WO2005005996A3 - Apparatus and method for electromechanical testing and validation of probe cards - Google Patents

Apparatus and method for electromechanical testing and validation of probe cards Download PDF

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Publication number
WO2005005996A3
WO2005005996A3 PCT/US2004/021175 US2004021175W WO2005005996A3 WO 2005005996 A3 WO2005005996 A3 WO 2005005996A3 US 2004021175 W US2004021175 W US 2004021175W WO 2005005996 A3 WO2005005996 A3 WO 2005005996A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe card
validation
probe cards
electromechanical testing
verification wafer
Prior art date
Application number
PCT/US2004/021175
Other languages
French (fr)
Other versions
WO2005005996A2 (en
Inventor
Charles A Miller
Emad B Hreish
Original Assignee
Formfactor Inc
Charles A Miller
Emad B Hreish
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc, Charles A Miller, Emad B Hreish filed Critical Formfactor Inc
Priority to JP2006517822A priority Critical patent/JP2007524837A/en
Priority to EP04756506A priority patent/EP1642145B1/en
Priority to DE602004017003T priority patent/DE602004017003D1/en
Publication of WO2005005996A2 publication Critical patent/WO2005005996A2/en
Publication of WO2005005996A3 publication Critical patent/WO2005005996A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/08—Locating faults in cables, transmission lines, or networks
    • G01R31/11—Locating faults in cables, transmission lines, or networks using pulse reflection methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Abstract

A method of testing a probe card (156) includes the step of positioning the probe card (156) in a prober (152) over a verification wafer (501) that is placed on a stage (159). The probe card (156) is brought in contact with a contact region (503) on the verification wafer (501). The verification wafer (501) includes a shorting plane (502) surrounding the contact region (503). A test signal is sent through the verification wafer (501) to the probe card (156). A response signal from the probe card (156) is received and analyzed.
PCT/US2004/021175 2003-07-01 2004-06-30 Apparatus and method for electromechanical testing and validation of probe cards WO2005005996A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006517822A JP2007524837A (en) 2003-07-01 2004-06-30 Apparatus and method for electromechanical testing and verification of probe cards
EP04756506A EP1642145B1 (en) 2003-07-01 2004-06-30 Apparatus and method for electromechanical testing and validation of probe cards
DE602004017003T DE602004017003D1 (en) 2003-07-01 2004-06-30 DEVICE AND METHOD FOR ELECTROMECHANICAL TESTING AND VALIDATION OF TEST CARDS

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/612,235 2003-07-01
US10/612,235 US6911814B2 (en) 2003-07-01 2003-07-01 Apparatus and method for electromechanical testing and validation of probe cards

Publications (2)

Publication Number Publication Date
WO2005005996A2 WO2005005996A2 (en) 2005-01-20
WO2005005996A3 true WO2005005996A3 (en) 2005-02-24

Family

ID=34062353

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/021175 WO2005005996A2 (en) 2003-07-01 2004-06-30 Apparatus and method for electromechanical testing and validation of probe cards

Country Status (8)

Country Link
US (1) US6911814B2 (en)
EP (1) EP1642145B1 (en)
JP (1) JP2007524837A (en)
KR (2) KR100915436B1 (en)
CN (1) CN100483142C (en)
DE (1) DE602004017003D1 (en)
TW (1) TWI332577B (en)
WO (1) WO2005005996A2 (en)

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US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7525302B2 (en) * 2005-01-31 2009-04-28 Formfactor, Inc. Method of estimating channel bandwidth from a time domain reflectometer (TDR) measurement using rise time and maximum slope
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US20100018286A1 (en) * 2006-10-10 2010-01-28 Masaya Numajiri Calibration apparatus, contact judging method and semiconductor testing apparatus
US20080100323A1 (en) * 2006-10-25 2008-05-01 Silicon Test Systems, Inc. Low cost, high pin count, wafer sort automated test equipment (ate) device under test (dut) interface for testing electronic devices in high parallelism
US7956628B2 (en) * 2006-11-03 2011-06-07 International Business Machines Corporation Chip-based prober for high frequency measurements and methods of measuring
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
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WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8564308B2 (en) * 2009-09-30 2013-10-22 Tektronix, Inc. Signal acquisition system having reduced probe loading of a device under test
JP5579547B2 (en) * 2010-09-07 2014-08-27 株式会社ヨコオ Inspection jig for connector connection
CN102062847B (en) * 2010-11-08 2016-04-27 上海集成电路研发中心有限公司 The detection method of semiconductor parameter measuring system
CN102156271B (en) * 2011-03-15 2015-11-04 上海华虹宏力半导体制造有限公司 The detection method of semiconductor parameter measuring system
KR20130000213A (en) 2011-06-22 2013-01-02 삼성전자주식회사 Semiconductor device and method of testing the same
US8525168B2 (en) * 2011-07-11 2013-09-03 International Business Machines Corporation Integrated circuit (IC) test probe
US8952711B2 (en) * 2011-10-20 2015-02-10 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for probing semiconductor wafers
US20140084956A1 (en) * 2012-09-21 2014-03-27 Dennis Glenn L. Surell Probe head test fixture and method of using the same
KR102066155B1 (en) * 2013-03-08 2020-01-14 삼성전자주식회사 Probing method, probe card for performing the method, and probing apparatus including the probe card
CN103197245B (en) * 2013-03-29 2015-07-15 苏州汇川技术有限公司 Detecting device and detecting technology for servo motor stator
WO2015001417A1 (en) * 2013-07-03 2015-01-08 Stichting Continuïteit Beijert Engineering Apparatus and method for inspecting pins on a probe card
CN104280651B (en) * 2013-07-10 2018-08-17 晶豪科技股份有限公司 Test system and semiconductor element
CN104297609B (en) * 2013-07-19 2017-05-24 瑞昱半导体股份有限公司 Detection circuit and method for determining connecting state of first and second pins
US10451652B2 (en) * 2014-07-16 2019-10-22 Teradyne, Inc. Coaxial structure for transmission of signals in test equipment
CN104101855A (en) * 2014-07-24 2014-10-15 上海华力微电子有限公司 Probe card electric leakage monitoring method and probe card electric leakage monitoring system
KR101650729B1 (en) * 2014-10-15 2016-08-24 주식회사 에스에이치엘 A test head for testing a probe card
KR101665332B1 (en) * 2014-10-24 2016-10-12 주식회사 에스에이치엘 A test head for testing a probe card
US9952254B1 (en) 2014-11-13 2018-04-24 National Technology & Engineering Solutions Of Sandia, Llc Grips for testing of electrical characteristics of a specimen under a mechanical load
US9577770B2 (en) * 2015-05-08 2017-02-21 APS Soutions GmbH Method for analyzing the RF performance of a probe card, detector assembly and system for analyzing the RF performance of a probe card
US10768206B2 (en) * 2015-06-24 2020-09-08 Integrated Technology Corporation Loop-back probe test and verification method
TWI661206B (en) * 2018-01-19 2019-06-01 新加坡商美亞國際電子有限公司 Printed circuit board for electrical testing
US10816631B2 (en) * 2018-03-29 2020-10-27 Rohde & Schwarz Gmbh & Co. Kg Probe correction system and method
CN108872917A (en) * 2018-06-28 2018-11-23 北京铂阳顶荣光伏科技有限公司 A kind of test device for probe contact class testing equipment
CN110634840B (en) * 2019-09-24 2021-08-20 京东方科技集团股份有限公司 Detection substrate, preparation method thereof, detection device and detection method
TWI732326B (en) * 2019-10-29 2021-07-01 華邦電子股份有限公司 Short-circuit probe card, wafer test system, and fault detection method for the wafer test system
TWI741856B (en) * 2020-10-27 2021-10-01 鴻勁精密股份有限公司 Operating assembly and operating apparatus using the same
KR20230165258A (en) * 2021-03-23 2023-12-05 닐슨 싸이언티픽, 엘엘씨 cryogenic probe card

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Also Published As

Publication number Publication date
KR100919882B1 (en) 2009-09-30
DE602004017003D1 (en) 2008-11-20
WO2005005996A2 (en) 2005-01-20
JP2007524837A (en) 2007-08-30
EP1642145A4 (en) 2006-08-09
EP1642145A2 (en) 2006-04-05
US20050017708A1 (en) 2005-01-27
KR20090045418A (en) 2009-05-07
TWI332577B (en) 2010-11-01
KR100915436B1 (en) 2009-09-03
KR20060084362A (en) 2006-07-24
US6911814B2 (en) 2005-06-28
TW200516256A (en) 2005-05-16
CN1816751A (en) 2006-08-09
EP1642145B1 (en) 2008-10-08
CN100483142C (en) 2009-04-29

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