WO2004108825A1 - 変性エポキシ樹脂の製造方法 - Google Patents
変性エポキシ樹脂の製造方法 Download PDFInfo
- Publication number
- WO2004108825A1 WO2004108825A1 PCT/JP2004/007679 JP2004007679W WO2004108825A1 WO 2004108825 A1 WO2004108825 A1 WO 2004108825A1 JP 2004007679 W JP2004007679 W JP 2004007679W WO 2004108825 A1 WO2004108825 A1 WO 2004108825A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- rubber
- epoxy resin
- polymer particles
- water
- organic medium
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L21/00—Compositions of unspecified rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/24—Thermosetting resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/53—Core-shell polymer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL04735123T PL1632533T3 (pl) | 2003-06-09 | 2004-05-27 | Sposób wytwarzania modyfikowanej żywicy epoksydowej |
EP04735123.4A EP1632533B1 (en) | 2003-06-09 | 2004-05-27 | Process for producing modified epoxy resin |
ES04735123T ES2412804T3 (es) | 2003-06-09 | 2004-05-27 | Procedimiento para producir resina epoxi modificada |
CA2526461A CA2526461C (en) | 2003-06-09 | 2004-05-27 | Process for producing modified epoxy resin |
US10/558,759 US8222324B2 (en) | 2003-06-09 | 2004-05-27 | Process for producing modified epoxy resin |
JP2005506770A JP4668788B2 (ja) | 2003-06-09 | 2004-05-27 | 変性エポキシ樹脂の製造方法 |
US13/372,231 US8680180B2 (en) | 2003-06-09 | 2012-02-13 | Process for producing modified epoxy resin |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-164416 | 2003-06-09 | ||
JP2003164416 | 2003-06-09 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10558759 A-371-Of-International | 2004-05-27 | ||
US13/372,231 Division US8680180B2 (en) | 2003-06-09 | 2012-02-13 | Process for producing modified epoxy resin |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004108825A1 true WO2004108825A1 (ja) | 2004-12-16 |
Family
ID=33508814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/007679 WO2004108825A1 (ja) | 2003-06-09 | 2004-05-27 | 変性エポキシ樹脂の製造方法 |
Country Status (11)
Country | Link |
---|---|
US (2) | US8222324B2 (ja) |
EP (3) | EP2481773A3 (ja) |
JP (1) | JP4668788B2 (ja) |
KR (1) | KR100780582B1 (ja) |
CN (1) | CN100447196C (ja) |
CA (2) | CA2789741C (ja) |
ES (1) | ES2412804T3 (ja) |
MY (1) | MY137365A (ja) |
PL (1) | PL1632533T3 (ja) |
TW (1) | TWI359843B (ja) |
WO (1) | WO2004108825A1 (ja) |
Cited By (32)
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EP1780239A1 (en) * | 2004-08-18 | 2007-05-02 | Kaneka Corporation | Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material |
WO2008060545A1 (en) | 2006-11-13 | 2008-05-22 | Henkel Corporation | Benzoxazine compositions with core shell rubbers |
WO2008105189A1 (ja) * | 2007-02-28 | 2008-09-04 | Kaneka Corporation | ゴム状重合体粒子分散熱硬化性樹脂組成物、及びその製造方法 |
WO2009014037A1 (ja) * | 2007-07-25 | 2009-01-29 | Kaneka Corporation | 樹脂組成物、および該樹脂組成物を用いた重縮合体 |
WO2009034966A1 (ja) | 2007-09-11 | 2009-03-19 | Kaneka Corporation | 液状樹脂組成物、および該液状樹脂組成物を用いた硬化物 |
US7537827B1 (en) | 2006-12-13 | 2009-05-26 | Henkel Corporation | Prepreg laminates |
EP2135909A1 (en) | 2008-06-12 | 2009-12-23 | Henkel Corporation | Next generation, highly toughened two part structural epoxy adhesive compositions |
US7649060B2 (en) | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
JP2010270328A (ja) * | 2009-04-24 | 2010-12-02 | Mitsubishi Rayon Co Ltd | 重合体粒子含有分散体及び重合体粒子含有樹脂組成物の製造方法 |
US7847034B2 (en) | 2008-03-20 | 2010-12-07 | Loctite (R&D) Limited | Adducts and curable compositions using same |
JP2011026503A (ja) * | 2009-07-28 | 2011-02-10 | Kaneka Corp | ポリマー微粒子含有液状樹脂組成物、及びその製造方法 |
JP2011181525A (ja) * | 2011-06-09 | 2011-09-15 | Sony Chemical & Information Device Corp | 異方性導電材料 |
US8029889B1 (en) | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
WO2012035112A1 (en) | 2010-09-15 | 2012-03-22 | Loctite (R&D) Limited | Two-part, cyanoacrylate/cationically curable adhesive systems |
US8716377B2 (en) | 2008-05-09 | 2014-05-06 | Henkel Ag & Co. Kgaa | Polymerizable composition |
WO2014140804A2 (en) | 2013-03-15 | 2014-09-18 | Henkel IP & Holding GmbH | Two-part, cyanoacrylate/cationically curable adhesive systems |
US8932718B2 (en) * | 2006-07-07 | 2015-01-13 | Valspar Sourcing, Inc. | Coating systems for cement composite articles |
US9133064B2 (en) | 2008-11-24 | 2015-09-15 | Valspar Sourcing, Inc. | Coating system for cement composite articles |
JP2015534591A (ja) * | 2012-09-07 | 2015-12-03 | ダウ グローバル テクノロジーズ エルエルシー | 強化マスターブレンド |
JP2016199673A (ja) * | 2015-04-09 | 2016-12-01 | 株式会社カネカ | 接着性の改善されたポリマー微粒子含有硬化性樹脂組成物 |
JP2018500440A (ja) * | 2014-12-24 | 2018-01-11 | アルケマ フランス | 多段ポリマー組成物、その調製方法、その使用及びそれを含む組成物 |
WO2019189621A1 (ja) * | 2018-03-30 | 2019-10-03 | 株式会社カネカ | 熱硬化性マトリクス樹脂に対する分散性が改善された粉粒体 |
WO2019203273A1 (ja) * | 2018-04-20 | 2019-10-24 | 株式会社カネカ | コアシェルポリマー粒子含有溶剤組成物の製造方法 |
WO2020035442A1 (en) | 2018-08-13 | 2020-02-20 | Henkel Ag & Co. Kgaa | A two-part cyanoacrylate curable adhesive system |
WO2020035440A1 (en) | 2018-08-13 | 2020-02-20 | Henkel IP & Holding GmbH | A two-part cyanoacrylate curable adhesive system |
WO2020138263A1 (ja) * | 2018-12-27 | 2020-07-02 | 株式会社カネカ | 樹脂組成物およびその利用 |
WO2020178082A1 (en) | 2019-03-04 | 2020-09-10 | Henkel IP & Holding GmbH | Two-part, cyanoacrylate/cationically curable adhesive systems |
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JP2020164561A (ja) * | 2019-03-28 | 2020-10-08 | 株式会社カネカ | 粉粒体の製造方法および粉粒体 |
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CA2526461C (en) | 2013-03-19 |
US8680180B2 (en) | 2014-03-25 |
PL1632533T3 (pl) | 2013-08-30 |
US20070027233A1 (en) | 2007-02-01 |
TW200502309A (en) | 2005-01-16 |
CA2789741A1 (en) | 2004-12-16 |
EP2481773A3 (en) | 2012-09-05 |
TWI359843B (en) | 2012-03-11 |
JP4668788B2 (ja) | 2011-04-13 |
CN1798805A (zh) | 2006-07-05 |
KR20060036912A (ko) | 2006-05-02 |
EP2258773A1 (en) | 2010-12-08 |
EP1632533A4 (en) | 2008-06-25 |
EP2481773A2 (en) | 2012-08-01 |
KR100780582B1 (ko) | 2007-11-29 |
EP1632533A1 (en) | 2006-03-08 |
ES2412804T3 (es) | 2013-07-12 |
MY137365A (en) | 2009-01-30 |
JPWO2004108825A1 (ja) | 2006-08-03 |
US8222324B2 (en) | 2012-07-17 |
US20120142820A1 (en) | 2012-06-07 |
EP1632533B1 (en) | 2013-04-10 |
CA2526461A1 (en) | 2004-12-16 |
CN100447196C (zh) | 2008-12-31 |
CA2789741C (en) | 2014-11-04 |
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