FABRIC LABEL USING OPENINGS IN A SUBSTRATE
EP3797407A1 (en) 2018-05-22 2021-03-31 Sensormatic Electronics, LLC Elongate flexible tag
US10398873B1 (en) 2018-07-20 2019-09-03 Automated Assembly Corporation Rolled substrate cable
US11551537B2 (en) 2019-04-11 2023-01-10 Nexite Ltd. Wireless dual-mode identification tag
CN114600379A (en) 2019-04-11 2022-06-07 奈克赛特公司 Wireless dual-mode identification tag
CN113228052A (en) * 2019-05-08 2021-08-06 惠普发展公司，有限责任合伙企业 Information kiosk equipment with storage box
GB2587033A (en) * 2019-09-16 2021-03-17 Payper Tech Limited Printing substrate, method of manufacture, method of use, and computer system
US10970613B1 (en) 2019-09-18 2021-04-06 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US11443160B2 (en) 2019-09-18 2022-09-13 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
US11055588B2 (en) 2019-11-27 2021-07-06 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
US11694057B2 (en) 2020-01-03 2023-07-04 Sensormatic Electronics, LLC RFID tag and method of making same
EP4275160A1 (en) 2021-01-11 2023-11-15 Nexite Ltd. Contactless and automatic operations of a retail store
DE102021102349A1 (en) 2021-02-02 2022-08-04 Manfred Rietzler RFID tag for attaching to a piece of clothing
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
US20230186329A1 (en) 2021-12-13 2023-06-15 Nexite Ltd. Systems and methods for estimating foot traffic
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5566441A (en) * 1993-03-11 1996-10-22 British Technology Group Limited Attaching an electronic circuit to a substrate

Family Cites Families (262)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2551591A (en) 1944-11-17 1951-05-08 Int Standard Electric Corp Polyethylene bonded to copper by means of a layer of cuprous oxide integral with copper base
US3024151A (en) 1957-09-30 1962-03-06 Automated Circuits Inc Printed electrical circuits and method of making the same
US3458382A (en) 1965-10-24 1969-07-29 Schjeldahl Co G T Laminator assembly
US3390308A (en) 1966-03-31 1968-06-25 Itt Multiple chip integrated circuit assembly
US3440027A (en) 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
US3689991A (en) 1968-03-01 1972-09-12 Gen Electric A method of manufacturing a semiconductor device utilizing a flexible carrier
US3708860A (en) 1971-03-04 1973-01-09 Eastman Kodak Co Method and apparatus for chopping a plurality of articles and depositing the articles in complementary article receptors
US3724737A (en) 1971-10-06 1973-04-03 E Bodnar Spreader for slit web material
JPS49131863U (en) * 1973-03-10 1974-11-13
US3891157A (en) 1973-06-04 1975-06-24 Beloit Corp Slitting mechanism for winder
US3989575A (en) 1975-04-16 1976-11-02 Oliver Machinery Company Split labeling apparatus
US4246595A (en) 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
DE2810005A1 (en) 1978-03-08 1979-09-20 Egon P Schubert Clothes line assembly - pivots on ceiling mountings to give upper and lower positions to free room space
AT374596B (en) 1979-04-20 1984-05-10 Enander Bengt TO FIND AVALANCHE VICTIMS, ANSWERS TO BE WEARED ON THE BODY
CH642594A5 (en) 1979-06-25 1984-04-30 Hunkeler Jos Ag Fabrik Fuer Gr METHOD AND DEVICE FOR AUTOMATICALLY APPLYING STICKERS ON A CONTINUOUS RAILWAY.
DE3203943A1 (en) 1982-02-05 1983-08-25 Karl 7631 Meißenheim Gallus METHOD FOR CUTTING PHOTOSET FILMS OR THE LIKE. AND DEVICE FOR IMPLEMENTING THE METHOD
US4670770A (en) * 1984-02-21 1987-06-02 American Telephone And Telegraph Company Integrated circuit chip-and-substrate assembly
US4818855A (en) * 1985-01-11 1989-04-04 Indala Corporation Identification system
US4783646A (en) 1986-03-07 1988-11-08 Kabushiki Kaisha Toshiba Stolen article detection tag sheet, and method for manufacturing the same
US4795898A (en) 1986-04-28 1989-01-03 American Telephone And Telegraph Company Personal memory card having a contactless interface using differential data transfer
FR2599893B1 (en) * 1986-05-23 1996-08-02 Ricoh Kk METHOD FOR MOUNTING AN ELECTRONIC MODULE ON A SUBSTRATE AND INTEGRATED CIRCUIT CARD
US4857893A (en) 1986-07-18 1989-08-15 Bi Inc. Single chip transponder device
US4918811A (en) * 1986-09-26 1990-04-24 General Electric Company Multichip integrated circuit packaging method
US4783695A (en) 1986-09-26 1988-11-08 General Electric Company Multichip integrated circuit packaging configuration and method
DE3777164D1 (en) 1986-09-26 1992-04-09 Gen Electric METHOD AND ARRANGEMENT FOR TESTING ELECTRONIC CIRCUITS AND INTEGRATED CIRCUIT CHIPS WITH A DETACHABLE COATING LAYER.
US4766670A (en) 1987-02-02 1988-08-30 International Business Machines Corporation Full panel electronic packaging structure and method of making same
JPH0834264B2 (en) * 1987-04-21 1996-03-29 住友電気工業株式会社 Semiconductor device and manufacturing method thereof
DE8709503U1 (en) 1987-07-10 1987-12-10 Mayer, Helmut, 7342 Bad Ditzenbach, De
JP2517341B2 (en) * 1988-01-14 1996-07-24 三洋電機株式会社 Method for manufacturing optical information recording disk
US4937653A (en) 1988-07-21 1990-06-26 American Telephone And Telegraph Company Semiconductor integrated circuit chip-to-chip interconnection scheme
US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
US5008213A (en) * 1988-12-09 1991-04-16 The United States Of America As Represented By The Secretary Of The Air Force Hybrid wafer scale microcircuit integration
US4990462A (en) * 1989-04-12 1991-02-05 Advanced Micro Devices, Inc. Method for coplanar integration of semiconductor ic devices
US5099227A (en) * 1989-07-18 1992-03-24 Indala Corporation Proximity detecting apparatus
US5032896A (en) * 1989-08-31 1991-07-16 Hughes Aircraft Company 3-D integrated circuit assembly employing discrete chips
US5083697A (en) * 1990-02-14 1992-01-28 Difrancesco Louis Particle-enhanced joining of metal surfaces
JPH0777258B2 (en) * 1990-03-16 1995-08-16 株式会社東芝 Semiconductor device
JP3280394B2 (en) 1990-04-05 2002-05-13 ロックヒード マーティン コーポレーション Electronic equipment
US5241456A (en) * 1990-07-02 1993-08-31 General Electric Company Compact high density interconnect structure
US5049978A (en) 1990-09-10 1991-09-17 General Electric Company Conductively enclosed hybrid integrated circuit assembly using a silicon substrate
US5205032A (en) * 1990-09-28 1993-04-27 Kabushiki Kaisha Toshiba Electronic parts mounting apparatus
US5298685A (en) * 1990-10-30 1994-03-29 International Business Machines Corporation Interconnection method and structure for organic circuit boards
US5138436A (en) * 1990-11-16 1992-08-11 Ball Corporation Interconnect package having means for waveguide transmission of rf signals
FR2672428B1 (en) 1991-02-04 1993-05-28 Schiltz Andre METHOD AND DEVICE FOR INSERTING CHIPS INTO HOUSINGS OF A SUBSTRATE BY SIZING HEAD.
USD343261S (en) * 1991-07-11 1994-01-11 Indala Corporation Transponder tag housing for attachment to the ear of an animal
US5231751A (en) * 1991-10-29 1993-08-03 International Business Machines Corporation Process for thin film interconnect
US5221831A (en) * 1991-11-29 1993-06-22 Indala Corporation Flap-type portal reader
JPH05169885A (en) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp Thin ic card
US5382952A (en) * 1992-01-22 1995-01-17 Indala Corporation Transponder for proximity identification system
USD353343S (en) 1992-03-17 1994-12-13 Indala Corporation Identification transponder tag for fabric-type articles
US5517752A (en) * 1992-05-13 1996-05-21 Fujitsu Limited Method of connecting a pressure-connector terminal of a device with a terminal electrode of a substrate
US5779839A (en) 1992-06-17 1998-07-14 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
DE4345610B4 (en) * 1992-06-17 2013-01-03 Micron Technology Inc. Method for producing a radio-frequency identification device (HFID)
US5612254A (en) * 1992-06-29 1997-03-18 Intel Corporation Methods of forming an interconnect on a semiconductor substrate
US5422513A (en) * 1992-10-16 1995-06-06 Martin Marietta Corporation Integrated circuit chip placement in a high density interconnect structure
US6274391B1 (en) 1992-10-26 2001-08-14 Texas Instruments Incorporated HDI land grid array packaged device having electrical and optical interconnects
US5353498A (en) * 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
US5382784A (en) * 1993-02-08 1995-01-17 Indala Corporation Hand-held dual technology identification tag reading head
US5420757A (en) * 1993-02-11 1995-05-30 Indala Corporation Method of producing a radio frequency transponder with a molded environmentally sealed package
JPH06337354A (en) 1993-05-27 1994-12-06 Nikon Corp Zoom lens
US5378880A (en) * 1993-08-20 1995-01-03 Indala Corporation Housing structure for an access control RFID reader
US5430441A (en) * 1993-10-12 1995-07-04 Motorola, Inc. Transponding tag and method
US5373627A (en) 1993-11-23 1994-12-20 Grebe; Kurt R. Method of forming multi-chip module with high density interconnections
US5824186A (en) * 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5904545A (en) 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
US6864570B2 (en) * 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
DE69435230D1 (en) 1993-12-30 2009-10-01 Miyake Kk Composite foil with circuit-shaped metal foil or the like and method for the production
US5444223A (en) 1994-01-11 1995-08-22 Blama; Michael J. Radio frequency identification tag and method
US5514613A (en) * 1994-01-27 1996-05-07 Integrated Device Technology Parallel manufacturing of semiconductor devices and the resulting structure
US6222212B1 (en) 1994-01-27 2001-04-24 Integrated Device Technology, Inc. Semiconductor device having programmable interconnect layers
USD378578S (en) * 1994-02-25 1997-03-25 Indala Corporation Identification transponder tag
US5434751A (en) * 1994-04-11 1995-07-18 Martin Marietta Corporation Reworkable high density interconnect structure incorporating a release layer
US5565846A (en) * 1994-04-25 1996-10-15 Indala Corporation Reader system for waste bin pickup vehicles
US5554821A (en) * 1994-07-15 1996-09-10 National Semiconductor Corporation Removable computer peripheral cards having a solid one-piece housing
CA2152860A1 (en) * 1994-07-15 1996-01-16 Argyrios A. Chatzipetros Antenna for communication device
DE4427309C2 (en) 1994-08-02 1999-12-02 Ibm Production of a carrier element module for installation in chip cards or other data carrier cards
US5682143A (en) * 1994-09-09 1997-10-28 International Business Machines Corporation Radio frequency identification tag
US5574470A (en) * 1994-09-30 1996-11-12 Palomar Technologies Corporation Radio frequency identification transponder apparatus and method
US5541613A (en) 1994-11-03 1996-07-30 Hughes Aircraft Company, Hughes Electronics Efficient broadband antenna system using photonic bandgap crystals
US5707902A (en) * 1995-02-13 1998-01-13 Industrial Technology Research Institute Composite bump structure and methods of fabrication
CN1148456A (en) * 1995-03-13 1997-04-23 摩托罗拉公司 Radio frequency identification system for reliable communication
CA2176625C (en) 1995-05-19 2008-07-15 Donald Harold Fergusen Radio frequency identification tag
US5745984A (en) * 1995-07-10 1998-05-05 Martin Marietta Corporation Method for making an electronic module
GB2305075A (en) 1995-09-05 1997-03-26 Ibm Radio Frequency Tag for Electronic Apparatus
DE19534480C2 (en) 1995-09-18 1999-11-11 David Finn IC card module for the production of an IC card and IC card with an IC card module
US6040773A (en) * 1995-10-11 2000-03-21 Motorola, Inc. Radio frequency identification tag arranged for magnetically storing tag state information
US6252508B1 (en) * 1995-10-11 2001-06-26 Motorola, Inc. Radio frequency identification tag arranged for magnetically storing tag state information
US6211572B1 (en) * 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
US5785181A (en) * 1995-11-02 1998-07-28 Clothestrak, Inc. Permanent RFID garment tracking system
US5754110A (en) 1996-03-07 1998-05-19 Checkpoint Systems, Inc. Security tag and manufacturing method
DE19616819A1 (en) 1996-04-26 1997-10-30 Giesecke & Devrient Gmbh CD with built-in chip
US5627931A (en) * 1996-05-28 1997-05-06 Motorola Optoelectronic transducer
US5708419A (en) * 1996-07-22 1998-01-13 Checkpoint Systems, Inc. Method of wire bonding an integrated circuit to an ultraflexible substrate
FR2751767B1 (en) * 1996-07-26 1998-12-18 Thomson Csf SECURE DATA STORAGE SYSTEM ON CD-ROM
US6466131B1 (en) * 1996-07-30 2002-10-15 Micron Technology, Inc. Radio frequency data communications device with adjustable receiver sensitivity and method
WO1998015981A1 (en) 1996-10-10 1998-04-16 Samsung Electronics Co., Ltd. Microwave-frequency hybrid integrated circuit
JPH10166770A (en) 1996-12-17 1998-06-23 Rohm Co Ltd Non-contact type ic card and its manufacture
DE19703057A1 (en) * 1996-12-20 1998-07-02 Siemens Ag Carrier element for semiconductor chip esp. for combination chip card
US5798050A (en) * 1997-01-10 1998-08-25 International Business Machines Corporation Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate
EP0954836B1 (en) * 1997-01-25 2004-03-31 Philip Noel Leonard Identification or control arrangements
US6082600A (en) 1997-03-08 2000-07-04 Angus; June Clipable article container
BR9808620A (en) 1997-03-10 2000-05-16 Precision Dynamics Corp Elements reactively coupled in circuits on flexible substrates
US5862117A (en) 1997-03-12 1999-01-19 Em Microelectronic-Marin Sa Device, in particular a compact disc, comprising a data storage medium and an integrated circuit
US6229203B1 (en) 1997-03-12 2001-05-08 General Electric Company Semiconductor interconnect structure for high temperature applications
US6094173A (en) * 1997-04-18 2000-07-25 Motorola, Inc. Method and apparatus for detecting an RFID tag signal
US6329213B1 (en) * 1997-05-01 2001-12-11 Micron Technology, Inc. Methods for forming integrated circuits within substrates
DE19722327A1 (en) 1997-05-28 1998-12-03 Arsoma Druckmaschinen Gmbh Method for producing a multilayer label and device for carrying out the method
US6459084B1 (en) 1997-05-30 2002-10-01 University Of Central Florida Area receiver with antenna-coupled infrared sensors
US6064116A (en) 1997-06-06 2000-05-16 Micron Technology, Inc. Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
US6816830B1 (en) 1997-07-04 2004-11-09 Xerox Corporation Finite state data structures with paths representing paired strings of tags and tag combinations
JP3438565B2 (en) * 1997-08-22 2003-08-18 ユニ電子工業株式会社 Anti-theft tag
FR2769389B1 (en) 1997-10-07 2000-01-28 Rue Cartes Et Systemes De MICROCIRCUIT CARD COMBINING EXTERIOR CONTACT RANGES AND AN ANTENNA, AND METHOD FOR MANUFACTURING SUCH A CARD
DE19745648A1 (en) 1997-10-15 1998-11-26 Siemens Ag Carrier element for contactless semiconductor chip-card
US6164551A (en) 1997-10-29 2000-12-26 Meto International Gmbh Radio frequency identification transponder having non-encapsulated IC chip
US6002344A (en) * 1997-11-21 1999-12-14 Bandy; William R. System and method for electronic inventory
JP2001510670A (en) * 1997-12-05 2001-07-31 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Identification transponder
US6268796B1 (en) 1997-12-12 2001-07-31 Alfred Gnadinger Radio frequency identification transponder having integrated antenna
US6281794B1 (en) * 1998-01-02 2001-08-28 Intermec Ip Corp. Radio frequency transponder with improved read distance
US6019284A (en) 1998-01-27 2000-02-01 Viztec Inc. Flexible chip card with display
DE19805282A1 (en) 1998-02-10 1999-08-19 Siemens Ag Flat carrier with a display device
US6395373B2 (en) 1998-02-11 2002-05-28 Avery Dennison Corporation Label/tag with embedded signaling device and method and apparatus for making and using
US6094138A (en) * 1998-02-27 2000-07-25 Motorola, Inc. Integrated circuit assembly and method of assembly
US6206282B1 (en) 1998-03-03 2001-03-27 Pyper Products Corporation RF embedded identification device
FR2775810B1 (en) 1998-03-09 2000-04-28 Gemplus Card Int NON-CONTACT CARD MANUFACTURING PROCESS
JP3625646B2 (en) 1998-03-23 2005-03-02 東レエンジニアリング株式会社 Flip chip mounting method
US6288559B1 (en) * 1998-03-30 2001-09-11 International Business Machines Corporation Semiconductor testing using electrically conductive adhesives
US6040630A (en) 1998-04-13 2000-03-21 Harris Corporation Integrated circuit package for flip chip with alignment preform feature and method of forming same
US6107921A (en) * 1998-04-16 2000-08-22 Motorola, Inc. Conveyor bed with openings for capacitive coupled readers
US6275681B1 (en) * 1998-04-16 2001-08-14 Motorola, Inc. Wireless electrostatic charging and communicating system
US6282407B1 (en) * 1998-04-16 2001-08-28 Motorola, Inc. Active electrostatic transceiver and communicating system
EP0951068A1 (en) 1998-04-17 1999-10-20 Interuniversitair Micro-Elektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
JP4043601B2 (en) 1998-06-04 2008-02-06 大日本印刷株式会社 Non-contact type IC card and manufacturing method thereof, non-contact type IC card substrate
US6246327B1 (en) * 1998-06-09 2001-06-12 Motorola, Inc. Radio frequency identification tag circuit chip having printed interconnection pads
US6107920A (en) 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
US6018299A (en) 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
US6091332A (en) 1998-06-09 2000-07-18 Motorola, Inc. Radio frequency identification tag having printed circuit interconnections
WO2000003354A1 (en) 1998-07-08 2000-01-20 Dai Nippon Printing Co., Ltd. Noncontact ic card and manufacture thereof
ATE464614T1 (en) 1998-08-14 2010-04-15 3M Innovative Properties Co METHOD OF USING A PORTABLE RFID READER
DE19840226B4 (en) 1998-09-03 2006-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method of applying a circuit chip to a carrier
DE19840210A1 (en) * 1998-09-03 2000-03-09 Fraunhofer Ges Forschung Method for handling a plurality of circuit chips
GB2350599B (en) 1998-09-04 2001-11-14 Denny Bros Printing Adhesive labels and manufacture thereof
US6147605A (en) 1998-09-11 2000-11-14 Motorola, Inc. Method and apparatus for an optimized circuit for an electrostatic radio frequency identification tag
US6189208B1 (en) 1998-09-11 2001-02-20 Polymer Flip Chip Corp. Flip chip mounting technique
ATE398814T1 (en) * 1998-09-11 2008-07-15 Motorola Inc RFID LABEL APPARATUS AND METHOD
IL136171A0 (en) 1998-09-17 2001-05-20 Trakus Inc Moldable transceiver for use with apparel
DE19846237A1 (en) 1998-10-07 2000-04-13 Fraunhofer Ges Forschung Process for the production of a microtransponder
WO2000023994A1 (en) 1998-10-16 2000-04-27 Intermec Ip Corp. Smart optical storage media
JP2000132871A (en) * 1998-10-22 2000-05-12 Hitachi Ltd Disk and recording and reproducing device using it
US6100804A (en) 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
US6902111B2 (en) * 1998-11-12 2005-06-07 Wenyu Han Method and apparatus for impeding the counterfeiting of discs
US6262692B1 (en) 1999-01-13 2001-07-17 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
US6114088A (en) 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
EP1035503B2 (en) 1999-01-23 2010-03-03 X-ident technology GmbH RFID-Transponder with printable surface
US6031450A (en) 1999-02-03 2000-02-29 Huang; Tien-Tsai Tire pressure alarm system with centrifugal force-controlled power switch
US6850312B2 (en) * 1999-03-16 2005-02-01 Alien Technology Corporation Apparatuses and methods for flexible displays
US6274508B1 (en) * 1999-02-05 2001-08-14 Alien Technology Corporation Apparatuses and methods used in forming assemblies
US6281038B1 (en) * 1999-02-05 2001-08-28 Alien Technology Corporation Methods for forming assemblies
WO2000046854A1 (en) 1999-02-05 2000-08-10 Alien Technology Corporation Apparatuses and methods for forming assemblies
US6122492A (en) * 1999-02-08 2000-09-19 Motorola, Inc. Adjustable radio frequency power amplifier and transmitter
EP1035418B1 (en) 1999-02-09 2005-07-27 Magnus Granhed Encapsulated antenna in passive transponders
JP2000231614A (en) 1999-02-12 2000-08-22 Omron Corp Data carrier which can be read by electromagnetic wave
US6291896B1 (en) 1999-02-16 2001-09-18 Alien Technology Corporation Functionally symmetric integrated circuit die
US6133833A (en) * 1999-02-25 2000-10-17 Motorola, Inc. Wireless add-on keyboard system and method
CN1374993A (en) 1999-03-02 2002-10-16 摩托罗拉公司 Electronic tag assembly and method therefor
FR2790849B1 (en) * 1999-03-12 2001-04-27 Gemplus Card Int MANUFACTURING METHOD FOR CONTACTLESS CARD TYPE ELECTRONIC DEVICE
US6468638B2 (en) * 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US6410415B1 (en) * 1999-03-23 2002-06-25 Polymer Flip Chip Corporation Flip chip mounting technique
ES2453486T3 (en) 1999-03-24 2014-04-07 Motorola Solutions, Inc. Circuit chip connector and connection method of a circuit chip
JP2000278009A (en) 1999-03-24 2000-10-06 Nec Corp Microwave/millimeter wave circuit device
EP1043684A1 (en) * 1999-03-29 2000-10-11 OMD Productions AG Data carrier
US6280544B1 (en) * 1999-04-21 2001-08-28 Intermec Ip Corp. RF tag application system
JP3928682B2 (en) * 1999-06-22 2007-06-13 オムロン株式会社 Wiring board bonded body, wiring board bonding method, data carrier manufacturing method, and electronic component module mounting apparatus
DE19929610C1 (en) 1999-06-28 2000-10-12 Giesecke & Devrient Gmbh Chip module for chip card has electrical component and contact bridge on one side of module carrier each coupled to contact surfaces on opposite side of module carrier via respective openings in latter
GB9915331D0 (en) 1999-06-30 1999-09-01 World Golf Systems Limited Golf balls
US6134130A (en) 1999-07-19 2000-10-17 Motorola, Inc. Power reception circuits for a device receiving an AC power signal
US6140146A (en) 1999-08-03 2000-10-31 Intermec Ip Corp. Automated RFID transponder manufacturing on flexible tape substrates
US6147662A (en) 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
US6271060B1 (en) * 1999-09-13 2001-08-07 Vishay Intertechnology, Inc. Process of fabricating a chip scale surface mount package for semiconductor device
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
WO2001026392A1 (en) * 1999-10-06 2001-04-12 Trimble Bradley G Object locating system employing rf signaling
WO2001026910A1 (en) 1999-10-08 2001-04-19 Dai Nippon Printing Co., Ltd. Non-contact data carrier and ic chip
US6479395B1 (en) 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6420266B1 (en) * 1999-11-02 2002-07-16 Alien Technology Corporation Methods for creating elements of predetermined shape and apparatuses using these elements
US6271793B1 (en) 1999-11-05 2001-08-07 International Business Machines Corporation Radio frequency (RF) transponder (Tag) with composite antenna
EP1232477A1 (en) 1999-11-18 2002-08-21 Siemens Aktiengesellschaft Mobile data carrier with a transponder made from a surface wave component with a slot antenna
US6259408B1 (en) * 1999-11-19 2001-07-10 Intermec Ip Corp. RFID transponders with paste antennas and flip-chip attachment
FR2801708B1 (en) * 1999-11-29 2003-12-26 A S K METHOD OF MANUFACTURING A CONTACTLESS CHIP CARD WITH AN ANTENNA SUPPORT OF FIBROUS MATERIAL
DE19957647A1 (en) 1999-11-30 2001-06-28 Siemens Ag Annular data mobile memory with coupling coil, in particular for an identification system, preferably for identifying gas cylinders
JP3390389B2 (en) 1999-12-08 2003-03-24 チェックポイント・マニュファクチュアリング・ジャパン株式会社 Resonance tag
JP2001175837A (en) 1999-12-22 2001-06-29 Toppan Printing Co Ltd Ic card
FI112288B (en) 2000-01-17 2003-11-14 Rafsec Oy Procedure for producing an input path for smart labels
US6275156B1 (en) 2000-02-07 2001-08-14 Westvaco Corporation EAS ready paperboard
US6451154B1 (en) 2000-02-18 2002-09-17 Moore North America, Inc. RFID manufacturing concepts
JP3729491B2 (en) 2000-02-22 2005-12-21 東レエンジニアリング株式会社 Non-contact ID cards and manufacturing method thereof
FR2806029A1 (en) 2000-03-09 2001-09-14 Christian Antoine Fournier Electronic cards, labels, etc. are produced continuously by extruding strip and then cutting to desired format or dimensions
DE60141391D1 (en) 2000-03-10 2010-04-08 Chippac Inc Flip-chip connection structure and its manufacturing method
US6229442B1 (en) * 2000-03-14 2001-05-08 Motorola, Inc, Radio frequency identification device having displacement current control and method thereof
CN1421019A (en) * 2000-04-04 2003-05-28 东丽工程株式会社 Method of mfg. COF package
DE10017431C2 (en) * 2000-04-07 2002-05-23 Melzer Maschinenbau Gmbh Method and device for producing data carriers with an integrated transponder
US6366468B1 (en) * 2000-04-28 2002-04-02 Hewlett-Packard Company Self-aligned common carrier
US7113095B2 (en) * 2000-05-22 2006-09-26 Avery Dennison Corp. Trackable files and systems for using the same
FI20001344A (en) 2000-06-06 2001-12-07 Rafsec Oy Method and apparatus for making a smart label feed web
FI111881B (en) 2000-06-06 2003-09-30 Rafsec Oy A smart card web and a method for making it
US6908295B2 (en) * 2000-06-16 2005-06-21 Avery Dennison Corporation Process and apparatus for embossing precise microstructures and embossing tool for making same
US6309912B1 (en) 2000-06-20 2001-10-30 Motorola, Inc. Method of interconnecting an embedded integrated circuit
JP4239439B2 (en) 2000-07-06 2009-03-18 セイコーエプソン株式会社 OPTICAL DEVICE, ITS MANUFACTURING METHOD, AND OPTICAL TRANSMISSION DEVICE
JP3815269B2 (en) * 2000-07-07 2006-08-30 セイコーエプソン株式会社 Organic EL display and manufacturing method thereof, perforated substrate, electro-optical device and manufacturing method thereof, and electronic apparatus
JP3840926B2 (en) 2000-07-07 2006-11-01 セイコーエプソン株式会社 Organic EL display, method for manufacturing the same, and electronic device
JP3915868B2 (en) * 2000-07-07 2007-05-16 セイコーエプソン株式会社 Ferroelectric memory device and manufacturing method thereof
US6483473B1 (en) * 2000-07-18 2002-11-19 Marconi Communications Inc. Wireless communication device and method
US6780696B1 (en) 2000-09-12 2004-08-24 Alien Technology Corporation Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs
CN1498417A (en) * 2000-09-19 2004-05-19 纳诺皮尔斯技术公司 Method for assembling components and antenna in radio frequency identification devices
US6392213B1 (en) * 2000-10-12 2002-05-21 The Charles Stark Draper Laboratory, Inc. Flyer assembly
US6448109B1 (en) 2000-11-15 2002-09-10 Analog Devices, Inc. Wafer level method of capping multiple MEMS elements
US20020149107A1 (en) 2001-02-02 2002-10-17 Avery Dennison Corporation Method of making a flexible substrate containing self-assembling microstructures
US6794221B2 (en) 2000-11-29 2004-09-21 Hrl Laboratories, Llc Method of placing elements into receptors in a substrate
US6611237B2 (en) * 2000-11-30 2003-08-26 The Regents Of The University Of California Fluidic self-assembly of active antenna
FI112121B (en) 2000-12-11 2003-10-31 Rafsec Oy Smart sticker web, process for making it, process for making a carrier web, and component of a smart sticker on a smart sticker web
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
EP2287778B1 (en) * 2001-02-12 2015-04-22 Symbol Technologies, Inc. Data symbol calibration in RFID tags
US7101091B2 (en) * 2001-02-21 2006-09-05 Zarlink Semiconductor, Inc. Apparatus for coupling a fiber optic cable to an optoelectronic device, a system including the apparatus, and a method of forming the same
US7000834B2 (en) * 2001-02-21 2006-02-21 International Business Machines Corporation Method to address security and privacy issue of the use of RFID systems to track consumer products
US6417025B1 (en) 2001-04-02 2002-07-09 Alien Technology Corporation Integrated circuit packages assembled utilizing fluidic self-assembly
DE10120269C1 (en) * 2001-04-25 2002-07-25 Muehlbauer Ag Microchip transponder manufacturing method has chip module carrier band combined with antenna carrier band with chip module terminals coupled to antenna
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US6727970B2 (en) * 2001-06-25 2004-04-27 Avery Dennison Corporation Method of making a hybrid display device having a rigid substrate and a flexible substrate
US6856086B2 (en) * 2001-06-25 2005-02-15 Avery Dennison Corporation Hybrid display device
US6590346B1 (en) 2001-07-16 2003-07-08 Alien Technology Corporation Double-metal background driven displays
US7112138B2 (en) * 2001-08-03 2006-09-26 Igt Player tracking communication mechanisms in a gaming machine
US20030036249A1 (en) * 2001-08-06 2003-02-20 Bauer Donald G. Chip alignment and placement apparatus for integrated circuit, MEMS, photonic or other devices
US6530649B1 (en) * 2001-08-16 2003-03-11 Hewlett-Packard Company Hermetic seal in microelectronic devices
US6863219B1 (en) * 2001-08-17 2005-03-08 Alien Technology Corporation Apparatuses and methods for forming electronic assemblies
US6528351B1 (en) * 2001-09-24 2003-03-04 Jigsaw Tek, Inc. Integrated package and methods for making same
DE10150458A1 (en) 2001-10-16 2003-04-17 Ident Gmbh X Opto-electronic data carrier with applied transponder
US6844673B1 (en) * 2001-12-06 2005-01-18 Alien Technology Corporation Split-fabrication for light emitting display structures
JP2006504251A (en) 2002-01-23 2006-02-02 エイリアン・テクノロジイ・コーポレーション Apparatus incorporating small size component and large size component and method of making the same
KR20030076274A (en) * 2002-03-18 2003-09-26 도레 엔지니아린구 가부시키가이샤 Non-contact id card and the method for producing thereof
ES2198216B1 (en) 2002-07-02 2005-04-16 Juan Carlos Instituto Cientifico Y Tecnologico De Navarra, S.A.(67%). MEANS OF CULTURE OF MOTHER-PROGENITORS CELLS HUMAN AND ITS APPLICATIONS.
US20040005494A1 (en) * 2002-07-05 2004-01-08 Drake Javit A. Chemical sensing in fuel cell systems
AU2003238638A1 (en) 2002-07-08 2004-01-23 Koninklijke Philips Electronics N.V. Information carrier drive device provided with a double antenna
US6867983B2 (en) * 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
US7275040B2 (en) 2002-09-12 2007-09-25 Mineral Lassen Llc RFID security device for optical disc
US20040052202A1 (en) * 2002-09-13 2004-03-18 Brollier Brian W. RFID enabled information disks
US20040052203A1 (en) * 2002-09-13 2004-03-18 Brollier Brian W. Light enabled RFID in information disks
US20040143505A1 (en) * 2002-10-16 2004-07-22 Aram Kovach Method for tracking and disposition of articles
US6900731B2 (en) * 2002-10-30 2005-05-31 Bellsouth Intellectual Property Corporation Method for monitoring and tracking objects
JP2004206412A (en) 2002-12-25 2004-07-22 Casio Comput Co Ltd Card type device and authentication system
US6940408B2 (en) * 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
US20040142766A1 (en) * 2003-01-17 2004-07-22 Chris Savarese Apparatuses, methods and systems relating to findable golf balls
US7253735B2 (en) * 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
GB0309498D0 (en) 2003-04-25 2003-06-04 Avery Dennison Corp Extended range RFID system
US7120987B2 (en) 2003-08-05 2006-10-17 Avery Dennison Corporation Method of making RFID device
US7017807B2 (en) * 2003-09-08 2006-03-28 Francis M. Claessens Apparatus and method for detecting tampering with containers and preventing counterfeiting thereof
US7691009B2 (en) * 2003-09-26 2010-04-06 Radar Golf, Inc. Apparatuses and methods relating to findable balls
KR101119989B1 (en) * 2003-11-04 2012-03-15 애버리 데니슨 코포레이션 Rfid tag with enhanced readability
US7158037B2 (en) * 2004-03-22 2007-01-02 Avery Dennison Corporation Low cost method of producing radio frequency identification tags with straps without antenna patterning
ATE414976T1 (en) 2004-05-17 2008-12-15 Sony Dadc Austria Ag OPTICAL DATA CARRIER, METHOD AND DEVICE FOR PRODUCING AN OPTICAL DATA CARRIER
JP4328682B2 (en) * 2004-07-13 2009-09-09 富士通株式会社 Radio tag antenna structure for optical recording medium and optical recording medium housing case with radio tag antenna
SG119329A1 (en) * 2004-07-29 2006-02-28 Fujikura Ltd Semiconductor device and method for manufacturing the same
US7353598B2 (en) * 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5566441A (en) * 1993-03-11 1996-10-22 British Technology Group Limited Attaching an electronic circuit to a substrate
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1606778A4 *

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9105555B2 (en) 2004-06-04 2015-08-11 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
US9515025B2 (en) 2004-06-04 2016-12-06 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US9450043B2 (en) 2004-06-04 2016-09-20 The Board Of Trustees Of The University Of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
US9324733B2 (en) 2004-06-04 2016-04-26 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US9601671B2 (en) 2007-01-17 2017-03-21 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US9117940B2 (en) 2007-01-17 2015-08-25 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly
US8905772B2 (en) 2008-03-05 2014-12-09 The Board Of Trustees Of The University Of Illinois Stretchable and foldable electronic devices
US8946683B2 (en) 2008-06-16 2015-02-03 The Board Of Trustees Of The University Of Illinois Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates
US9012784B2 (en) 2008-10-07 2015-04-21 Mc10, Inc. Extremely stretchable electronics
US9289132B2 (en) 2008-10-07 2016-03-22 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8865489B2 (en) 2009-05-12 2014-10-21 The Board Of Trustees Of The University Of Illinois Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
US9159635B2 (en) 2011-05-27 2015-10-13 Mc10, Inc. Flexible electronic structure
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
US9554484B2 (en) 2012-03-30 2017-01-24 The Board Of Trustees Of The University Of Illinois Appendage mountable electronic devices conformable to surfaces
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer

Also Published As

Publication number Publication date
EP1606778A4 (en) 2011-07-27
US7253735B2 (en) 2007-08-07
US9418328B2 (en) 2016-08-16
EP1606778A2 (en) 2005-12-21
US20090167534A1 (en) 2009-07-02
US7489248B2 (en) 2009-02-10
US8912907B2 (en) 2014-12-16
US20130265134A1 (en) 2013-10-10
US20040188531A1 (en) 2004-09-30
US20110186640A1 (en) 2011-08-04
US8350703B2 (en) 2013-01-08
US7868766B2 (en) 2011-01-11
CN1764932A (en) 2006-04-26
US20150242739A1 (en) 2015-08-27
CN1764932B (en) 2012-05-23
WO2004086289A2 (en) 2004-10-07
US20060267778A1 (en) 2006-11-30

Similar Documents

Publication Publication Date Title
WO2004086289A3 (en) Rfid tags and processes for producing rfid tags
WO2005112591A3 (en) Radiofrequency antennae and identification tags and methods of manufacturing radiofrequency antennae and radiofrequency identification tags
WO2006057820A3 (en) Radio frequency identification (rfid) tag for an item having a conductive layer included or attached
EP1626364A3 (en) Radio frequency identification (RFID) tag and manufacturing method thereof
WO2004015441A3 (en) Radio frequency identificaton device and method
WO2005022443A3 (en) A radio frequency identification tag with tamper detection capability
US6384727B1 (en) Capacitively powered radio frequency identification device
US7701352B2 (en) RFID label with release liner window, and method of making
WO2000026856A3 (en) Radio frequency identification system
TWI368174B (en) A durable radio frequency identification label and methods of manufacturing the same
EP1898488A4 (en) Radio frequency identification tag
TW200710736A (en) Radio frequency identification tags for use on metal or other conductive objects
TW200713075A (en) RFID tag and manufacturing method thereof
TW200737013A (en) RFID tag and manufacturing method thereof
EP1720216A4 (en) Radio tag
SG90116A1 (en) Circuit chip connector and method of connecting a circuit chip
ATE229204T1 (en) METHOD FOR PRODUCING CONTACTLESS CARDS
CA2396750A1 (en) Rfid foil or film antennas
MXPA04001359A (en) Rfid tag having integral electrical bridge and method of assembling the same.
WO2002056245A3 (en) Radio frequency identification tag on a single layer substrate
WO2010013810A1 (en) Rfid tag and manufacturing method therefor, impedance-adjusting method and resin sheet and manufacturing method therefor
TW200732977A (en) RFID tag
CA2334156A1 (en) Radio frequency identification tag having an article integrated antenna
WO2003009007A3 (en) Rfid tag with bridge circuit assembly and methods of use
WO2010104991A3 (en) Universal rfid tags and manufacturing methods

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 20048078250

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2004758132

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2004758132

Country of ref document: EP