WO2004107461B1 - Light emitting diode package and light emitting diode system having at least two heat sinks - Google Patents

Light emitting diode package and light emitting diode system having at least two heat sinks

Info

Publication number
WO2004107461B1
WO2004107461B1 PCT/KR2004/001153 KR2004001153W WO2004107461B1 WO 2004107461 B1 WO2004107461 B1 WO 2004107461B1 KR 2004001153 W KR2004001153 W KR 2004001153W WO 2004107461 B1 WO2004107461 B1 WO 2004107461B1
Authority
WO
WIPO (PCT)
Prior art keywords
emitting diode
light emitting
package
heat sinks
wavelength
Prior art date
Application number
PCT/KR2004/001153
Other languages
French (fr)
Other versions
WO2004107461A1 (en
Inventor
Kwan Young Han
Kwang Il Park
Jae Ho Cho
Jung Hoo Seo
Seong Ryeol Ryu
Original Assignee
Seoul Semiconductor Co Ltd
Kwan Young Han
Kwang Il Park
Jae Ho Cho
Jung Hoo Seo
Seong Ryeol Ryu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR20030033989A external-priority patent/KR100455089B1/en
Priority claimed from KR20030067949A external-priority patent/KR100524656B1/en
Application filed by Seoul Semiconductor Co Ltd, Kwan Young Han, Kwang Il Park, Jae Ho Cho, Jung Hoo Seo, Seong Ryeol Ryu filed Critical Seoul Semiconductor Co Ltd
Priority to JP2006532044A priority Critical patent/JP4966656B2/en
Priority to US10/557,820 priority patent/US7994526B2/en
Priority to DE112004000864.6T priority patent/DE112004000864B4/en
Publication of WO2004107461A1 publication Critical patent/WO2004107461A1/en
Publication of WO2004107461B1 publication Critical patent/WO2004107461B1/en
Priority to US13/170,837 priority patent/US8823036B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Abstract

There is provided a light emitting diode package having at least two heat sinks. The light emitting diode package includes a main body, at least two lead terminals fixed to the main body, and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being fixed to the main body. The at least two heat sinks are separated from each other. Thus, high luminous power can be obtained mounting a plurality of light emitting diode dies in one LED package. Further, it is possible to embody polychromatic lights mounting LED dies emitting different wavelengths of light each other in the LED package.

Claims

AMENDED CLAIMS [received by the International Bureau on 02 November 2004 (02.11.04); original claims 1-14, replaced by amended claims 1-14]
Claims 1. A high power light emitting diode package comprising: a main body; at least two lead terminals fixed to the main body; and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being separated from each other and fixed to the main body.
2. The package of claim 1, wherein each of the at least two heat sinks has a reflective surface extended from an upper surface thereof.
3. The package of claim 1, wherein the at least two heat sinks are a pair.
4. The package of claim 3, further comprising: at least one light emitting diode die mounted on upper surfaces of the at least two heat sinks, the die being directly and electrically connected to the heat sinks through a surface of the die.
5. The package of claim 4, further comprising: bonding wires electrically connecting the at least two lead terminals, the at least two heat sinks and the at least one light emitting diode die.
6. The package of claim 4, further comprising: a lens attached to the main body, the lens enclosing the at least one light emitting diode die.
7. The package of claim 6, wherein the lens includes an optically transparent material which is directly contacted with the at least one light emitting diode die.
8. The package of claim 4, further comprising: a fluorescent material converting the wavelength of light emitted from the at least one light emitting diode die. 17
9. The package of claim 1, further comprising: light emitting diode dies mounted on the respective heat sinks, the light emitting diode dies emitting different wavelengths of light.
10. The package of claim 9, wherein the at least two lead terminals include: lead terminals electrically connected to the at least two heat sinks respectively; and a common lead terminal electrically connected to all of the at least two heat sinks.
11. The package of claim 10, further comprising: an additional heat sink; and a zener diode mounted on the additional heat sink.
12. The package of claim 9, wherein the light emitting diode dies include light emitting diode dies emitting a first wavelength of light, a second wavelength of light and a third wavelength of light, respectively.
13. The package of claim 12, wherein the first wavelength, the second wavelength and the third wavelength are red wavelength, green wavelength and blue wavelength, respectively.
14. A light emitting diode system comprising: the light emitting diode package according to claim 10 or claim 11 ; and a controller for controlling the electric power supplied to the light emitting diode package, wherein the controller controls the amount of the current supplied to the respective heat sinks.
PCT/KR2004/001153 2003-05-28 2004-05-14 Light emitting diode package and light emitting diode system having at least two heat sinks WO2004107461A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006532044A JP4966656B2 (en) 2003-05-28 2004-05-14 Light emitting diode package with multiple heat sinks
US10/557,820 US7994526B2 (en) 2003-05-28 2004-05-14 Light emitting diode package and light emitting diode system having at least two heat sinks
DE112004000864.6T DE112004000864B4 (en) 2003-05-28 2004-05-14 Light - emitting diode assembly and light emitting diode system with at least two heat sinks
US13/170,837 US8823036B2 (en) 2003-05-28 2011-06-28 Light emitting diode package and light emitting diode system having at least two heat sinks

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2003-0033989 2003-05-28
KR20030033989A KR100455089B1 (en) 2003-05-28 2003-05-28 Package for high-power semiconductor light emitting devices and semiconductor light emitting device using the same
KR10-2003-0067949 2003-09-30
KR20030067949A KR100524656B1 (en) 2003-09-30 2003-09-30 Polychromatic Light Emitting Diode Package and Polychromatic Light Emitting Diode System

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10/557,820 A-371-Of-International US7994526B2 (en) 2003-05-28 2004-05-14 Light emitting diode package and light emitting diode system having at least two heat sinks
US13/170,837 Continuation US8823036B2 (en) 2003-05-28 2011-06-28 Light emitting diode package and light emitting diode system having at least two heat sinks

Publications (2)

Publication Number Publication Date
WO2004107461A1 WO2004107461A1 (en) 2004-12-09
WO2004107461B1 true WO2004107461B1 (en) 2005-04-14

Family

ID=36120946

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2004/001153 WO2004107461A1 (en) 2003-05-28 2004-05-14 Light emitting diode package and light emitting diode system having at least two heat sinks

Country Status (5)

Country Link
US (2) US7994526B2 (en)
JP (1) JP4966656B2 (en)
DE (1) DE112004000864B4 (en)
TW (1) TWI331404B (en)
WO (1) WO2004107461A1 (en)

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Also Published As

Publication number Publication date
US20110254045A1 (en) 2011-10-20
WO2004107461A1 (en) 2004-12-09
DE112004000864T5 (en) 2006-04-20
US7994526B2 (en) 2011-08-09
US8823036B2 (en) 2014-09-02
US20070063321A1 (en) 2007-03-22
TW200501460A (en) 2005-01-01
JP4966656B2 (en) 2012-07-04
DE112004000864B4 (en) 2014-12-31
JP2006529058A (en) 2006-12-28
TWI331404B (en) 2010-10-01

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