WO2004100218A3 - Prefabricated and attached interconnect structure - Google Patents

Prefabricated and attached interconnect structure Download PDF

Info

Publication number
WO2004100218A3
WO2004100218A3 PCT/US2004/012452 US2004012452W WO2004100218A3 WO 2004100218 A3 WO2004100218 A3 WO 2004100218A3 US 2004012452 W US2004012452 W US 2004012452W WO 2004100218 A3 WO2004100218 A3 WO 2004100218A3
Authority
WO
WIPO (PCT)
Prior art keywords
interconnect structure
terminal
interconnect
attachment
attachment interface
Prior art date
Application number
PCT/US2004/012452
Other languages
French (fr)
Other versions
WO2004100218A2 (en
WO2004100218B1 (en
Inventor
January Kister
David Beatson
Edward Laurent
Original Assignee
K & S Interconnect Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K & S Interconnect Inc filed Critical K & S Interconnect Inc
Publication of WO2004100218A2 publication Critical patent/WO2004100218A2/en
Publication of WO2004100218A3 publication Critical patent/WO2004100218A3/en
Publication of WO2004100218B1 publication Critical patent/WO2004100218B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Abstract

A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and seperate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachement each interconnect structure is combined with and/or held in a carrier structure fromm which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal. The interconnect assembly is preferably part of a probe apparatus.
PCT/US2004/012452 2003-05-01 2004-04-23 Prefabricated and attached interconnect structure WO2004100218A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/429,275 US6965245B2 (en) 2003-05-01 2003-05-01 Prefabricated and attached interconnect structure
US10/429,275 2003-05-01

Publications (3)

Publication Number Publication Date
WO2004100218A2 WO2004100218A2 (en) 2004-11-18
WO2004100218A3 true WO2004100218A3 (en) 2005-06-02
WO2004100218B1 WO2004100218B1 (en) 2005-07-21

Family

ID=33310573

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/012452 WO2004100218A2 (en) 2003-05-01 2004-04-23 Prefabricated and attached interconnect structure

Country Status (4)

Country Link
US (2) US6965245B2 (en)
CN (1) CN1816948A (en)
TW (1) TW200508624A (en)
WO (1) WO2004100218A2 (en)

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US7928751B2 (en) * 2009-02-18 2011-04-19 Winmems Technologies Holdings Co., Ltd. MEMS interconnection pins fabrication on a reusable substrate for probe card application
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CN101552396B (en) * 2009-05-05 2011-05-18 番禺得意精密电子工业有限公司 Terminal flitch and terminal assembling method
JP5500870B2 (en) * 2009-05-28 2014-05-21 新光電気工業株式会社 Substrate with connection terminal and socket for electronic parts
JP5606695B2 (en) * 2009-07-03 2014-10-15 新光電気工業株式会社 Board with connection terminal
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Also Published As

Publication number Publication date
US6965245B2 (en) 2005-11-15
TW200508624A (en) 2005-03-01
US20040217768A1 (en) 2004-11-04
US20050052194A1 (en) 2005-03-10
CN1816948A (en) 2006-08-09
WO2004100218A2 (en) 2004-11-18
WO2004100218B1 (en) 2005-07-21
US7173441B2 (en) 2007-02-06

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