WO2004092833A2 - Environmental system including a transport region for an immersion lithography apparatus - Google Patents
Environmental system including a transport region for an immersion lithography apparatus Download PDFInfo
- Publication number
- WO2004092833A2 WO2004092833A2 PCT/US2004/009994 US2004009994W WO2004092833A2 WO 2004092833 A2 WO2004092833 A2 WO 2004092833A2 US 2004009994 W US2004009994 W US 2004009994W WO 2004092833 A2 WO2004092833 A2 WO 2004092833A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- gap
- transport region
- fluid
- work piece
- immersion fluid
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/42—Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original
- G03B27/426—Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original in enlargers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
- G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/703—Gap setting, e.g. in proximity printer
Abstract
Description
Claims
Priority Applications (24)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020117016439A KR101177330B1 (en) | 2003-04-10 | 2004-04-01 | An immersion lithography apparatus |
KR1020147032349A KR20140139139A (en) | 2003-04-10 | 2004-04-01 | Environmental system including a transport region for an immersion lithography apparatus |
EP17206979.1A EP3352015A1 (en) | 2003-04-10 | 2004-04-01 | Environmental system including a transport region for an immersion lithography apparatus |
KR1020177014954A KR20170064003A (en) | 2003-04-10 | 2004-04-01 | Environmental system including a transport region for an immersion lithography apparatus |
KR1020147007727A KR101497289B1 (en) | 2003-04-10 | 2004-04-01 | Environmental system including a transport region for an immersion lithography apparatus |
EP04759085.6A EP1611486B1 (en) | 2003-04-10 | 2004-04-01 | Environmental system including a transport region for an immersion lithography apparatus |
KR1020057019303A KR101238142B1 (en) | 2003-04-10 | 2004-04-01 | Environmental system including a transport region for an immersion lithography apparatus |
KR1020127015202A KR101323993B1 (en) | 2003-04-10 | 2004-04-01 | Environmental system including a transport region for an immersion lithography apparatus |
KR1020157016371A KR101745223B1 (en) | 2003-04-10 | 2004-04-01 | Environmental system including a transport region for an immersion lithography apparatus |
JP2006509568A JP4650413B2 (en) | 2003-04-10 | 2004-04-01 | Environmental system including a transfer area for an immersion lithography apparatus |
KR1020127021786A KR101431938B1 (en) | 2003-04-10 | 2004-04-01 | Environmental system including a transport region for an immersion lithography apparatus |
KR1020137011294A KR101409565B1 (en) | 2003-04-10 | 2004-04-01 | Environmental system including a transport region for an immersion lithography apparatus |
US11/236,713 US7251017B2 (en) | 2003-04-10 | 2005-09-28 | Environmental system including a transport region for an immersion lithography apparatus |
HK06111866.2A HK1091272A1 (en) | 2003-04-10 | 2006-10-27 | Environmental system including a transport region for an immersion lithography apparatus |
US11/705,001 US7345742B2 (en) | 2003-04-10 | 2007-02-12 | Environmental system including a transport region for an immersion lithography apparatus |
US11/819,447 US7929111B2 (en) | 2003-04-10 | 2007-06-27 | Environmental system including a transport region for an immersion lithography apparatus |
US11/819,446 US7929110B2 (en) | 2003-04-10 | 2007-06-27 | Environmental system including a transport region for an immersion lithography apparatus |
US11/819,689 US7969552B2 (en) | 2003-04-10 | 2007-06-28 | Environmental system including a transport region for an immersion lithography apparatus |
US11/819,691 US7965376B2 (en) | 2003-04-10 | 2007-06-28 | Environmental system including a transport region for an immersion lithography apparatus |
US13/067,464 US8830443B2 (en) | 2003-04-10 | 2011-06-02 | Environmental system including a transport region for an immersion lithography apparatus |
US14/463,066 US9244363B2 (en) | 2003-04-10 | 2014-08-19 | Environmental system including a transport region for an immersion lithography apparatus |
US14/955,968 US9632427B2 (en) | 2003-04-10 | 2015-12-01 | Environmental system including a transport region for an immersion lithography apparatus |
US15/486,419 US9910370B2 (en) | 2003-04-10 | 2017-04-13 | Environmental system including a transport region for an immersion lithography apparatus |
US15/879,755 US20180164703A1 (en) | 2003-04-10 | 2018-01-25 | Environmental system including a transport region for an immersion lithography apparatus |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US46211203P | 2003-04-10 | 2003-04-10 | |
US60/462,112 | 2003-04-10 | ||
US48503303P | 2003-07-02 | 2003-07-02 | |
US60/485,033 | 2003-07-02 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/236,713 Continuation US7251017B2 (en) | 2003-04-10 | 2005-09-28 | Environmental system including a transport region for an immersion lithography apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004092833A2 true WO2004092833A2 (en) | 2004-10-28 |
WO2004092833A3 WO2004092833A3 (en) | 2005-12-01 |
Family
ID=33303064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/009994 WO2004092833A2 (en) | 2003-04-10 | 2004-04-01 | Environmental system including a transport region for an immersion lithography apparatus |
Country Status (7)
Country | Link |
---|---|
US (11) | US7251017B2 (en) |
EP (3) | EP3062152B1 (en) |
JP (10) | JP4650413B2 (en) |
KR (9) | KR101431938B1 (en) |
CN (1) | CN101813892B (en) |
HK (2) | HK1091272A1 (en) |
WO (1) | WO2004092833A2 (en) |
Cited By (132)
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EP1628163A2 (en) | 2004-08-19 | 2006-02-22 | ASML Netherlands BV | Lithographic apparatus and device manufacturing method |
EP1660925A2 (en) * | 2003-09-03 | 2006-05-31 | Nikon Corporation | Apparatus and method for providing fluid for immersion lithography |
US7119874B2 (en) | 2003-06-27 | 2006-10-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7196770B2 (en) | 2004-12-07 | 2007-03-27 | Asml Netherlands B.V. | Prewetting of substrate before immersion exposure |
WO2007055373A1 (en) * | 2005-11-14 | 2007-05-18 | Nikon Corporation | Liquid recovery member, exposure apparatus, exposure method, and device production method |
US7224431B2 (en) | 2005-02-22 | 2007-05-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7291850B2 (en) | 2005-04-08 | 2007-11-06 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2008010893A (en) * | 2007-09-25 | 2008-01-17 | Canon Inc | Exposure device |
US7324185B2 (en) | 2005-03-04 | 2008-01-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7330238B2 (en) | 2005-03-28 | 2008-02-12 | Asml Netherlands, B.V. | Lithographic apparatus, immersion projection apparatus and device manufacturing method |
US7378025B2 (en) | 2005-02-22 | 2008-05-27 | Asml Netherlands B.V. | Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method |
JP2008135769A (en) * | 2003-08-29 | 2008-06-12 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
US7403261B2 (en) | 2004-12-15 | 2008-07-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7405805B2 (en) | 2004-12-28 | 2008-07-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7411657B2 (en) | 2004-11-17 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7420194B2 (en) | 2005-12-27 | 2008-09-02 | Asml Netherlands B.V. | Lithographic apparatus and substrate edge seal |
US7428038B2 (en) | 2005-02-28 | 2008-09-23 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid |
US7436486B2 (en) | 2002-12-10 | 2008-10-14 | Nikon Corporation | Exposure apparatus and device manufacturing method |
US7446850B2 (en) | 2004-12-03 | 2008-11-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7466392B2 (en) | 2002-12-10 | 2008-12-16 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
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US7491661B2 (en) | 2004-12-28 | 2009-02-17 | Asml Netherlands B.V. | Device manufacturing method, top coat material and substrate |
US7528931B2 (en) | 2004-12-20 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7576833B2 (en) | 2007-06-28 | 2009-08-18 | Nikon Corporation | Gas curtain type immersion lithography tool using porous material for fluid removal |
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