WO2004100218B1 - Prefabricated and attached interconnect structure - Google Patents

Prefabricated and attached interconnect structure

Info

Publication number
WO2004100218B1
WO2004100218B1 PCT/US2004/012452 US2004012452W WO2004100218B1 WO 2004100218 B1 WO2004100218 B1 WO 2004100218B1 US 2004012452 W US2004012452 W US 2004012452W WO 2004100218 B1 WO2004100218 B1 WO 2004100218B1
Authority
WO
WIPO (PCT)
Prior art keywords
attachment
terminal
face
suspension element
interconnect
Prior art date
Application number
PCT/US2004/012452
Other languages
French (fr)
Other versions
WO2004100218A3 (en
WO2004100218A2 (en
Inventor
January Kister
David Beatson
Edward Laurent
Original Assignee
K & S Interconnect Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K & S Interconnect Inc filed Critical K & S Interconnect Inc
Publication of WO2004100218A2 publication Critical patent/WO2004100218A2/en
Publication of WO2004100218A3 publication Critical patent/WO2004100218A3/en
Publication of WO2004100218B1 publication Critical patent/WO2004100218B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Abstract

A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and seperate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachement each interconnect structure is combined with and/or held in a carrier structure fromm which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal. The interconnect assembly is preferably part of a probe apparatus.

Claims

[Received by the International Bureau on 09 May 2005 (09.05.05): original claims 1, 6, 12, 28, 32 and 38 are amended, original claims 2-5, 7-11, 13-18, 29- 31, 33-37 and 39-44 are unchanged, new claims 48 and 49 are added. ]
What is claimed is: 1. An interconnect assembly for providing electrical interconnection for testing of semiconductor devices, said interconnect assembly comprising: a. a larger structure having at least one electrically conductive attachment terminal; and b. an interconnect structure metallurgically bonded to said attachment terminal, said interconnect structure having: I. an attachment base having: 1. an attachment face for said metallurgical bonding to said attachment terminal; and 2. an access face substantially opposing said attachment face for accessing said attachment base with an attachment tool; II. a suspension element protruding from said attachment base adjacent said attachment face and adjacent said access face such that said attachment of said attachment face via the attachment tool is substantially unimpeded by said suspension element; and III. a contacting end positioned at a distal end of said suspension element, said contacting end being configured for establishing conductive contact with a contact terminal while said contacting end is forced against said contact terminal, said contacting end being shaped to scribe against the contact terminal during contact therebetween, said contact terminal being configured to be in electrical contact with a semiconductor device to be tested; wherein said contacting end is configured to be forced into contact with the contact terminal by a positioning movement of said larger structure relative to said contact terminal.
2. The assembly of claim 1 , wherein said interconnect structure is fabricated from sheet metal.
3. The assembly of claim 1 , wherein said larger structure comprises at least one conductive lead conductively connected to said at least one attachment terminal for corrimunicating an electric signal towards and or away from said interconnect structure.
4. The assembly of claim \, wherein said larger structure is a space transformer of a probe appararus. 34
5. The assembly of claim 1, wherein said larger structure is a printed circuit board transformer of a probe apparatus. ι
6. The assembly of claim 1 , wherein said suspension element is configured such that an internal bending stress that occurs along a length of said suspension element as a result from a spring force applied to said suspension element is substantially equal along a length of said suspension element, the spring force being generated by Hie positioning movement of the larger structure relative to the contact terminal.
7. The assembly of claim 1, wherein said attachment base, said suspension element and said contacting end are shaped parallel with respect to a contour plane.
8. The assembly of claim 7, wherein said contour plane is substantially perpendicular to an assembly plane of said larger structure.
9. The assembly of claim 1, wherein said suspension element is backwards looped.
10. The assembly of claim 9, wherein said suspension element is backwards looped such that said contacting end and said attachment face are substantially centered with respect to a direction of said spring force.
11. The assembly of claim 1 , wherein a number of said interconnect structures are assembled and oriented in separate orientations on said larger structure such that said contacting ends are in a minimal distance to each other.
12. The assembly of claim 1 , wherein said contacting end is configured to remove at least a portion of a layer from the contact teπninal when said contacting end scribes against the contact terminal, and wherein a deformation characteristic of said suspension element results in said contacting end scribing against the contact terminal in response to said positioning movement
13. The assembly of claim 1 , wherein between said attachment face and a teπninal face of said attachment terminal an attachment interface is defined in combination with a welding operation.
14. The assembly of claim 13, wherein said welding operation is a laser welding operation.
35
15. The assembly of claim 13, wherein said welding operation is a friction welding operation.
16. The assembly of claim 1 , wherein between said attachment face and a terminal face of said attachment terminal an attachment interface is defined in combination with a friction welding operation,
17. The assembly of claim 1 , wherein between said attachment face and a teπninal face of said attachment terminal an attachment interface is defined in combination with a soldering operation.
18. The assembly of claim 1 , wherein between said attachment face and a terminal face of said attachment terminal an attachment interface is defined in combination with a bracing operation,
19. A sheet metal structure for fabricating an interconnect assembly including a metallurgical bonding in an attachment interface,, said sheet metal structure comprising: a. a carrier structure; b. at least one interconnect structure connected to said carrier structure j a cutoff bridge, said interconnect structure having: I. an attachment base having: 1. an attachment face for said metallurgical bonding; 2. an access face substantially opposing said attachment face for accessing said base with an attachment tool; II. a suspension element protruding from said attachment base adjacent said attachment face and adjacent said access face such that said attachment of said attachment face and said accessing of said access face are substantially unimpeded by said suspension element; III. a contacting end positioned at a distal end of said suspension element, said being configured for establishing an operational conductive contact with a contact terminal; and wherein said carrier structure is spatially separated from said at least one interconnect structure such that said access face is accessible for said attachment tool and such that said cutoff bridge is accessible for a cutoff tool,
20. The structure of claim 19 being fabricated from sheet metal.
36 AMENDED SHEET ARTICLE 9
21. The structure of claim 19, wherein said suspension element is configured such that an internal bending stress resulting from said spring force is substantially equal along a length of said suspension element
22. The structure of claim 19, wherein said attachment base, said suspension element and said contacting end are shaped parallel with respect to a contour plane.
23. The structure of claim 19. wherein said suspension element is backwards looped.
24. The structure of claim 19, wherein a number of said interconnect structures are assembled and oriented in separate orientations on said carrier structure.
25. The structure of claim 19, wherein said carrier structure comprises positioning features for positioning said carrier structuxe.
26. The structure of claim 19, wherein said carrier structure is substantially finite,
27. The structure of claim 19, wherein said carrier structure is substantially infinite.
28. A probe apparatus for providing electrical interconnection for testing of semiconductor devices, said interconnect assembly comprising: a. a larger structure having at least one electrically conductive attachment terminal and a conductive lead conductively connected to said at least one attachment terminal for communicating an electric signal towards and/or away from said attachment teπninal; b. an interconnect structure metallurgically bonded to said attachment terminal, said interconnect structure having: I. an attachment base having: 1. an attachment face for said metallurgical bonding to said attachment terminal; 2. an access face substantially opposing said attachment face for accessing said attachment base with an attachment tool; II. a suspension element protruding from said attachment base adjacent said attachment face and adjacent said access face such that said attachment of said attachment face via the attachment tool is substantially unimpeded by said suspension element;
37 AMENDED SHEET ARTICLE 19 III. a contacting end positioned at a distal end of said suspension element, said contacting end being configured for establishing conductive contact with a contact terminal while said contacting end is forced against said contact terminal, said contacting end being shaped to scribe against the contact teπninal during contact therebetween, said contact terminal being configured to be in electrical contact with a semiconductor device to be tested; wherein said 'contacting end is configured to be forced into contact with the contact terminal by a positioning movement of said probe apparatus relative to said contact terminal.
29. The probe apparatus of claim 28, wherein said interconnect structure is fabricated from sheet metal.
30. The probe apparatus of claim 28, wherein said larger structure is a space transformer.
31. The probe apparatus of claim 28, wherein said larger structure is a printed circuit board transformer.
32. The probe apparatus of claim 28, wherein said suspension element is configured such that an internal bending stress that occurs along a length of said suspension element as a result from a spring force applied to said suspension element is substantially equal along a length of said suspension element, the spring force being generated by the positioning movement of the larger structure relative to the contact terminal.
33. The probe apparatus of claim 28, wherein said attachment base, said suspension element and said contacting end are shaped parallel with respect to a contour plane.
34. The probe apparatus of claim 33, wherein said contour planes is substantially perpendicular to an assembly plane of said larger structure.
35- The probe apparatus of claim 28, wherein said suspension element is backwards looped.
36. The probe apparatus of claim 35, wherein said suspension element is backwards looped such that said contacting end and said attachment face are substantially centered with respect to a direction of said spring force.
38 AMENDED SHEET (ARTICLE .19;
37. The probe apparatus of claim 28, wherein a number of said interconnect structures are assembled and oriented in separate orientations on said larger structure such that said contacting ends are in a minimal distance to each other.
38. The probe apparatus of claim 28, wherein said contacting end is configured to remove at least a portion of a layer from the contact teπninal when said contacting end scribes against the contact terminal, and wherein a deformation characteristic of said suspension element results in said contacting end scribing against the contact terminal in response to said positioning movement.
39. The probe apparatus of claim 28, wherein between said attachment face and a teπninal face of said attachment teπninal an attachment interface is defined in combination with a welding operation.
40. The probe apparatus of claim 39, wherein said welding operation is a laser welding operation.
41. The probe apparatus of claim 39, wherein said welding operation is a friction welding operation.
42. The probe apparatus of claim 28, wherein between said attachment face and a terminal face of said attachment terminal an attachment interface is defined in combination with a friction welding operation.
43. The probe apparatus of claim 28, wherein between said attachment face and a terminal face of said attachment terminal an attachment interface is defined in combination with a soldering operation.
44. The probe apparatus of claim 28, wherein between said attachment face and a terminal face of said attachment terminal an attachment interface is defined in combination with a bracing operation.
45. A method for fabricating a probe apparatus mcluding the steps of: a. fabricating a larger structure with an attachment terminal and a conductive lead conductively connected to said attachment terminal for communicating an electrical signal towards and/or away from said attachment terminal;
39 AMENDED SHEET (ARTICLE 19 b. fabricating an interconnect structure within a carrier structure independently from said fabricating of said larger structure; c. positioning said carrier structure relative to said larger structure such that an attachment face of said interconnect structure is in attachment proximity to said attachment terminal; d. attaching said interconnect structure to said attachment terminal by excerpting a bonding energy onto an access face of said interconnect structure such that a metallurgical bonding is established between said attachment teπninal and said attachment face; and e. separating said interconnect structure from said carrier structure.
46. The method of claim 45, wherein a number of said attachment teπninal are arrayed on said larger structure with a first spacing, wherein said interconnect structures are arrayed within said carrier structure with a second spacing, and wherein said second spacing corresponds substantially to said first spacing such that each of a number of said attachment face are in attachment proximity to one of said number of said attachment terminals.
47. The method of claim 46, wherein said attaching is simultaneously perfoπned at a number of said interconnect structure.
48. The interconnect assembly of claim 1 additionally comprising a plurality of said interconnect structures, each of said interconnect structures being metallurgically bonded to a respective one of said attachment terminal, wherein at least one of said interconnect structures is metallurgically bonded to a respective one of said attachment terminal such that a portion of said at least one interconnect structure extends above a portion of another of said interconnect structures.
49. The probe apparatus of claim 28 additionally comprising a plurality of said interconnect structures, each of said interconnect structures being metallurgically bonded to a respective one of said attachment terminal, wherein at least one of said interconnect structures is metallurgically bonded to a respective one of said attachment terminal such that a portion of said at least one interconnect structure extends above a portion of another of said interconnect structures.
40
PCT/US2004/012452 2003-05-01 2004-04-23 Prefabricated and attached interconnect structure WO2004100218A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/429,275 2003-05-01
US10/429,275 US6965245B2 (en) 2003-05-01 2003-05-01 Prefabricated and attached interconnect structure

Publications (3)

Publication Number Publication Date
WO2004100218A2 WO2004100218A2 (en) 2004-11-18
WO2004100218A3 WO2004100218A3 (en) 2005-06-02
WO2004100218B1 true WO2004100218B1 (en) 2005-07-21

Family

ID=33310573

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/012452 WO2004100218A2 (en) 2003-05-01 2004-04-23 Prefabricated and attached interconnect structure

Country Status (4)

Country Link
US (2) US6965245B2 (en)
CN (1) CN1816948A (en)
TW (1) TW200508624A (en)
WO (1) WO2004100218A2 (en)

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Also Published As

Publication number Publication date
US20050052194A1 (en) 2005-03-10
WO2004100218A3 (en) 2005-06-02
WO2004100218A2 (en) 2004-11-18
US7173441B2 (en) 2007-02-06
CN1816948A (en) 2006-08-09
US20040217768A1 (en) 2004-11-04
TW200508624A (en) 2005-03-01
US6965245B2 (en) 2005-11-15

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